Patents by Inventor Chiung-Yuan Chang

Chiung-Yuan Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and manufacturing method thereof
    Patent number: 11934916
    Abstract: An electronic device includes a pair of depletion gates, an accumulation gate, and a conductive resonator. The depletion gates are spaced apart from each other. The accumulation gate is over the depletion gates. The conductive resonator is over the depletion gates and the accumulation gate. The conductive resonator includes a first portion, a second portion, and a third portion. The first portion and the second portion are on opposite sides of the accumulation gate. The third portion interconnects the first and second portions of the conductive resonator and across the depletion gates. A bottom surface of the first portion of the conductive resonator is lower than a bottom surface of the accumulation gate.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: March 19, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Jiun-Yun Li, Shih-Yuan Chen, Yao-Chun Chang, Ian Huang, Chiung-Yu Chen
  • Method for fabricating microlens with lithographic process
    Patent number: 6861207
    Abstract: A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: March 1, 2005
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Jen Hsu, Chih-Kung Chang, Fu-Tien Weng, Te-Fu Tseng, Chin-Chen Kuo, Chiung-Yuan Chang
  • METHOD FOR FABRICATING MICROLENS WITH LITHOGRAPHIC PROCESS
    Publication number: 20040265752
    Abstract: A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Hung-Jen Hsu, Chih-Kung Chang, Fu-Tien Weng, Te-Fu Tseng, Chin-Chen Kuo, Chiung-Yuan Chang