Patents by Inventor Chiung-Yuan Chang

Chiung-Yuan Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6861207
    Abstract: A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: March 1, 2005
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Jen Hsu, Chih-Kung Chang, Fu-Tien Weng, Te-Fu Tseng, Chin-Chen Kuo, Chiung-Yuan Chang
  • Publication number: 20040265752
    Abstract: A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Hung-Jen Hsu, Chih-Kung Chang, Fu-Tien Weng, Te-Fu Tseng, Chin-Chen Kuo, Chiung-Yuan Chang