Patents by Inventor Cho H. Teh

Cho H. Teh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8502146
    Abstract: One embodiment relates to a method of classifying a defect on a substrate surface. The method includes scanning a primary electron beam over a target region of the substrate surface causing secondary electrons to be emitted therefrom, wherein the target region includes the defect. The secondary electrons are detected from the target region using a plurality of at least two off-axis sensors so as to generate a plurality of image frames of the target region, each image frame of the target region including data from a different off-axis sensor. The plurality of image data frames are processed to generate a surface height map of the target region, and surface height attributes are determined for the defect. The surface height attributes for the defect are input into a defect classifier. Other embodiments, aspects and features are also disclosed.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: August 6, 2013
    Assignee: KLA-Tencor Corporation
    Inventors: Chien-Huei Chen, Hedong Yang, Cho H. Teh
  • Publication number: 20130082174
    Abstract: One embodiment relates to a method of classifying a defect on a substrate surface. The method includes scanning a primary electron beam over a target region of the substrate surface causing secondary electrons to be emitted therefrom, wherein the target region includes the defect. The secondary electrons are detected from the target region using a plurality of at least two off-axis sensors so as to generate a plurality of image frames of the target region, each image frame of the target region including data from a different off-axis sensor. The plurality of image data frames are processed to generate a surface height map of the target region, and surface height attributes are determined for the defect. The surface height attributes for the defect are input into a defect classifier. Other embodiments, aspects and features are also disclosed.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 4, 2013
    Inventors: Chien-Huei CHEN, Hedong YANG, Cho H. TEH
  • Patent number: 8289510
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: October 16, 2012
    Assignee: KLA-Tencor Corporation
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Publication number: 20110137576
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Application
    Filed: February 10, 2011
    Publication date: June 9, 2011
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Publication number: 20100067781
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Application
    Filed: November 25, 2009
    Publication date: March 18, 2010
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Patent number: 7646476
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: January 12, 2010
    Assignee: KLA-Tencor Corporation
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Publication number: 20080204739
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Application
    Filed: May 9, 2008
    Publication date: August 28, 2008
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong
  • Patent number: 7394534
    Abstract: A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: July 1, 2008
    Assignee: KLA-Tencor Corporation
    Inventors: Patrick Y. Huet, Robinson Piramuthu, Martin Plihal, Christopher W. Lee, Cho H. Teh, Yan Xiong