Patents by Inventor Chong Mei
Chong Mei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230391709Abstract: The present disclosure relates to a method for preparing an esterified alkane. The method includes mixing a gaseous alkane with oxygen or air to obtain a mixed gas; adding a chlorine-containing catalyst and/or a nitrogen-containing catalyst to a light-transmission reaction vessel; then adding the mixed gas, an acid and a solvent in sequence to carry out a reaction under ambient pressure and an illumination condition; and then conducting analysis to obtain an NMR yield, followed by extraction, drying, filtration, distillation under reduced pressure and separation by column chromatography to obtain an esterified alkane. The present disclosure has the advantages that the reaction can be carried out under the conditions of ambient temperature and pressure with a cheap and safe chlorine-containing compound and a nitrogen-containing compound as a catalyst and air as an oxidant, and the method has energy-saving and economic effects, convenient and safe operation and environmental friendliness.Type: ApplicationFiled: August 17, 2023Publication date: December 7, 2023Applicant: Shanghai Jiao Tong UniversityInventors: Wenjun LU, Lai XU, Chong MEI, Mengdi ZHAO
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Publication number: 20230383309Abstract: The present invention relates to materials and methods for creating and maintaining a cereal plant line for the production of a hybrid cereal plant, that include for example, and not limitation, using the BLue Aleurone (BLA) system.Type: ApplicationFiled: May 19, 2023Publication date: November 30, 2023Applicants: KWS SAAT SE & Co., KGaA, The University of Sydney, Global Crop Innovations Pty. Ltd.Inventors: Norman DARVEY, Peng Zhang, Richard Trethowan, Chong Mei Dong, Jacob Lage, Nicholas Bird, Christopher Tapsell, Aaron Hummel
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Patent number: 11697822Abstract: The present invention relates to materials and methods for creating and maintaining a cereal plant line for the production of a hybrid cereal plant, that include for example, and not limitation, using the BLue Aleurone (BLA) system.Type: GrantFiled: August 29, 2018Date of Patent: July 11, 2023Assignees: KWS SAAT SE & Co. KGaA, THE UNIVERSIYY OF SYDNEY, GLOBAL CROP INNOVATIONS PTY. LTD.Inventors: Norman Darvey, Peng Zhang, Richard Trethowan, Chong Mei Dong, Jacob Lage, Nicholas Bird, Christopher Tapsell, Aaron Hummel
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Patent number: 11406008Abstract: A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.Type: GrantFiled: August 21, 2020Date of Patent: August 2, 2022Assignee: TTM Technologies Inc.Inventors: Omar Eldaiki, Chong Mei
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Patent number: 11362407Abstract: A directional coupler may include a first coupled section comprising a first and a second coupled transmission lines, the first coupled transmission line having a first end coupled to an input port. The directional coupler may also include a second coupled section comprising a first and a second coupled transmission lines. The directional coupler may also include a third coupled section comprising a first and a second coupled transmission lines. The first coupled transmission line of the third coupled section has a first end coupled to a second end of the second coupled transmission line of the second coupled section and a second end coupled to an output port. The directional coupler may further include a delay section. A total electrical length of the first coupled section, the second coupled section, the third coupled section, and the delay section is about 90 degrees.Type: GrantFiled: February 28, 2020Date of Patent: June 14, 2022Assignee: TTM Technologies Inc.Inventors: Chong Mei, Omar Eldaiki, Samir Tozin
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Patent number: 11254943Abstract: The present invention relates to the field of molecular biology and more particularly to promoters useful for metabolic engineering in yeast or fungi for the production of biobased chemicals with broad applications. Intron-containing promoters with strong activity during oil-accumulation stages are particularly useful for genetic engineering in yeast and fungi, particularly Rhodosporidium or Rhodotorula genera. Such promoter are capable of driving strong expression of RNA or proteins in species of the Rhodosporidium or Rhodotorula genera.Type: GrantFiled: February 2, 2017Date of Patent: February 22, 2022Assignee: Temasek Life Sciences Laboratory LimitedInventors: Lianghui Ji, Yanbin Liu, Chong Mei John Koh, Sihui Amy Yap
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Publication number: 20210273308Abstract: A directional coupler may include a first coupled section comprising a first and a second coupled transmission lines, the first coupled transmission line having a first end coupled to an input port. The directional coupler may also include a second coupled section comprising a first and a second coupled transmission lines. The directional coupler may also include a third coupled section comprising a first and a second coupled transmission lines. The first coupled transmission line of the third coupled section has a first end coupled to a second end of the second coupled transmission line of the second coupled section and a second end coupled to an output port. The directional coupler may further include a delay section. A total electrical length of the first coupled section, the second coupled section, the third coupled section, and the delay section is about 90 degrees.Type: ApplicationFiled: February 28, 2020Publication date: September 2, 2021Inventors: Chong Mei, Omar Eldaiki, Samir Tozin
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Publication number: 20210227695Abstract: A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.Type: ApplicationFiled: April 8, 2021Publication date: July 22, 2021Inventors: Michael LEN, Chong MEI, Michael LUGERT, Raj KUMAR
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Patent number: 11034981Abstract: The present invention relates to the field of fungal production fatty alcohols. More specifically, the present invention relates to genetically modified host cells, nucleic acid constructs and culture medium for the production of fatty alcohols in Rhodosporidium.Type: GrantFiled: January 29, 2018Date of Patent: June 15, 2021Assignee: TEMASEK LIFE SCIENCES LABORATORY LIMITEDInventors: Lianghui Ji, Yanbin Liu, Chong Mei John Koh, Sihui Amy Yap, Si Te Ngoh
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Publication number: 20210127482Abstract: A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.Type: ApplicationFiled: August 21, 2020Publication date: April 29, 2021Inventors: Omar Eldaiki, Chong Mei
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Patent number: 10980127Abstract: A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.Type: GrantFiled: June 7, 2019Date of Patent: April 13, 2021Assignee: TTM Technologies Inc.Inventors: Michael Len, Chong Mei, Michael Lugert, Raj Kumar
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Publication number: 20200377898Abstract: The present invention relates to the field of molecular biology and more particularly to promoters useful for metabolic engineering in yeast or fungi for the production of biobased chemicals with broad applications. Intron-containing promoters with strong activity during oil-accumulation stages are particularly useful for genetic engineering in yeast and fungi, particularly Rhodosporidium or Rhodotorula genera. Such promoter are capable of driving strong expression of RNA or proteins in species of the Rhodosporidium or Rhodotorula genera.Type: ApplicationFiled: February 2, 2017Publication date: December 3, 2020Applicant: TEMASEK LIFE SCIENCES LABORATORY LIMITEDInventors: Lianghui JI, Yanbin LIU, Chong Mei John KOH, Sihui Amy YAP
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Publication number: 20200288576Abstract: A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.Type: ApplicationFiled: June 7, 2019Publication date: September 10, 2020Inventors: Michael LEN, Chong MEI, Michael LUGERT, Raj KUMAR
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Patent number: 10772193Abstract: A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.Type: GrantFiled: December 6, 2019Date of Patent: September 8, 2020Assignee: TTM Technologies Inc.Inventors: Omar Eldaiki, Chong Mei
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Publication number: 20200255856Abstract: The present invention relates to materials and methods for creating and maintaining a cereal plant line for the production of a hybrid cereal plant, that include for example, and not limitation, using the BLue Aleurone (BLA) system.Type: ApplicationFiled: August 29, 2018Publication date: August 13, 2020Applicants: KWS SAAT SE & Co. KGaA, THE UNIVERSITY OF SYDNEY, GLOBAL CROP INNOVATIONS PTY. LTD.Inventors: Norman DARVEY, Peng ZHANG, Richard TRETHOWAN, Chong Mei DONG, Jacob LAGE, Nicholas BIRD, Christopher TAPSELL, Aaron HUMMEL
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Patent number: 10581399Abstract: The present invention is directed to an impedance matching network for use at a predetermined frequency.Type: GrantFiled: July 27, 2016Date of Patent: March 3, 2020Assignee: Anaren, Inc.Inventors: Chong Mei, Omar Eldaiki, Hans Peter Ostergaard
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Patent number: 10535912Abstract: A power divider capable of implementation in a compact multilayer surface mount component to perform power division/combining with low insertion loss, wide bandwidth, design flexibility and high power handling capabilities. The power divider has a first pair of coupled transmission lines interconnecting the input to the outputs, a second pair of coupled transmission lines interconnecting the output ports to grounded isolation resistors, and a single transmission line interconnecting the second pair of coupled transmission lines. The surface mount implementation is by a first layer supporting the ports, a second layer providing edge coupled lines, a third layer having ground plane, a fourth layer and a fifth layer each supporting one of a pair of broadside coupled lines, a sixth layer with another ground plane, and a seventh layer including a single line interconnecting the broadside coupled lines.Type: GrantFiled: August 9, 2017Date of Patent: January 14, 2020Assignee: Anaren, Inc.Inventors: David Senior, Chong Mei
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Publication number: 20190360003Abstract: The present invention relates to the field of fungal production fatty alcohols. More specifically, the present invention relates to genetically modified host cells, nucleic acid constructs and culture medium for the production of fatty alcohols in Rhodosporidium.Type: ApplicationFiled: January 29, 2018Publication date: November 28, 2019Applicant: TEMASEK LIFE SCIENCES LABORATORY LIMITEDInventors: Lianghui JI, Yanbin LIU, Chong Mei John KOH, Sihui Amy YAP, Si Te NGOH
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Patent number: 10308691Abstract: The present invention relates to the field of fungal biotechnology, more particularly to genetic engineering methods for the production of carotenoids in fungal hosts selected from Rhodospordium and Rhodotorula genera.Type: GrantFiled: December 14, 2015Date of Patent: June 4, 2019Assignee: TEMASEK LIFE SCIENCES LABORATORY LIMITEDInventors: Yanbin Liu, Chong Mei Koh, Lianghui Ji
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Publication number: 20190051964Abstract: A power divider capable of implementation in a compact multilayer surface mount component to perform power division/combining with low insertion loss, wide bandwidth, design flexibility and high power handling capabilities. The power divider has a first pair of coupled transmission lines interconnecting the input to the outputs, a second pair of coupled transmission lines interconnecting the output ports to grounded isolation resistors, and a single transmission line interconnecting the second pair of coupled transmission lines. The surface mount implementation is by a first layer supporting the ports, a second layer providing edge coupled lines, a third layer having ground plane, a fourth layer and a fifth layer each supporting one of a pair of broadside coupled lines, a sixth layer with another ground plane, and a seventh layer including a single line interconnecting the broadside coupled lines.Type: ApplicationFiled: August 9, 2017Publication date: February 14, 2019Applicant: Anaren, Inc.Inventors: David Senior, Chong Mei