Abstract: A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.

Abstract: A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.

Abstract: An improved assembly for a computer that includes a motherboard having a first side and a second side. The first side has a first portion and a second portion. The first portion contains components capable of generating substantial heat and a strong electric field. The assembly further includes an EMI attenuating cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard.

Abstract: A computer peripheral device retention apparatus is disclosed. In one embodiment, the apparatus includes a frame, a control arm slidably coupled to the frame, and first and second locking arms operably coupled to the control arm. A release button is received within the frame and is in operable association with the control arm. A release trigger arm is pivotally attached to the frame and a control arm latch is connected to the control arm at a first end and is releasably coupled to the release trigger arm at a second end. An ejection mechanism is attached to a rear end of the frame. A backplane printed circuit board is also attached to the rear end of the frame and an electrical control system is coupled to the backplane printed circuit board. A solenoid assembly is coupled to the electrical control system and is releasably coupled to the control arm.