Abstract: An apparatus for cooling a plurality of rack-mountable servers containing heat generating electronic components in a server room including a dielectric liquid cooling apparatus located inside the tank and a secondary cooling apparatus comprising a remote heat exchanger and at least one pump. The volume of dielectric liquid coolant comprises at least one passage in the tank that is outside of the vertically oriented rack-mountable servers. When the at least one pump is operated to move the dielectric liquid coolant vertically across the heat producing components on the vertically oriented servers, a circuit is formed in which a first portion of dielectric liquid coolant is moved vertically upward across the heat producing components on the vertically oriented servers and then downward outside of the rack mountable servers in the at least one passage, while a second portion of the dielectric liquid coolant flows out of the tank.

Abstract: An apparatus for cooling a plurality of rack-mountable servers containing heat generating electronic components in a server room including a dielectric liquid cooling apparatus located inside the tank and a secondary cooling apparatus comprising a remote heat exchanger and at least one pump. The volume of dielectric liquid coolant comprises at least one passage in the tank that is outside of the vertically oriented rack-mountable servers. When the at least one pump is operated to move the dielectric liquid coolant vertically across the heat producing components on the vertically oriented servers, a circuit is formed in which a first portion of dielectric liquid coolant is moved vertically upward across the heat producing components on the vertically oriented servers and then downward outside of the rack mountable servers in the at least one passage, while a second portion of the dielectric liquid coolant flows out of the tank.

Abstract: An apparatus for cooling a plurality of rack-mountable servers containing heat generating electronic components in a server room including a dielectric liquid cooling apparatus located inside the tank and a secondary cooling apparatus comprising a remote heat exchanger and at least one pump. The volume of dielectric liquid coolant comprises at least one passage in the tank that is outside of the vertically oriented rack-mountable servers. When the at least one pump is operated to move the dielectric liquid coolant vertically across the heat producing components on the vertically oriented servers, a circuit is formed in which a first portion of dielectric liquid coolant is moved vertically upward across the heat producing components on the vertically oriented servers and then downward outside of the rack mountable servers in the at least one passage, while a second portion of the dielectric liquid coolant flows out of the tank.

Abstract: A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant.

Abstract: Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.

Abstract: An apparatus for cooling a plurality of rack-mountable servers containing heat generating electronic components in a server room including a dielectric liquid cooling apparatus located inside the tank and a secondary cooling apparatus comprising a remote heat exchanger and at least one pump. The volume of dielectric liquid coolant comprises at least one passage in the tank that is outside of the vertically oriented rack-mountable servers. When the at least one pump is operated to move the dielectric liquid coolant vertically across the heat producing components on the vertically oriented servers, a circuit is formed in which a first portion of dielectric liquid coolant is moved vertically upward across the heat producing components on the vertically oriented servers and then downward outside of the rack mountable servers in the at least one passage, while a second portion of the dielectric liquid coolant flows out of the tank.

Abstract: Embodiments that allow for the air cooling of disk drives associated with liquid cooled nodes are disclosed. A node for performing computing operations includes a frame, a power supply coupled to the |frame|[CB1], and one or more liquid coolant-submersible motherboard assemblies. The one or more motherboard assemblies are configured to operate when submersed in a liquid coolant. The motherboard assemblies are mounted on the frame with one or more spaces between. The spaces form one or more channels between the motherboard assemblies. The frame includes an opening on at least one end of the one or more channels.

Abstract: A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant.

Abstract: A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant.

Abstract: A system for cooling a plurality of servers containing heat generating electronic components, the system including a tank having a fluid inlet and a fluid outlet and a dielectric liquid. The dielectric liquid enters the tank via the fluid inlet at a first temperature equal to or greater than 90 degrees F. and exits the tank via the fluid outlet at a second greater than the first temperature.

Abstract: Embodiments that allow for the air cooling of disk drives associated with liquid cooled nodes are disclosed. A node for performing computing operations includes a frame, a power supply coupled to the |frame|[CB1], and one or more liquid coolant-submersible motherboard assemblies. The one or more motherboard assemblies are configured to operate when submersed in a liquid coolant. The motherboard assemblies are mounted on the frame with one or more spaces between. The spaces form one or more channels between the motherboard assemblies.

Abstract: Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.

Abstract: Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.

Abstract: Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.

Abstract: Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.

Abstract: A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant.

Abstract: A computing module includes one or more racks, one or more cooling components, and one or more power distribution components. The racks include one or more servers and one or more tanks that hold liquid coolant for the servers. The one or more cooling components move a liquid to remove heat from the servers. The one or more power distribution components supply power to the servers. The one or more racks, one or more cooling components, and one or more power distribution components are commonly coupled to one another to be movable as a unit.

Abstract: A node for performing computing operations includes a frame, a power supply coupled to the frame, and one or more liquid coolant-submersible motherboard assemblies. The one or more motherboard assemblies are configured to operate when submersed in a liquid coolant. The motherboard assemblies are mounted on the frame with one or more spaces between. The spaces form one or more channels between the motherboard assemblies. The frame includes an opening on at least one end of the one or more channels.

Abstract: Hard disk drives and computing systems to which they are connected are cooled by submerging the computing systems into a dielectric liquid coolant in a tank and by thermally coupling the hard disk drives to a heat conductive extension that is partly submerged into the coolant and partly out of the coolant. To keep the hard disks drives out of the coolant, they are mounted to the part of the heat conductive extension that is out of the coolant. In such a configuration, the hard disk drives are cooled through conduction of the heat from the hard disk drive to the coolant via the heat conductive extension. A pump may be used to move warmer coolant from the tank into a heat exchanger where the coolant is cooled and to move the cooled coolant back into the tank.

Abstract: Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.