Abstract: Pass through having a glass part disposed in an opening formed in a metal case part, an insulator for lengthening the leakage path connected at an end face thereof to at least one end face of the glass part and at least one electric conductor extending through the glass part and the insulator, the connection between the insulator and the glass part including a fused glass junction.

Abstract: Housing for a semiconductor device includes a housing cup in which the semiconductor device is disposed, the housing cup has a bottom, at least one wall and a metal plate disposed opposite the bottom. The metal plate is thermally connected to the semiconductor device and has a mounting surface connectible to a heat sink and a lateral surface perpendicular to the mounting surface. Contacts extend from inside the housing cup through the bottom and are firmly connected thereto. Cutouts are formed in the metal plate at the edges thereof opposite said contacts. The mounting surface of the metal plate extends beyond the wall opposite the bottom. The housing is fillable with sealing compound through the cutouts to an extent where at least part of the lateral surface of the metal plate is wetted with sealing compound.