Patents by Inventor Christiane Puget

Christiane Puget has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8067060
    Abstract: A polymer layer is deposited on a surface of a support, said surface comprising a flat main part and at least one recessed zone with respect to the flat main part. The polymer layer is achieved by at least the following successive steps: deposition of a predetermined quantity of a liquid mixture comprising at least a polymer or at least a precursor of said polymer on the flat main part of the surface of the support, introducing at least a part of the liquid mixture into the recessed zone by moving a cylinder placed on the flat main part of the surface, deposition of an additional quantity of liquid mixture on the flat main part of the surface, and rotation of the support along an axis perpendicular to the plane of the surface.
    Type: Grant
    Filed: January 14, 2008
    Date of Patent: November 29, 2011
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Christiane Puget, David Henry
  • Patent number: 7563703
    Abstract: A method producing conductive rods localized on conductive blocks of an electronic component.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: July 21, 2009
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Jean Brun, Remi Franiatte, Christiane Puget
  • Patent number: 7510962
    Abstract: This invention relates to a process for manufacturing an anisotropic conducting film comprising a layer of electrically insulating material and conducting through inserts, the process including the following steps: a) formation on a substrate of at least one layer of material with through holes, the layer being called the perforated layer, b) filling of the through holes to form conducting inserts. The process also includes production of a mask partially covering a first end of the conducting inserts and etching of the unmasked part of the ends of the conducting inserts so as to obtain conducting inserts with pointed ends. The invention is applicable to the formation of components (chips, integrated circuits) with a high interconnections density.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: March 31, 2009
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Jean Brun, Christiane Puget
  • Publication number: 20080175996
    Abstract: A polymer layer is deposited on a surface of a support, said surface comprising a flat main part and at least one recessed zone with respect to the flat main part. The polymer layer is achieved by at least the following successive steps: deposition of a predetermined quantity of a liquid mixture comprising at least a polymer or at least a precursor of said polymer on the flat main part of the surface of the support, introducing at least a part of the liquid mixture into the recessed zone by moving a cylinder placed on the flat main part of the surface, deposition of an additional quantity of liquid mixture on the flat main part of the surface, and rotation of the support along an axis perpendicular to the plane of the surface.
    Type: Application
    Filed: January 14, 2008
    Publication date: July 24, 2008
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE
    Inventors: Christiane Puget, David Henry
  • Publication number: 20070166978
    Abstract: A method producing conductive rods localized on conductive blocks of an electronic component.
    Type: Application
    Filed: February 24, 2005
    Publication date: July 19, 2007
    Inventors: Jean Brun, Remi Franiatte, Christiane Puget
  • Publication number: 20060160270
    Abstract: This invention relates to a process for manufacturing an anisotropic conducting film comprising a layer of electrically insulating material and conducting through inserts, the said process comprising the following steps: a) formation on a substrate of at least one layer of material with through holes, the said layer being called the perforated layer, b) filling of the through holes to form conducting inserts. The process also comprises production of a mask partially covering a first end of the conducting inserts and etching of the unmasked part of the ends of the conducting inserts so as to obtain conducting inserts with pointed ends. The invention is applicable to the formation of components (chips, integrated circuits) with a high interconnections density.
    Type: Application
    Filed: July 15, 2004
    Publication date: July 20, 2006
    Applicant: Commissariat L'energie
    Inventors: Jean Brun, Christiane Puget
  • Patent number: 6435733
    Abstract: Assembly allowing for connection of optical fibres with optical or optoelectronic components and process for manufacturing this assembly. According to the invention, at least one fibre support (4, 6) is formed including, for each fibre (2), a V-shaped housing. The support and the component (32) are attached to a substrate (12) with meltable elements (16, 38) and the fibre is positioned in the housing so as to vertically align the fibre with the component, horizontal alignment being obtained by the melted elements. Application is to microelectronics.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: August 20, 2002
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Guy Parat, Patrice Caillat, Christiane Puget