Abstract: A through-wafer via substrate includes a substrate having an intermediate layer and a bonding layer formed on a surface of the intermediate layer. A via cavity extends through the bonding layer and into the intermediate layer, and a stress buffer liner is deposited directly on inner sidewalls and a base of the via cavity. An electrically conductive through-wafer via is disposed in the via cavity such that the stress buffer liner is interposed completely between the intermediate layer and the through-wafer via.

Abstract: A through-wafer via substrate includes a substrate having an intermediate layer and a bonding layer formed on a surface of the intermediate layer. A via cavity extends through the bonding layer and into the intermediate layer, and a stress buffer liner is deposited directly on inner sidewalls and a base of the via cavity. An electrically conductive through-wafer via is disposed in the via cavity such that the stress buffer liner is interposed completely between the intermediate layer and the through-wafer via.

Abstract: Disclosed is a process for manufacturing individual die devices, with a desired or predicted amount of flatness, from a bonded wafer process. The flatness of a bonded wafer is measured at point in the wafer manufacturing process. This measurement is compared to a value predetermined by an empirical analysis of previous devices made by the same process. If the flatness of the bonded wafer is not at the predetermined value, then one or more compensation layers are provided to the bonded wafer to obtain the predetermined flatness value. Once obtained, subsequent processing is performed and the resulting individual dies are obtained with the desired flatness characteristic.

Abstract: Disclosed is a process for manufacturing individual die devices, with a desired or predicted amount of flatness, from a bonded wafer process. The flatness of a bonded wafer is measured at point in the wafer manufacturing process. This measurement is compared to a value predetermined by an empirical analysis of previous devices made by the same process. If the flatness of the bonded wafer is not at the predetermined value, then one or more compensation layers are provided to the bonded wafer to obtain the predetermined flatness value. Once obtained, subsequent processing is performed and the resulting individual dies are obtained with the desired flatness characteristic.

Abstract: In alternative embodiments, the invention provides products (articles) of manufacture comprising nanostructures such as nanotubes having a surface comprising tantalum. In alternative embodiments, products of manufacture of the invention include nanostructures, e.g., nanotubes, nanowire, nanopore, and the like comprising a surface layer of tantalum. In alternative embodiments, products or articles of manufacture of the invention are bioimplants, and the tantalum-surface-coated nanostructures of the invention provide increased bioactivity and bone forming ability. In alternative embodiments, products or articles of manufacture of the invention, e.g., bioimplants, comprising the tantalum-surface-coated nanostructures of the invention are used for in vitro, ex vivo and in vivo testing, implants, biomedical devices and therapeutics.

Abstract: Techniques, apparatus, materials and systems are described for providing solar cells. In one aspect, an apparatus includes a high efficiency dye sensitized solar cell (DSSC). The DSSC includes three-dimensional nanostructured electrodes. The three-dimensional nanostructured electrodes can include a cathode; an electrolyte; and anode that includes TiO2 nanotubes arranged in a three-dimensional structure; and a photosensitive dye coated on the anode.

Abstract: In alternative embodiments, the invention provides products (articles) of manufacture comprising nanostructures such as nanotubes having a surface comprising tantalum. In alternative embodiments, products of manufacture of the invention include nanostructures, e.g., nanotubes, nanowire, nanopore, and the like comprising a surface layer of tantalum. In alternative embodiments, products or articles of manufacture of the invention are bioimplants, and the tantalum-surface-coated nanostructures of the invention provide increased bioactivity and bone forming ability. In alternative embodiments, products or articles of manufacture of the invention, e.g., bioimplants, comprising the tantalum-surface-coated nanostructures of the invention are used for in vitro, ex vivo and in vivo testing, implants, biomedical devices and therapeutics.

Abstract: Techniques, apparatus, materials and systems are described for providing solar cells. In one aspect, an apparatus includes a high efficiency dye sensitized solar cell (DSSC). The DSSC includes three-dimensional nanostructured electrodes. The three-dimensional nanostructured electrodes can include a cathode; an electrolyte; and anode that includes TiO2 nanotubes arranged in a three-dimensional structure; and a photosensitive dye coated on the anode.