Patents by Inventor Christof Landesberger

Christof Landesberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10304714
    Abstract: The invention relates to an apparatus for electrostatic coupling of a substrate with a substrate carrier, wherein the apparatus includes a flexible plastic carrier film on which an electrically contactable electrode structure is unilaterally deposited, and a cover layer which can be brought into contact with the electrode structure on the side of the electrode structure facing away from the carrier film, wherein the apparatus is configured such that, in a coupled state, the same is arranged at least in sections between the substrate and the substrate carrier and, in a non-coupled state, the same can be removed from the substrate carrier in a reusable manner.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: May 28, 2019
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventor: Christof Landesberger
  • Publication number: 20190135618
    Abstract: A method for manufacturing a semiconductor device package includes providing an electrically insulating film having film terminal contacts on a surface thereof, and an opening therethrough. A semiconductor device arrangement at least including a carrier element having arranged thereon a projecting element and element terminal contacts is deposited on the film, wherein the projecting element is introduced into the opening and the element terminal contacts are arranged in contact with the film terminal contacts. The planarization layer is deposited over the carrier element and the film.
    Type: Application
    Filed: November 3, 2018
    Publication date: May 9, 2019
    Inventors: Christof LANDESBERGER, Indranil BOSE
  • Patent number: 9978626
    Abstract: Carrier wafers are used to hold thin and ultra-thin substrates such as semiconductor components, for example. The carrier wafer of the invention has a plurality of electrodes insulated on all sides (floating electrodes). This plurality of floating electrodes, but at least 50 floating electrodes, are located next to one another with reference to the plane of the first surface of the carrier wafer. Each of these floating electrodes can be charged, for example by means of Fowler-Nordheim tunnels or by the injection of hot charge carriers, in particular of hot electrons or hot holes. Also provided are a method for holding a flexible substrate by means of a carrier wafer of this type and a method for the manufacture of a carrier wafer of this type.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: May 22, 2018
    Assignee: Fraunhofer-Gesellschaft zur Foederung der angewandten Forschung e.V.
    Inventors: Christoph Kutter, Christof Landesberger, Dieter Bollmann
  • Publication number: 20180108557
    Abstract: The invention relates to an apparatus for electrostatic coupling of a substrate with a substrate carrier, wherein the apparatus includes a flexible plastic carrier film on which an electrically contactable electrode structure is unilaterally deposited, and a cover layer which can be brought into contact with the electrode structure on the side of the electrode structure facing away from the carrier film, wherein the apparatus is configured such that, in a coupled state, the same is arranged at least in sections between the substrate and the substrate carrier and, in a non-coupled state, the same can be removed from the substrate carrier in a reusable manner.
    Type: Application
    Filed: December 6, 2017
    Publication date: April 19, 2018
    Inventor: Christof LANDESBERGER
  • Publication number: 20180035548
    Abstract: The invention relates to a method in which a layer compound having a substrate having an adhesive layer applied thereon at least in regions is provided. An opening extending through the substrate and through the adhesive layer is introduced therein in order to obtain a patterned layer compound. A microchip having an active region arranged on the outside of the chip is provided, wherein the active region is a sensor area or a radiation coupling-out area. In addition, in accordance with the invention, the microchip is arranged on the adhesive layer of the patterned layer compound such that the active region is exposed through the opening.
    Type: Application
    Filed: July 26, 2017
    Publication date: February 1, 2018
    Inventors: Christof LANDESBERGER, Dieter BOLLMANN, Waltraud HELL, Gerhard KLINK
  • Publication number: 20160035611
    Abstract: Carrier wafers are used to hold thin and ultra-thin substrates such as semiconductor components, for example. The carrier wafer of the invention has a plurality of electrodes insulated on all sides (floating electrodes). This plurality of floating electrodes, but at least 50 floating electrodes, are located next to one another with reference to the plane of the first surface of the carrier wafer. Each of these floating electrodes can be charged, for example by means of Fowler-Nordheim tunnels or by the injection of hot charge carriers, in particular of hot electrons or hot holes. Also provided are a method for holding a flexible substrate by means of a carrier wafer of this type and a method for the manufacture of a carrier wafer of this type.
    Type: Application
    Filed: July 31, 2015
    Publication date: February 4, 2016
    Inventors: Christoph Kutter, Christof Landesberger, Dieter Bollmann
  • Publication number: 20150332944
    Abstract: A carrier substrate for supporting a substrate structure having a process substrate and a frame structure has a base portion and a support portion. The support portion is arranged on the base portion. The support portion and the base portion form a recess region for receiving the frame structure of the substrate structure. The support portion has a support surface area for supporting the process substrate of the substrate structure.
    Type: Application
    Filed: July 27, 2015
    Publication date: November 19, 2015
    Inventor: Christof LANDESBERGER
  • Patent number: 8563358
    Abstract: A method of producing a chip package includes providing a substrate comprising a first recess having a recess bottom and recess side walls. A chip comprising a chip backside is introduced into the recess such that the chip does not protrude from the recess and such that a gap remains between the recess side walls and the chip, the chip backside being attached to the recess bottom. The gap is filled with a filler material.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: October 22, 2013
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Christof Landesberger, Robert Faul
  • Patent number: 8198135
    Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: June 12, 2012
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung e.V.
    Inventors: Gerhard Klink, Christof Landesberger, Michael Feil
  • Publication number: 20120091594
    Abstract: A method of producing a chip package includes providing a substrate comprising a first recess having a recess bottom and recess side walls. A chip comprising a chip backside is introduced into the recess such that the chip does not protrude from the recess and such that a gap remains between the recess side walls and the chip, the chip backside being attached to the recess bottom. The gap is filled with a filler material.
    Type: Application
    Filed: October 18, 2011
    Publication date: April 19, 2012
    Inventors: Christof LANDESBERGER, Robert FAUL
  • Publication number: 20110047793
    Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.
    Type: Application
    Filed: November 10, 2010
    Publication date: March 3, 2011
    Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Gerhard KLINK, Christof LANDESBERGER, Michael FEIL
  • Patent number: 7733624
    Abstract: Method for handling a substrate with polarizable molecules including providing a carrier with a first junction electrode and disposing the substrate between the first junction electrode and a second junction electrode. Fixing the substrate on the carrier is achieved by applying a voltage between the first junction electrode and the second junction electrode, so that the polarizable molecules are polarized. After removing the second junction electrode, the substrate remains fixed on the carrier.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: June 8, 2010
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventor: Christof Landesberger
  • Publication number: 20090162566
    Abstract: The present invention relates to a method for the selective coating of a surface of a substrate with liquid, wherein the surface to be selectively coated with liquid comprises regions exhibiting different surface energies, and wherein prior to wetting a fluorine-containing plasma gas is directly acting on the regions exhibiting different surface energies.
    Type: Application
    Filed: December 18, 2008
    Publication date: June 25, 2009
    Inventors: Erwin Yacoub-George, Sabine Scherbaum, Christof Landesberger
  • Publication number: 20080232022
    Abstract: Method for handling a substrate with polarizable molecules including providing a carrier with a first junction electrode and disposing the substrate between the first junction electrode and a second junction electrode. Fixing the substrate on the carrier is achieved by applying a voltage between the first junction electrode and the second junction electrode, so that the polarizable molecules are polarized. After removing the second junction electrode, the substrate remains fixed on the carrier.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 25, 2008
    Applicant: Fraunhofer-Gesellschaft Zur Forderung der angewandten Forschung e.V.
    Inventor: Christof Landesberger
  • Publication number: 20080076209
    Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.
    Type: Application
    Filed: September 5, 2007
    Publication date: March 27, 2008
    Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Gerhard KLINK, Christof LANDESBERGER, Michael FEIL
  • Patent number: 7027283
    Abstract: The present invention provides a mobile holder for a wafer, which comprises a base element, a first fixing means and a second fixing means. The first fixing means is configured to allow a wafer to be fixed to the base element. The second fixing means is configured to fix the mobile holder to a support for said mobile holder.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: April 11, 2006
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Christof Landesberger, Armin Klumpp, Martin Bleier
  • Patent number: 6756288
    Abstract: In a method of dicing a wafer, which comprises a plurality of individual circuit structures, a trench is first defined between at least two circuit structures on one face of the wafer. Subsequently, the trench is deepened down to a defined depth. Following this, one face of the wafer has fixed thereto a re-detachable intermediate support composed of a fixed intermediate support substrate and an adhesive medium which is applied to said intermediate support substrate and which can specifically be modified in terms of its adhesive strength, whereupon the wafer is dry-etched from the opposite face so that circuit chips are obtained which are connected to one another only via the intermediate support. Subsequently, the circuit chips are removed from the intermediate support.
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: June 29, 2004
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Michael Feil, Christof Landesberger, Armin Klumpp, Erwin Hacker
  • Publication number: 20040037692
    Abstract: The present invention provides a mobile holder for a wafer, which comprises a base element, a first fixing means and a second fixing means. The first fixing means is configured to allow a wafer to be fixed to the base element. The second fixing means is configured to fix the mobile holder to a support for said mobile holder.
    Type: Application
    Filed: June 10, 2003
    Publication date: February 26, 2004
    Inventors: Christof Landesberger, Armin Klumpp, Martin Bleier
  • Patent number: 6514790
    Abstract: In a method for handling in parallel a plurality of circuit chips, which are arranged in a first arrangement, which corresponds to their arrangement in the original wafer, on the surface of an auxiliary carrier, the plurality of circuit chips is picked up by a plurality of pick up devices. The plurality of pick up devices with the picked up circuit chips is moved simultaneously to one or several carriers, in such a way that, simultaneously with the motion, the first arrangement of the circuit chips is changed into a second arrangement, which is different from the first arrangement. Then the circuit chips are simultaneously placed in the second arrangement on the one or several carriers.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: February 4, 2003
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Andreas Plettner, Karl Haberger, Christof Landesberger
  • Patent number: 6444493
    Abstract: In a method for vertically integrating active circuit planes, a first substrate having at least one integrated circuit in a first main surface thereof and further having connecting areas for the integrated circuit as well as outer connecting areas on the first main surface is provided in a first step. A second substrate having at least one integrated circuit in a first main surface thereof and further having connecting areas for the integrated circuit as well as open or openable areas on the first main surface is provided. The first main surfaces of the first and second substrates are joined in such a way that the connecting areas of the first substrate are connected to those of the second substrate in an electrically conductive manner in such a way that the outer connecting areas of the first substrate are in alignment with the open or openable areas of the second substrate. Subsequently, the second substrate is thinned and the outer connecting areas are exposed through the open or openable areas.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: September 3, 2002
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Michael Feil, Christof Landesberger