Patents by Inventor Christoph THEISS

Christoph THEISS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10775561
    Abstract: An optoelectronic component includes a chip having a substrate and at least one optical waveguide integrated in the chip. The electro-optical component may be monolithically integrated in one or a plurality of semiconductor layers of the chip arranged on the substrate top side of the substrate, or on the substrate top side of the substrate. At least one electrical connection of the monolithically integrated electro-optical component is connected by means of a connection line to a conductor track connection situated below the substrate rear side. The connection line extends through a hole in the substrate from the electro-optical component to the conductor track connection situated below the substrate rear side.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: September 15, 2020
    Assignee: TECHNISCHE UNIVERSITÄT BERLIN
    Inventors: Stefan Meister, Hanjo Rhee, Christoph Theiss, Sebastian Kupijai
  • Patent number: 10598859
    Abstract: An optoelectronic component including an optical waveguide integrated into a plane of the component. The optical waveguide configured to guide optical radiation in the plane. The component including a coupling element connected to the waveguide and coupling optical radiation into the waveguide along the main coupling path. The degree of coupling efficiency of the coupling element is less than one in respect to the main coupling path. The coupling element outputs optical loss radiation along a secondary coupling path. The optical loss radiation is proportional to the radiation transferred along the main coupling path. The optoelectronic component includes a detector connected to the coupling element that registers the optical loss radiation and produces a detector signal. The optoelectronic component includes a control unit configured to influence at least one operating variable of the optoelectronic component based on the detector signal.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: March 24, 2020
    Assignee: TECHNISCHE UNIVERSITÄT BERLIN
    Inventors: Stefan Meister, Hanjo Rhee, Christoph Theiss, Aws Al-Saadi
  • Patent number: 10488595
    Abstract: A photonic component that includes a photonically integrated chip and a fiber holder that is mechanically connected to said chip. The fiber holder includes at least one groove with an optical fiber laid therein. The chip includes a substrate whose substrate base material is a semiconductor material, an integrated optical waveguide that is integrated into one or more material layers of the chip, which layers are wave guiding and positioned on the substrate, a coupler formed in the optical waveguide or connected to said optical waveguide, particularly a grating coupler, and an optical diffraction and refraction structure that is integrated into one or more material layers of the chip which are positioned above the optical coupler when viewed from the substrate, and that shapes the beam prior to its being coupled into the waveguide or after being coupled out of the waveguide.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: November 26, 2019
    Assignee: Sicoya GmbH
    Inventors: Moritz Grehn, Sven Otte, Christoph Theiss, Stefan Meister, David Selicke, Hanjo Rhee
  • Patent number: 10481355
    Abstract: An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: November 19, 2019
    Assignee: Sicoya GmbH
    Inventors: Thorsten Kettler, Moritz Grehn, Christoph Theiss, Stefan Meister
  • Publication number: 20190324222
    Abstract: An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.
    Type: Application
    Filed: April 20, 2018
    Publication date: October 24, 2019
    Applicant: Sicoya GmbH
    Inventors: Thorsten KETTLER, Moritz GREHN, Christoph THEISS, Stefan MEISTER
  • Publication number: 20190179082
    Abstract: The invention relates, inter alia, to a photonic component (1) that comprises a phonetically integrated chip (100) and a fibre holder (200) that is mechanically connected to said chip, said fibre holder comprising: at least one groove (210) with an optical fibre (220) laid therein, and at least one mirroring surface (230) which reflects the beam (S) of the fibre in the direction of the chip, and/or the beam of the chip in the direction of the fibre.
    Type: Application
    Filed: July 28, 2017
    Publication date: June 13, 2019
    Applicant: Sicoya GmbH
    Inventors: Moritz GREHN, Sven OTTE, Christoph THEISS, Stefan MEISTER, David SELICKE, Hanjo RHEE
  • Publication number: 20190146151
    Abstract: The invention relates to an optoelectronic component (100) comprising a chip (110) comprising a substrate (12) and at least one optical waveguide (20) integrated in the chip (110). In one variant of the invention it is provided that an electro-optical component (30) is monolithically integrated in one or a plurality of semiconductor layers of the chip (110) arranged on the substrate top side (12a) of the substrate (12), or on the substrate top side (12a) of the substrate (12) and at least one electrical connection of the monolithically integrated electro-optical component (30) is connected by means of a connection line (41) to a conductor track connection (43) situated below the substrate rear side (12b), wherein the connection line (41) extends through a through hole (42) in the substrate (12) from the electro-optical component (30) to the conductor track connection (43) situated below the substrate rear side (12b).
    Type: Application
    Filed: September 28, 2015
    Publication date: May 16, 2019
    Applicant: TECHNISCHE UNIVERSITÄT BERLIN
    Inventors: Stefan MEISTER, Hanjo RHEE, Christoph THEISS, Sebastian KUPIJAI
  • Patent number: 10025030
    Abstract: An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: July 17, 2018
    Assignee: Technische Universitaet Berlin
    Inventors: Stefan Meister, Hanjo Rhee, Christoph Theiss, Aws Al-Saadi, Marvin Henniges, Muhammad Atif
  • Publication number: 20180143378
    Abstract: An optoelectronic component including an optical waveguide integrated into a plane of the component. The optical waveguide configured to guide optical radiation in the plane. The component including a coupling element connected to the waveguide and coupling optical radiation into the waveguide along the main coupling path. The degree of coupling efficiency of the coupling element is less than one in respect to the main coupling path. The coupling element outputs optical loss radiation along a secondary coupling path. The optical loss radiation is proportional to the radiation transferred along the main coupling path. The optoelectronic component includes a detector connected to the coupling element that registers the optical loss radiation and produces a detector signal. The optoelectronic component includes a control unit configured to influence at least one operating variable of the optoelectronic component based on the detector signal.
    Type: Application
    Filed: May 3, 2016
    Publication date: May 24, 2018
    Applicant: Technische Universität Berlin
    Inventors: Stefan MEISTER, Hanjo RHEE, Christoph THEISS, Aws AL-SAADI
  • Publication number: 20180100966
    Abstract: An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.
    Type: Application
    Filed: April 12, 2016
    Publication date: April 12, 2018
    Applicant: Technische Universität Berlin
    Inventors: Stefan MEISTER, Hajo RHEE, Christoph THEISS, Aws AL-SAADE, Marvin HENNIGES, Muhammad ATIF
  • Patent number: 9817295
    Abstract: An injection modulator for modulation of optical radiation, having an optical waveguide and a diode structure, having at least two p-doped semiconductor portions, at least two n-doped semiconductor portions and at least one lightly or undoped intermediate portion between the p-doped and n-doped portions. The p-doped portions when viewed in the longitudinal direction of the waveguide are offset with respect to the n-doped portions and the diode structure is arranged in a resonance-free portion of the waveguide. The p-doped portions lie on one side of the waveguide, the n-doped portions lie on the other side of the waveguide and the intermediate portion lies in the center, each portion extends transversely with respect to the waveguide longitudinal direction in the direction of the waveguide center of the waveguide and no p-doped portion when viewed in the longitudinal direction of the waveguide overlaps any n-doped portion.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: November 14, 2017
    Assignees: TECHNISCHE UNIVERSITAT BERLIN, SICOYA GMBH
    Inventors: Stefan Meister, Aws Al-Saadi, Sebastian Kupijai, Christoph Theiss, Hanjo Rhee, Lars Zimmermann, David Stolarek
  • Publication number: 20170299939
    Abstract: An injection modulator for modulation of optical radiation, having an optical waveguide and a diode structure, having at least two p-doped semiconductor portions, at least two n-doped semiconductor portions and at least one lightly or undoped intermediate portion between the p-doped and n-doped portions. The p-doped portions when viewed in the longitudinal direction of the waveguide are offset with respect to the n-doped portions and the diode structure is arranged in a resonance-free portion of the waveguide. The p-doped portions lie on one side of the waveguide, the n-doped portions lie on the other side of the waveguide and the intermediate portion lies in the center, each portion extends transversely with respect to the waveguide longitudinal direction in the direction of the waveguide center of the waveguide and no p-doped portion when viewed in the longitudinal direction of the waveguide overlaps any n-doped portion.
    Type: Application
    Filed: September 21, 2015
    Publication date: October 19, 2017
    Applicants: TECHNISCHE UNIVERSITAET BERLIN, SICOYA GMBH
    Inventors: Stefan MEISTER, Aws AL-SAADI, Sebastian KUPIJAI, Christoph THEISS, Hanjo RHEE, Lars ZIMMERMANN, David STOLAREK
  • Publication number: 20170242191
    Abstract: The invention relates, inter alia, to a photonically integrated chip (2) having a substrate (20), a plurality of material layers arranged on a top side (21) of the substrate (20), an optical waveguide which is integrated in one or more wave-guiding material layers of the chip (2), and a grating coupler (60) which is formed in the optical waveguide and causes beam deflection of radiation guided in the waveguide in the direction out of the layer plane of the wave-guiding material layer(s) or causes beam deflection of radiation to be coupled into the waveguide in the direction into the layer plane of the wave-guiding material layer(s).
    Type: Application
    Filed: September 25, 2015
    Publication date: August 24, 2017
    Applicants: Technische Universität Berlin, Sicoya GmbH
    Inventors: Hanjo RHEE, Marvin HENNIGES, Stefan MERSTER, Christoph THEISS, David SELICKE, David STOLAREK, Lars ZIMMERMANN, Harald H. RICHTER