Abstract: Embodiments of the present disclosure provide improved photolithography systems and methods using a solid state emitter array. The solid state emitter array comprises solid state emitter devices arranged in rows and columns, wherein each solid state emitter device comprises two or more subpixels. Each solid state emitter device comprises one program gate which may transmit a voltage to a state storage node. The state storage node is in electrical communication with a drive gate. The drive gate is in communication with two or more solid state emitter subpixels. The arrangement of a plurality of subpixels in communication with a single drive gate allows more than one pulse to be delivered to the drive gate, resulting in illumination of more than one subpixel at each drive gate. The redundancy results in improved data efficiency.

Abstract: The present disclosure generally relates to lithography devices comprising an autofocus system. The autofocus system is configured to individually focus and adjust a plurality of digital micromirror devices. The autofocus system comprises a single light beam and a diffractive optical element configured to split the single light beam into two or more split beams. The two or more split beams are directed to a beam splitter. The two or more split beams are then reflected off the surface of a substrate to at least one position sensor. The position sensor is configured to measure the position of each of the two or more split beams. At least one digital micromirror device is then individually adjusted based on the measured position to adjust the focus of the at least one digital micromirror device with respect to surface height and tilt variations of the substrate.

Abstract: Embodiments of the present disclosure provide methods for producing images on substrates. The method includes providing a p-polarization beam to a first mirror cube having a first digital micromirror device (DMD), providing an s-polarization beam to a second mirror cube having a second DMD, and reflecting the p-polarization beam off the first DMD and reflecting the s-polarization beam off the second DMD such that the p-polarization beam and the s-polarization beam are reflected towards a light altering device configured to produce a plurality of superimposed images on the substrate.

Abstract: Systems and methods discussed herein relate to patterning substrates during lithography and microlithography to form features to a set or sets of critical dimensions using dose. The dose maps are generated based upon images captured during manufacturing to account for process variation in a plurality of operations employed to pattern the substrates. The dose maps are used along with imaging programs to tune the voltages applied to various regions of a substrate in order to produce features to a set or sets of critical dimensions and compensate for upstream or downstream operations that may otherwise result in incorrect critical dimension formation.

Abstract: Embodiments of the present disclosure provide improved photolithography systems and methods using a solid state emitter device. The solid state emitter device includes an array of solid state emitters arranged in a plurality of horizontal rows and vertical columns. The variable intensity of each group of solid state emitters, for example an entire row or column of solid state emitters, is controllable for improved field brightness uniformity and stitching. Controlling the variable intensity includes, for example, varying the signal, such as voltage, that is applied to each of the rows of solid state emitters to attenuate the brightness from the middle of the array to the edges of the array to accommodate for overlapping exposures during photolithography processing.

Abstract: Embodiments of the present disclosure generally relate to an image projection system. The image projection system includes an active matrix solid state emitter (SSE) device. The active matrix solid state emitter includes a substrate, a silicon layer, and a emitter substrate. The silicon layer is deposited over the substrate having a plurality of transistors formed therein. The emitter substrate is positioned between the silicon layer and the substrate. The emitter substrate comprises a plurality of emitter arrays. Each emitter array defines a pixel, wherein one pixel comprises one or more transistors from the plurality of transistors. Each transistor is configured to receive a variable amount of current.

Abstract: Embodiments disclosed herein relate to an exposure pattern alteration software application which manipulates exposure polygons having lines with angles substantially close to angles of symmetry of a hex close pack arrangement, which suffer from long jogs. Long jogs present themselves as high edge placement error regions. As such, the exposure pattern alteration software application provides for line wave reduction by serrating polygon edges at affected angles to reduce edge placement errors during maskless lithography patterning in a manufacturing process.

Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a substrate without planarization. The method includes depositing a material stack to be patterned on a substrate, depositing and patterning a thick mask material on a portion of the material stack, etching the material stack down one level, trimming a side portion of the thick mask material, etching the material stack down one more level, repeating trim and etch steps above ‘n’ times, and stripping the thick mask material from the material stack.

Abstract: The present disclosure provides a method for producing an image on a substrate. The method includes providing a single beam of light to a multiple DMD assembly, splitting the single beam of light into an s-polarization beam and a p-polarization beam, and reflecting the s-polarization beam and the p-polarization beam through the multiple DMD assembly such that the multiple DMD assembly produces a plurality of superimposed images on the substrate.

Abstract: An image correction application relating to the ability to apply maskless lithography patterns to a substrate in a manufacturing process is disclosed. The embodiments described herein relate to a software application platform, which corrects non-uniform image patterns on a substrate. The application platform method includes in a digital micromirror device (DMD) installed in an image projection system, the DMD having a plurality of columns, each column having a plurality of mirrors, disabling at least one entire column of the plurality of columns, exposing a first portion of the substrate to a first shot of electromagnetic radiation, exposing a second portion of the substrate to a second shot of electromagnetic radiation, and iteratively translating the substrate a step size and exposing another portion of the substrate to another shot of electromagnetic radiation until the substrate has been completely exposed to shots of electromagnetic radiation.

Abstract: The present disclosure generally relates to light field displays and methods of displaying images with light field arrays. In one example, the present disclosure relates to pixel arrangements for use in light field displays. Each pixel includes a plurality of LEDs, such as micro LEDs, positioned adjacent respective micro-lenses of each pixel.

Abstract: An image correction application relating to the ability to apply maskless lithography patterns to a substrate in a manufacturing process is disclosed. The embodiments described herein relate to a software application platform, which corrects non-uniform image patterns on a substrate. The application platform method includes in a digital micromirror device (DMD) installed in an image projection system, the DMD having a plurality of columns, each column having a plurality of mirrors, disabling at least one entire column of the plurality of columns, exposing a first portion of the substrate to a first shot of electromagnetic radiation, exposing a second portion of the substrate to a second shot of electromagnetic radiation, and iteratively translating the substrate a step size and exposing another portion of the substrate to another shot of electromagnetic radiation until the substrate has been completely exposed to shots of electromagnetic radiation.

Abstract: The present disclosure generally relates to light field displays and methods of displaying images with light field arrays. In one example, the present disclosure relates to pixel arrangements for use in light field displays. Each pixel includes a plurality of LEDs, such as micro LEDs, positioned adjacent respective micro-lenses of each pixel.

Abstract: Disclosed are methods and apparatus for a shadow mask. A shadow mask (200), comprising: a frame (210) made of a metallic material, and one or more mask patterns (205) coupled to the frame (210), the one or more mask patterns (205) comprising a metal having a coefficient of thermal expansion less than or equal to about 14 microns/meter/degrees Celsius and having a plurality of openings (215) formed therein, the metal having a thickness of about 5 microns to about 50 microns and having borders (355) formed therein each defining a fine opening (215) having a recessed surface (370) formed on a substrate contact surface (375) thereof.

Abstract: Embodiments described herein provide for light field displays and methods of forming light field displays where micro-LED arrays are each configured to provide at least a macro-pixel of effective native hardware resolution, where each macro-pixel provides single pixel of spatial resolution and plurality of pixels of angular resolution, and where each pixel of angular resolution includes a plurality of sub-pixels each provided by a directional collimating micro-LED device described herein.

Abstract: The present disclosure generally relates to methods and systems for manufacturing wire grid polarizers (WGP) using Markle-Dyson exposure systems and dual tone development (DTD) frequency doubling. In one embodiment, the method includes depositing a photoresist layer over an aluminum-coated display substrate, patterning the photoresist layer by dual tone development using a Markle-Dyson system to form a photoresist pattern, and transferring the photoresist pattern into the aluminum-coated display substrate to manufacture a WGP having finer pitch, for example less than or equal to about 100 nm, and increased frequency.

Abstract: The present disclosure generally relates to a method and apparatus for processing a web-based substrate. As the substrate travels between rollers, the substrate may be stretched and thus distorted. Once the substrate reaches the roller, the substrate distortion is fixed. By adjusting the processing parameters, the distorted substrate is processed without correcting the distortion.

Abstract: Embodiments disclosed herein relate to an exposure pattern alteration software application which manipulates exposure polygons having lines with angles substantially close to angles of symmetry of a hex close pack arrangement, which suffer from long jogs. Long jogs present themselves as high edge placement error regions. As such, the exposure pattern alteration software application provides for line wave reduction by serrating polygon edges at affected angles to reduce edge placement errors during maskless lithography patterning in a manufacturing process.

Abstract: Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, a camera adjacent the beamsplitter, and a projection optics system adjacent the beamsplitter.

Abstract: Multi-beam pattern generators employing processors to vary delivered dose of writing beams according to photoresist thicknesses, and associated methods are disclosed. A pattern generator may write a pattern upon a substrate having a photoresist which is sensitive to the writing beams. The pattern may be written in respective writing cycles when the writing beams write at least a portion of the pattern at writing pixel locations. A beam actuator of the pattern generator may independently direct the writing beams to the writing pixels to deliver respective pixel doses during each writing cycle. Pixel doses delivered may be adjusted according to a thickness of the photoresist at various writing pixel locations according to one or more approaches, using one or more of: actuator dwell times, emitted pulse duration, emitted pulse frequency, and emitted pulse intensity. In this manner, additional dimensional control is provided for substrates having variable photoresist thicknesses.