Patents by Inventor Christopher Lawrence Rexer
Christopher Lawrence Rexer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240119206Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: ApplicationFiled: December 14, 2023Publication date: April 11, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK
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Patent number: 11880642Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: GrantFiled: September 7, 2022Date of Patent: January 23, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph Victory, Thomas Neyer, YunPeng Xiao, Hyeongwoo Jang, Peter Dingenen, Vaclav Valenta, Mehrdad Baghaie Yazdi, Christopher Lawrence Rexer, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu, Roman Sickaruk
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Publication number: 20230253468Abstract: In one general aspect, an apparatus can include a substrate having a semiconductor region, and a trench defined in the semiconductor region and having a sidewall. The apparatus can include a shield electrode disposed in the trench and insulated from the sidewall of the trench by a shield dielectric, the shield dielectric having a low-k dielectric portion and a high-k dielectric portion. The apparatus can include a gate electrode disposed in the trench and at least partially surrounded by a gate dielectric, and an inter-electrode dielectric disposed between the shield electrode and the gate electrode.Type: ApplicationFiled: February 9, 2022Publication date: August 10, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Zia HOSSAIN, Balaji PADMANABHAN, Christopher Lawrence REXER, Gordon M. GRIVNA, Sauvik CHOWDHURY
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Publication number: 20230004700Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: ApplicationFiled: September 7, 2022Publication date: January 5, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK
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Patent number: 11481532Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: GrantFiled: October 21, 2020Date of Patent: October 25, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph Victory, Thomas Neyer, YunPeng Xiao, Hyeongwoo Jang, Peter Dingenen, Vaclav Valenta, Tirthajyoti Sarkar, Mehrdad Baghaie Yazdi, Christopher Lawrence Rexer, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu, Roman Sickaruk
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Publication number: 20210117598Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: ApplicationFiled: October 21, 2020Publication date: April 22, 2021Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Tirthajyoti SARKAR, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK
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Publication number: 20140203355Abstract: In accordance with an embodiment a structure can include a monolithically integrated trench field-effect transistor (FET) and Schottky diode. The structure can include a first gate trench extending into a semiconductor region, a second gate trench extending into the semiconductor region, and a source region flanking a side of the first gate trench. The source region can have a substantially triangular shape, and a contact opening extending into the semiconductor region between the first gate trench and the second gate trench. The structure can include a conductor layer disposed in the contact opening to electrically contact the source region along at least a portion of a slanted sidewall of the source region, and the semiconductor region along a bottom portion of the contact opening. The conductor layer can form a Schottky contact with the semiconductor region.Type: ApplicationFiled: March 24, 2014Publication date: July 24, 2014Applicant: Fairchild Semiconductor CorporationInventors: Christopher Boguslaw Kocon, Steven Sapp, Paul Thorup, Dean Probst, Robert Herrick, Becky Losee, Hamza Yilmaz, Christopher Lawrence Rexer, Daniel Calafut
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Patent number: 8686493Abstract: A semiconductor structure includes a monolithically integrated trench FET and Schottky diode. The semiconductor structure further includes a plurality of trenches extending into a semiconductor region. A stack of gate and shield electrodes are disposed in each trench. Body regions extend over the semiconductor region between adjacent trenches, with a source region extending over each body region. A recess having tapered edges extends between every two adjacent trenches from upper corners of the two adjacent trenches through the body region and terminating in the semiconductor region below the body region. An interconnect layer extends into each recess to electrically contact tapered sidewalls of the source regions and the body regions, and to contact the semiconductor region along a bottom of each recess to form a Schottky contact therebetween.Type: GrantFiled: September 30, 2008Date of Patent: April 1, 2014Assignee: Fairchild Semiconductor CorporationInventors: Paul Thorup, Christopher Lawrence Rexer
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Patent number: 8680611Abstract: In accordance with an embodiment a structure can include a monolithically integrated trench field-effect transistor (FET) and Schottky diode. The structure can include a first gate trench extending into a semiconductor region, a second gate trench extending into the semiconductor region, and a source region flanking a side of the first gate trench. The source region can have a substantially triangular shape, and a contact opening extending into the semiconductor region between the first gate trench and the second gate trench. The structure can include a conductor layer disposed in the contact opening to electrically contact the source region along at least a portion of a slanted sidewall of the source region, and the semiconductor region along a bottom portion of the contact opening. The conductor layer can form a Schottky contact with the semiconductor region.Type: GrantFiled: August 30, 2012Date of Patent: March 25, 2014Assignee: Fairchild Semiconductor CorporationInventors: Christopher Boguslaw Kocon, Steven Sapp, Paul Thorup, Dean Probst, Robert Herrick, Becky Losee, Hamza Yilmaz, Christopher Lawrence Rexer, Daniel Calafut
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Patent number: 8669623Abstract: A semiconductor structure which includes a shielded gate FET is formed as follows. A plurality of trenches is formed in a semiconductor region using a mask. The mask includes (i) a first insulating layer over a surface of the semiconductor region, (ii) a first oxidation barrier layer over the first insulating layer, and (iii) a second insulating layer over the first oxidation barrier layer. A shield dielectric is formed extending along at least lower sidewalls of each trench. A thick bottom dielectric (TBD) is formed along the bottom of each trench. The first oxidation barrier layer prevents formation of a dielectric layer along the surface of the semiconductor region during formation of the TBD. A shield electrode is formed in a bottom portion of each trench. A gate electrode is formed over the shield electrode in each trench.Type: GrantFiled: August 27, 2010Date of Patent: March 11, 2014Assignee: Fairchild Semiconductor CorporationInventors: James Pan, Christopher Lawrence Rexer
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Publication number: 20120319197Abstract: In accordance with an embodiment a structure can include a monolithically integrated trench field-effect transistor (FET) and Schottky diode. The structure can include a first gate trench extending into a semiconductor region, a second gate trench extending into the semiconductor region, and a source region flanking a side of the first gate trench. The source region can have a substantially triangular shape, and a contact opening extending into the semiconductor region between the first gate trench and the second gate trench. The structure can include a conductor layer disposed in the contact opening to electrically contact the source region along at least a portion of a slanted sidewall of the source region, and the semiconductor region along a bottom portion of the contact opening. The conductor layer can form a Schottky contact with the semiconductor region.Type: ApplicationFiled: August 30, 2012Publication date: December 20, 2012Inventors: Christopher Boguslaw Kocon, Steven Sapp, Paul Thorup, Dean Probst, Robert Herrick, Becky Losee, Hamza Yilmaz, Christopher Lawrence Rexer, Daniel Calafut
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Publication number: 20120156845Abstract: A method for forming a field effect transistor and Schottky diode includes forming a well region in a first portion of a silicon region where the field effect transistor is to be formed but not in a second portion of the silicon region where the Schottky diode is to be formed. Gate trenches are formed extending into the silicon region. A recessed gate is formed in each gate trench. A dielectric cap is formed over each recessed gate. Exposed surfaces of the well region are recessed to form a recess between every two adjacent trenches. Without masking any portion of the active area, a zero-degree blanket implant is performed to form a heavy body region of the second conductivity type in the well region between every two adjacent trenches.Type: ApplicationFiled: December 13, 2011Publication date: June 21, 2012Applicant: Fairchild Semiconductor CorporationInventors: Christopher Boguslaw Kocon, Steven Sapp, Paul Thorup, Dean Probst, Robert Herrick, Becky Losee, Hamza Yilmaz, Christopher Lawrence Rexer, Daniel Calafut
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Publication number: 20110089432Abstract: An electrical device on a single semiconductor substrate includes: an open base vertical PNP transistor placed in parallel with a wide bandgap, high voltage diode wherein the PNP transistor has a P doped collector region, an N-doped base layer, an N doped buffer layer, and a P doped emitter layer.Type: ApplicationFiled: December 21, 2010Publication date: April 21, 2011Applicant: Fairchild Semiconductor CorporationInventors: Joseph A. Yedinak, Richard L. Woodin, Christopher Lawrence Rexer, Praveen Muraleedharan Shenoy, Kwanghoon Oh, Chongman Yun
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Publication number: 20100320534Abstract: A semiconductor structure which includes a shielded gate FET is formed as follows. A plurality of trenches is formed in a semiconductor region using a mask. The mask includes (i) a first insulating layer over a surface of the semiconductor region, (ii) a first oxidation barrier layer over the first insulating layer, and (iii) a second insulating layer over the first oxidation barrier layer. A shield dielectric is formed extending along at least lower sidewalls of each trench. A thick bottom dielectric (TBD) is formed along the bottom of each trench. The first oxidation barrier layer prevents formation of a dielectric layer along the surface of the semiconductor region during formation of the TBD. A shield electrode is formed in a bottom portion of each trench. A gate electrode is formed over the shield electrode in each trench.Type: ApplicationFiled: August 27, 2010Publication date: December 23, 2010Inventors: James Pan, Christopher Lawrence Rexer
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Publication number: 20090315040Abstract: A method and device for protecting wide bandgap devices from failing during suppression of voltage transients. An improvement in avalanche capability is achieved by placing one or more diodes, or a PNP transistor, across the blocking junction of the wide bandgap device.Type: ApplicationFiled: August 6, 2009Publication date: December 24, 2009Inventors: Joseph A. Yedinak, Richard L. Woodin, Christopher Lawrence Rexer, Praveen Muraleedharan Shenoy, Kwanghoon Oh, Chongman Yun
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Publication number: 20090315083Abstract: A semiconductor structure which includes a trench gate FET is formed as follows. A plurality of trenches is formed in a semiconductor region using a mask. The mask includes (i) a first insulating layer over a surface of the semiconductor region, (ii) a first oxidation barrier layer over the first insulating layer, and (iii) a second insulating layer over the first oxidation barrier layer. A thick bottom dielectric (TBD) is formed along the bottom of each trench. The first oxidation barrier layer prevents formation of a dielectric layer along the surface of the semiconductor region during formation of the TBD.Type: ApplicationFiled: June 20, 2008Publication date: December 24, 2009Inventors: James Pan, Christopher Lawrence Rexer
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Patent number: 7586156Abstract: A wide bandgap device in parallel with a device having a lower avalanche breakdown voltage and a higher forward voltage drop than the wide bandgap device.Type: GrantFiled: July 25, 2007Date of Patent: September 8, 2009Assignee: Fairchild Semiconductor CorporationInventors: Joseph A. Yedinak, Richard L. Woodin, Christopher Lawrence Rexer, Praveen Muraleedharan Shenoy, Kwanghoon Oh, Chongman Yun
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Publication number: 20090111227Abstract: A method for forming a field effect transistor with an active area and a termination region surrounding the active area includes forming a well region in a first silicon region, where the well region and the first silicon region are of opposite conductivity type. Gate trenches extending through the well region and terminating within the first silicon region are formed. A recessed gate is formed in each gate trench. A dielectric cap is formed over each recessed gate. The well region is recessed between adjacent trenches to expose upper sidewalls of each dielectric cap. A blanket source implant is carried out to form a second silicon region in an upper portion of the recessed well region between every two adjacent trenches. A dielectric spacer is formed along each exposed upper sidewall of the dielectric cap, with every two adjacent dielectric spacers located between every two adjacent gate trenches forming an opening over the second silicon region.Type: ApplicationFiled: December 30, 2008Publication date: April 30, 2009Inventors: Christopher Boguslaw Kocon, Steven Sapp, Paul Thorup, Dean Probst, Robert Herrick, Becky Losee, Hamza Yilmaz, Christopher Lawrence Rexer, Daniel Calafut
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Publication number: 20090090966Abstract: A semiconductor structure includes a monolithically integrated trench FET and Schottky diode. The semiconductor structure further includes a plurality of trenches extending into a semiconductor region. A stack of gate and shield electrodes are disposed in each trench. Body regions extend over the semiconductor region between adjacent trenches, with a source region extending over each body region. A recess having tapered edges extends between every two adjacent trenches from upper corners of the two adjacent trenches through the body region and terminating in the semiconductor region below the body region. An interconnect layer extends into each recess to electrically contact tapered sidewalls of the source regions and the body regions, and to contact the semiconductor region along a bottom of each recess to form a Schottky contact therebetween.Type: ApplicationFiled: September 30, 2008Publication date: April 9, 2009Inventors: PAUL THORUP, Christopher Lawrence Rexer
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Patent number: 7504306Abstract: A monolithically integrated field effect transistor and Schottky diode includes gate trenches extending into a semiconductor region. Source regions having a substantially triangular shape flank each side of the gate trenches. A contact opening extends into the semiconductor region between adjacent gate trenches. A conductor layer fills the contact opening to electrically contact: (a) the source regions along at least a portion of a slanted sidewall of each source region, and (b) the semiconductor region along a bottom portion of the contact opening, wherein the conductor layer forms a Schottky contact with the semiconductor region.Type: GrantFiled: April 4, 2006Date of Patent: March 17, 2009Assignee: Fairchild Semiconductor CorporationInventors: Steven Sapp, Hamza Yilmaz, Christopher Lawrence Rexer, Daniel Calafut