Abstract: A method of applying a dielectric coating on a structure array of a component of an electrical device includes applying a first layer of a first dielectric material on a structure array with an atomic layer deposition (ALD) process. The structure array is formed on a substrate and has a plurality of features, each of the plurality of features having an aspect ratio of at least 1:1.

Abstract: A method of applying a dielectric coating on a structure array of a component of an electrical device includes applying a first layer of a first dielectric material on a structure array with an atomic layer deposition (ALD) process or a spin-on cladding process. The structure array has a plurality of features. The method may include applying a second layer of a second dielectric material on the first layer with an evaporation deposition process, a physical vapor deposition process (PVD), or a flux-controlled chemical vapor deposition (CVD) process. The first layer has a first thickness and the second layer has a second thickness that is greater than the first thickness.