Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.

Abstract: A battery protection circuit includes: a plurality of pack terminals configured to connect a battery module to an external device; a first fuse element located on a current path between the battery module and the pack terminals to block a current flow between the battery module and the pack terminals depending on a voltage applied to a control terminal thereof; a first integrated circuit configured to include a first input terminal and control a voltage outputted to the control terminal of the first fuse element depending on a voltage applied to the first input terminal; and a plurality of thermistors connected in series between a positive electrode of the battery module and a first input terminal of the first integrated circuit and having resistance that is varied depending on a temperature of a corresponding cell among a plurality of cells constituting the battery module.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.

Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes and including first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces, a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer disposed on the first and second surfaces, a second external electrode including a 2-1-th electrode layer disposed on the fourth surface, and a 2-2-th electrode layer disposed on the first and second surfaces, wherein S1-2>S1-1, T1-2?8 ?m, S2-2>S2-1, and T2-2?8 ?m where based on a cross section of the first and second external electrodes, S1-1, S1-2, S2-1, S2-2 are fractions of an area occupied by glass in the 1-1-th, 1-2-th, 2-1-th, and 2-2-th electrode layers, respectively, T1-2 and T2-2 are thicknesses of the 1-2-th and 2-2-th electrode layers, respectively.

Abstract: An external electrode of a multilayer electronic component includes a base electrode layer and a corner electrode layer disposed at a corner of a body and disposed on the base electrode layer, wherein an area ratio of metal of the corner electrode layer is 90% or more.

Abstract: In an embodiment of the present disclosure, among a plurality of crystal grains included in first electrode layers, crystal grains disposed on an end of the dielectric layer in the second direction and in contact with the second electrode layers are defined as first crystal grains and crystal grains disposed on ends of the internal electrodes in the second direction and in contact with the second electrode layers are defined as second crystal grains, and a growth direction of the first crystal grains and a growth direction of the second crystal grains may be adjusted, so that bonding force between the first electrode layers and the body may be improved.

Abstract: A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.

Abstract: A multilayer electronic component, in which a first external electrode may include a 1-2-th electrode layer including glass, and a 1-3-th electrode layer disposed on the first and second surfaces and a second external electrode may include a 2-2-th electrode layer including glass, and a 2-3-th electrode layer disposed on the first and second surfaces. In cross sections of the first and second external electrodes in the first and second directions, when an area fraction occupied by glass in the 1-2-th electrode layer is S1-2, an area fraction occupied by glass in the 1-3-th electrode layer is S1-3, an area fraction occupied by glass in the 2-2-th electrode layer is S2-2, and an area fraction occupied by glass in the 2-3-th electrode layer is S2-3, S1-2?15%, S1-2?S1-3, S2-2?15%, S2-2>S2-3 are satisfied, thereby preventing cracks and improving moisture resistance reliability.

Abstract: A multilayer electronic component, in which an external electrode may include a base electrode layer disposed on a surface of a body of the multilayer electronic component and connected to internal electrodes of the body, an intermediate electrode layer disposed on a corner of the body and connected to the base electrode layer, a conductive resin layer disposed on the intermediate electrode layer, and a plating layer disposed on the conductive resin layer. The intermediate electrode layer may be in contact with the plating layer on the corner of the body to prevent an increase in ESR while preventing cracks due to mounting through the conductive resin layer.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

Abstract: A LIDAR apparatus is disclosed. A LIDAR apparatus according to an embodiment of the present invention comprises a cover window which covers a transmission path and reception path of laser light and is disposed in the same, and comprises a heating unit which covers a surface of the cover window and is disposed at the same, and a heating control unit connected to the heating unit to control the same.

Abstract: A LIDAR device is disclosed. A LIDAR device according to one embodiment of the present invention comprises: a light transmitting unit for transmitting laser light; a light receiving unit for receiving the laser light received by being reflected from the outside; a scanner including a transmitting mirror unit that has a reflective surface for reflecting the laser light transmitted from the light transmitting unit and transmitting the same to the outside, and a receiving mirror unit that has a reflective surface for reflecting the laser light reflected from the outside and transmitting the same to the light receiving unit; and an optical path dividing unit disposed in the vicinity of the scanner so as to block, from flowing into the light receiving unit, scattered light of a propagating laser light reflected from the transmitting mirror unit.

Abstract: Disclosed is a light and detection ranging (LiDAR) system for a vehicle, which includes: a laser generator generating an optical signal having an address signal and a pulse signal; and a plurality of LiDAR sensors connected to an optical fiber bus, in which each of the plurality of LiDAR sensors determines whether the pulse signal of the optical signal is received according to the address signal of the optical signal.

Abstract: A distance detection sensor includes a current-to-voltage converter configured to convert a current corresponding to a detection signal reflected from a target to a voltage, an amplifier configured to amplify the converted voltage, a comparator configured to compare an output value of the amplifier with a reference value to generate a receive pulse, a reference value selector configured to select any one of a plurality of reference values as the reference value, and a time-to-digital converter configured to calculate time-of-light (TOF) time in response to the receive pulse output from the comparator. The reference value selector continuously changes different reference values respectively corresponding continuous receive pulses.

Abstract: A battery protection circuit includes: a plurality of pack terminals configured to connect a battery module to an external device; a first fuse element located on a current path between the battery module and the pack terminals to block a current flow between the battery module and the pack terminals depending on a voltage applied to a control terminal thereof; a first integrated circuit configured to include a first input terminal and control a voltage outputted to the control terminal of the first fuse element depending on a voltage applied to the first input terminal; and a plurality of thermistors connected in series between a positive electrode of the battery module and a first input terminal of the first integrated circuit and having resistance that is varied depending on a temperature of a corresponding cell among a plurality of cells constituting the battery module.

Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an inner half adjacent to the active portion and an outer half adjacent to the edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half.

Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately stacked. The dielectric layers contain at least one dielectric grain having a ratio of a long axis to a short axis that is 3.5 or more. The internal electrodes contain a ceramic component containing a grain growth adjusting ingredient for dielectric grains. Each dielectric layer includes interfacial portions adjacent to the internal electrodes and a central portion disposed between the interfacial portions, and concentrations of the grain growth adjusting ingredient in the interfacial portions and the central portion are different from each other.