Patents by Inventor Chun-Chi Lee

Chun-Chi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220253102
    Abstract: A notebook computer includes a base, a first display device, a second display device and a camera. A first side of the first display device is pivotally connected to the base and the second display device is pivotally connected to a second side of the first display device, wherein the first side is opposite to the second side. The camera is disposed on the second display device. The second display device rotates with respect to the first display device to adjust an angle and a height of the camera.
    Type: Application
    Filed: March 9, 2021
    Publication date: August 11, 2022
    Inventors: Chun-Chi Lin, Szu-Yu Huang, Tong-Ting Wei, Kuan-Wei Lee, Jui-Hsiang Chen
  • Publication number: 20220099618
    Abstract: An electrowetting on dielectric (EWOD) device able to self-detect a movement of a droplet under test includes a detection chip, a power switch module, a detection module, and a determination module. The detection chip includes a channel, several driving electrodes, and a detection electrode. Each driving electrode can couple with the detection electrode to form a driving loop. The power switch module provides one of a first voltage and a second voltage, to rock the droplet along, and a third voltage can also be applied to a specified driving electrode. The detection module computes a capacitance recovery time of the detection voltage changing from a peak voltage to a reference voltage in one cycle of a voltage period. The determination module confirms a position of the droplet based on the recovery time. A method for a self-detecting a movement of the droplet in EWOD device is also disclosed.
    Type: Application
    Filed: September 29, 2021
    Publication date: March 31, 2022
    Inventors: HUNG-YUN HUANG, CHIH LUN HUANG, JEN-CHIN HSIEH, CHUN-CHI LEE, YU-FU WENG
  • Publication number: 20220097052
    Abstract: A heating structure includes a first cover plate, a second cover plate, a conductive portion; and two first driving electrodes. The conductive portion is connected to the first cover plate and the second cover plate. The first cover plate, the conductive portion, and the second cover plate cooperatively define a channel for carrying a microbead. The channel includes a flow path. The two first driving electrodes are electrically connected to the conductive portion to energize the conductive portion. When the conductive portion is energized, a driving force is generated to drive the microbead away from a sidewall of the conductive portion to the flow path. A nucleic acid detection kit with the detection chip, and a nucleic acid detection device with the nucleic acid detection kit are also disclosed.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 31, 2022
    Inventors: HUNG-YUN HUANG, CHIH LUN HUANG, JEN-CHIN HSIEH, CHUN-CHI LEE, YU-FU WENG
  • Publication number: 20210358435
    Abstract: A method applied to a display device for displaying images divides the display device into a first display area and a second display area. The method drives the first display area and the second display area to display images during a first driving period, and during a second driving period drives the first display area to keep displaying a most recent image. During the second driving period at least a part of the second display area is driven to display a white image, and the overall second display area is driven to accept and recognize fingerprints if and when a recognition-start signal is received during the second driving period. The first and second display areas are driven to again display images when a recognition-end signal is received during a third driving period. The display device is also provided.
    Type: Application
    Filed: June 18, 2020
    Publication date: November 18, 2021
    Inventors: KUO-SHENG LEE, CHUN-CHI LEE, WEN-PO KO
  • Publication number: 20210188652
    Abstract: A method for recovering lithium is provided. The method includes the following steps. A lithium-containing solution is provided. A manganese oxide adsorbent is immersed in the lithium-containing solution, and a reducing agent is added to carry out an adsorption reaction, and the manganese oxide adsorbent is immersed in a solution containing an oxidizing agent to carry out a desorption reaction.
    Type: Application
    Filed: August 7, 2020
    Publication date: June 24, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Li-Ching Chung, Guan-You Lin, Yi Ting Wang, Chun-Chi Lee, Tzu Yu Cheng, Shing-Der Chen, Kuan-Foo Chang, Hsin Shao
  • Patent number: 10522585
    Abstract: A semiconductor device includes a substrate, a conductive layer, a transparent layer, a transparent hard mask layer, a carrier, and a device layer. The substrate has a first surface and a second surface opposite to each other. The conductive layer is disposed on the first surface of the substrate. The transparent layer is disposed on the conductive layer. The transparent hard mask layer is disposed on the transparent layer, in which the substrate has an etch selectivity with respect to the transparent hard mask layer. The device layer is disposed between the carrier and the second surface of the substrate, in which various portions of the device layer are respectively exposed by various through holes which pass through the transparent hard mask layer, the transparent layer, the conductive layer, and the substrate.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: December 31, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Fang Yang, Yi-Hung Chen, Keng-Ying Liao, Yi-Jie Chen, Shih-Hsun Hsu, Chun-Chi Lee
  • Publication number: 20190195757
    Abstract: Provided is a detection method for heavy metal ions that includes the following steps. A waste water is flowed through an ion-imprinted polymer tube for adsorbing at least two kinds of target heavy metal ions. The ion-imprinted polymer tube is rinsed to remove a non-target object from the ion-imprinted polymer tube. The target heavy metal ions in the ion-imprinted polymer tube are desorbed by using an acid liquid. An electrochemical method is performed to detect concentrations of the target heavy metal ions.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Chi Lee, Shu-Kang Hsu, Min-Shan Wu, Yi-Ting Wang, Ting-Ting Chang, Kuan-Foo Chang
  • Publication number: 20180301501
    Abstract: A semiconductor device includes a substrate, a conductive layer, a transparent layer, a transparent hard mask layer, a carrier, and a device layer. The substrate has a first surface and a second surface opposite to each other. The conductive layer is disposed on the first surface of the substrate. The transparent layer is disposed on the conductive layer. The transparent hard mask layer is disposed on the transparent layer, in which the substrate has an etch selectivity with respect to the transparent hard mask layer. The device layer is disposed between the carrier and the second surface of the substrate, in which various portions of the device layer are respectively exposed by various through holes which pass through the transparent hard mask layer, the transparent layer, the conductive layer, and the substrate.
    Type: Application
    Filed: April 17, 2017
    Publication date: October 18, 2018
    Inventors: Yi-Fang Yang, Yi-Hung Chen, Keng-Ying Liao, Yi-Jie Chen, Shih-Hsun Hsu, Chun-Chi Lee
  • Publication number: 20140085402
    Abstract: A method executed by a conference terminal for processing videos from other conference terminals includes the following steps. Capture a video in front of the video camera. Extracting sub-images of the projection screen and the indicator from each video frame. Determining a size of the sub-image of the projection screen and size of the sub-image of the indicator. Determining distances between one fixed spot of the indicator and two reference spots of the projection screen in each video frame. Receiving from each other conference terminal the sub-image of the indicator, the sizes of the sub-images of the indicator and the projection screen, and the distances. Scaling the sub-image of each indicator from each of the other conference terminals and the distances from each other conference terminals. And positioning each scaled sub-image of the indicator to the projection screen according to the scaled distances to obtain a combined image.
    Type: Application
    Filed: August 21, 2013
    Publication date: March 27, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HON-DA WANG, TENG-SHUO CHANG, CHUN-CHI LEE
  • Patent number: 8654675
    Abstract: An interface detection device in electronic communication with a network tester to receive network packets includes a plurality of local area network (LAN) interfaces, a signal control unit and a path distribution unit. The LAN interfaces are in electronic communication with the network tester and are electrically connected in pairs. The signal control unit provides preset test data for the LAN interfaces and controls the LAN interfaces to generate corresponding verification data. The signal control unit compares the verification data with the test data, and controls the path distribution unit to automatically figure out corresponding transmission paths. The LAN interfaces are electronically communicating with each other through the connected LAN interfaces and the transmission paths to transfer the network packets.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: February 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chun-Chi Lee
  • Patent number: 8300539
    Abstract: A switching device transmits a link code word to the partner device by one Ethernet port of the switching device for automatic negotiation with a partner device. The switching device receives a first response link code word, changes the link code word, transmits the changed link code word to the partner device, and receives a second response link code word. The switching device determines the Ethernet port of the switching device experiences loopback upon the condition that the first response link code word is unequal to the second response link code.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: October 30, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chun-Chi Lee
  • Publication number: 20120257537
    Abstract: An interface detection device in electronic communication with a network tester to receive network packets includes a plurality of local area network (LAN) interfaces, a signal control unit and a path distribution unit. The LAN interfaces are in electronic communication with the network tester and are electrically connected in pairs. The signal control unit provides preset test data for the LAN interfaces and controls the LAN interfaces to generate corresponding verification data. The signal control unit compares the verification data with the test data, and controls the path distribution unit to automatically figure out corresponding transmission paths. The LAN interfaces are electronically communicating with each other through the connected LAN interfaces and the transmission paths to transfer the network packets.
    Type: Application
    Filed: August 30, 2011
    Publication date: October 11, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHUN-CHI LEE
  • Publication number: 20110255419
    Abstract: A switching device transmits a link code word to the partner device by one Ethernet port of the switching device for automatic negotiation with a partner device. The switching device receives a first response link code word, changes the link code word, transmits the changed link code word to the partner device, and receives a second response link code word. The switching device determines the Ethernet port of the switching device experiences loopback upon the condition that the first response link code word is unequal to the second response link code.
    Type: Application
    Filed: May 4, 2010
    Publication date: October 20, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chun-Chi LEE
  • Patent number: 7285434
    Abstract: A semiconductor package comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an active surface, a back surface opposite to the active surface, an optical component disposed on the active surface, and a plurality of pads disposed on the active surface and electrically connected to the optical component; the pad extension traces are electrically connected to the pads; the via holes are formed through the chip and electrically connected to the pad extension traces; the lid is attached on the active surface of the chip; and the plurality of metal traces are disposed on the back surface of the chip, electrically connected to the plurality of via holes, and defines a plurality of solder pads thereon.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: October 23, 2007
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo Chung Yee, Chun Chi Lee
  • Patent number: 7186110
    Abstract: An apparatus for making wedged plate has an extruder to provide melted plastic material. A die head has a channel with an inlet and an outlet. The inlet of the die head is connected to an outlet of the extruder. The outlet of the die head has a thick side and a narrow side. A rolling device has two rollers and a space between the rollers. The space has a thick portion and a narrow portion at opposite sides. The space of the rolling device is aligned with the outlet of the die head, so that the plastic material flows into the space of the rolling device via the die head and is rolled by the rollers. A cutting device is arranged behind the rolling device to cut the rolled plastic material to get wedged plates.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: March 6, 2007
    Inventors: Francis Chung Hwa Pan, John Chungteh Pan, Chun-Chi Lee, Chih-Lung Chen
  • Publication number: 20060186570
    Abstract: An apparatus for making substrates is consisted of a substrate providing unit, a cooler, a skin layer, a rolling unit and a cutting unit in sequence. The substrate providing unit provides a molten substrate material with a predetermined width. The cooler, which is a conveying unit, solidifies the substrate material and conveys it to the rolling unit. The skin layer providing unit provides a molten skin layer onto the substrate material. The rolling unit rolls the molten skin layer and the solidified substrate material and forms a predetermined surface profile on the skin layer at the same time. The cutting unit cuts the substrate material and the skin layer to have a plurality of the substrates.
    Type: Application
    Filed: March 4, 2005
    Publication date: August 24, 2006
    Inventors: Francis Chung Hwa Pan, John Chungteh Pan, Chun-Chi Lee
  • Patent number: 7064428
    Abstract: A wafer-level package structure, applicable to a flip-chip arrangement on a carrier, which comprises a plurality of contact points, is described. This wafer-level package structure is mainly formed with a chip and a conductive layer. The conductive layer is arranged on the bonding pads of the chip as contact points. The conductive layer can further be arranged at a region outside the bonding pads on the chip as a heat sink to enhance the heat dissipation ability of the package.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: June 20, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee, Yu-Chen Chou, Tsung-Hua Wu, Su Tao
  • Publication number: 20060078744
    Abstract: A substrate has a substrate member, which is made of a polar material, such as Polymethyl methacrylate (PMMA), Methyl methacrylate/Styrene copolymer (MS) or Polycarbonate (PC), having a first side and a second side. On the fist side and the second side of the substrate member provided with an insulating layers respectively, wherein the insulating layers are made of a non-polar material with a low water absorption, such as Cyclic Olefin Polymer (COP) or Cyclic Olefin Copolymer (COC). The water absorption of COP or COC is less than the water absorption of PMMA, MS or PC to prevent the substrate member from warping while the substrate is heated at a single side. Two adhesive layers, which is made of a material with a chemical structure with a non-polar segment and a polar segment, such as olefin/acrylate copolymer, to bond the insulating layers on the substrate member.
    Type: Application
    Filed: November 23, 2005
    Publication date: April 13, 2006
    Inventors: Tsung-Neng Liao, Francis Pan, John Pan, Chun-Chi Lee, Chih-Lung Chen
  • Publication number: 20060062868
    Abstract: An apparatus for making wedged plate has an extruder to provide melted plastic material. A die head has a channel with an inlet and an outlet. The inlet of the die head is connected to an outlet of the extruder. The outlet of the die head has a thick side and a narrow side. A rolling device has two rollers and a space between the rollers. The space has a thick portion and a narrow portion at opposite sides. The space of the rolling device is aligned with the outlet of the die head, so that the plastic material flows into the space of the rolling device via the die head and is rolled by the rollers. A cutting device is arranged behind the rolling device to cut the rolled plastic material to get wedged plates.
    Type: Application
    Filed: September 17, 2004
    Publication date: March 23, 2006
    Inventors: Francis Pan, John Pan, Chun-Chi Lee, Chih-Lung Chen
  • Patent number: 6989326
    Abstract: A method of forming bumps on the active surface of a silicon wafer. A first under-bump metallic layer is formed over the active surface of the wafer. A second under-bump metallic layer is formed over the first under-bump metallic layer. A portion of the second under-bump metallic layer is removed to expose the first under-bump metallic layer. A plurality of solder bumps is implanted onto the second under-bump metallic layer. The exposed first under-bump metallic layer is removed so that only the first under-bump metallic layer underneath the second under-bump metallic layer remains.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: January 24, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee