Patents by Inventor Chun-Fu Chen

Chun-Fu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7361601
    Abstract: A method for improving accuracy of determining polish endpoint of chemical mechanical polish (CMP) process is provided. The method is performed before the CMP process. First, a test wafer with a to-be-polished layer and a material layer under the to-be-polished layer is provided. Then, a test beam with a wavelength is provided to irradiate the test wafer. The CMP process is performed to the test wafer to remove the to-be-polished layer until the material layer is exposed while the reflection of the test beam during the polish process is continuously detected. The reflection tendency is detected when the to-be-polished layer is to be completely removed and when the CMP process reaches the interface between the to-be-polished layer and the material layer. If the reflection tendency is gradually weakened, the test beam with the wavelength is chosen for the subsequent polish process.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: April 22, 2008
    Assignee: MACRONIX International Co., Ltd.
    Inventors: Chun-Fu Chen, Chi-Tung Huang, Yung-Tai Hung, Chun-Chung Huang
  • Publication number: 20070269985
    Abstract: A chemical mechanical polishing method is disclosed. The method includes forming a film on a wafer having at least one trench structure thereon; polishing the surface of the film by providing a polishing composition to provide a first polished surface; rinsing the first polished surface with a rinse composition to provide a rinsed surface; and polishing the rinsed surface by providing a second polishing composition to provide a second polished surface.
    Type: Application
    Filed: May 18, 2006
    Publication date: November 22, 2007
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Chun-Fu Chen, Yung-Tai Hung, Chi-Tung Huang, Yun-Chi Yang
  • Publication number: 20070202702
    Abstract: A chemical mechanical polishing method is disclosed. The method includes forming a film on a wafer having at least one trench structure thereon; polishing the surface of the film by providing a polishing composition to provide a first polished surface; rinsing the first polished surface with a rinse composition to provide a rinsed surface; and polishing the rinsed surface by providing a second polishing composition to provide a second polished surface.
    Type: Application
    Filed: February 28, 2006
    Publication date: August 30, 2007
    Inventors: Chun Fu Chen, Yung Hung, Yun Yang
  • Patent number: 7199018
    Abstract: The present invention is related to methods of processing a semiconductor device. A plasma vapor deposition process is used to fill a trench with an oxide layer, wherein sharp corners are formed by the oxide layer. A pre-planarization sputtering process is performed to reduce the oxide layer corner sharpness. A planarization process is performed using polishing.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: April 3, 2007
    Assignee: Macronix International Co., Ltd.
    Inventors: Yung-Tai Hung, Chun-Fu Chen, Yun-Chi Yang, Chin-Hsiang Lin, Chen-Wei Liao
  • Publication number: 20070054471
    Abstract: An alignment mark is fabricated containing a mark portion and a trench structure. The trench structure surrounds the mark portion and is at a distance from the mark portion. The mark portion has a plurality of notches. Due to the erosion effect caused by the trench structure, it can prevent the residue leave in the notches of the alignment mark.
    Type: Application
    Filed: August 26, 2005
    Publication date: March 8, 2007
    Inventors: Chun-Fu Chen, Chi-Tung Huang, Yung-Tai Hung
  • Publication number: 20060283838
    Abstract: A method for improving accuracy of determining polish endpoint of chemical mechanical polish (CMP) process is provided. The method is performed before the CMP process. First, a test wafer with a to-be-polished layer and a material layer under the to-be-polished layer is provided. Then, a test beam with a wavelength is provided to irradiate the test wafer. The CMP process is performed to the test wafer to remove the to-be-polished layer until the material layer is exposed while the reflection of the test beam during the polish process is continuously detected. The reflection tendency is detected when the to-be-polished layer is to be completely removed and when the CMP process reaches the interface between the to-be-polished layer and the material layer. If the reflection tendency is gradually weakened, the test beam with the wavelength is chosen for the subsequent polish process.
    Type: Application
    Filed: June 21, 2005
    Publication date: December 21, 2006
    Inventors: Chun-Fu Chen, Chi-Tung Huang, Yung-Tai Hung, Chun-Chung Huang
  • Publication number: 20050003668
    Abstract: The present invention is related to methods of processing a semiconductor device. A plasma vapor deposition process is used to fill a trench with an oxide layer, wherein sharp corners are formed by the oxide layer. A pre-planarization sputtering process is performed to reduce the oxide layer corner sharpness. A planarization process is performed using polishing.
    Type: Application
    Filed: April 30, 2004
    Publication date: January 6, 2005
    Inventors: Yung-Tai Hung, Chun-Fu Chen, Yun-Chi Yang, Chin-Hsiang Lin, Chen-Wei Liao
  • Patent number: 4213134
    Abstract: A circuit and method for the display of a high frequency periodic signal on a display (21) having a maximum response frequency less than the periodic signal frequency includes a signal period counter (12) for counting the number of periods in the high frequency periodic signal, a sampling control counter (16) for counting at a frequency substantially greater than the frequency of the high frequency periodic signal, and a comparator (17) for comparing the counts in the signal period counter (12) and the sampling control counter (16) and indicating a match thereof. When a match count is indicated, some electrical parameter of the high frequency periodic signal is sampled and held by a sample and hold circuit (20) until the next match count is indicated, thereby accurately reproducing the high frequency periodic signal at another frequency in a range of frequencies from zero up to and including the maximum response frequencies of the display.
    Type: Grant
    Filed: February 26, 1979
    Date of Patent: July 15, 1980
    Assignee: The University of Akron
    Inventor: Chun-Fu Chen
  • Patent number: 4091236
    Abstract: Disclosed is an automatically tunable notch filter and method for suppression of acoustical feedback in an audio signal. The apparatus includes a selectively tunable notch filter having a center frequency which is variable over at least a substantial portion of the audio frequency spectrum. The apparatus receives an audio signal which is substantially non-periodic in the absence of acoustical feedback and substantially periodic with an instantaneous dominant frequency in the presence of the same. The duration of successive periods are monitored and compared by an up/down counter to determine whether the audio input signal is substantially periodic and to determine the instantaneous dominant frequency of such audio signal. Upon detection of an audio signal which is substantially periodic, the notch filter is tuned to the instantaneous dominant frequency so as to suppress the acoustical feedback.
    Type: Grant
    Filed: September 7, 1976
    Date of Patent: May 23, 1978
    Assignee: The University of Akron
    Inventor: Chun-Fu Chen
  • Patent number: 3979774
    Abstract: Disclosed is a digital control system and method for synchronizing audio-visual equipment for the presentation of film slides with corresponding sound narrations. As the film passes through conventional projecting equipment each slide receives a sequential address. Simultaneously, the sound narrations, passing through the audio equipment on a continuous media, receive identification numbers from a pulse generating means indicative of the outset of each narration, which numbers are stored in the system correlated with the proper sequential address. Means are further provided for skipping ahead or back to desired film slides rapidly, without loss of synchronization between the audio and visual portions of the program.
    Type: Grant
    Filed: March 13, 1974
    Date of Patent: September 7, 1976
    Assignee: The University of Akron
    Inventors: Chun-Fu Chen, Duane O. Hague, Jr.