Abstract: A method for manufacturing a capacitor structure is provided. A substrate having a first side and a second side opposite to the first side is provided. A plurality of first trenches are formed on the first side. A first capacitor is formed extending along the first side and into the first trenches. A plurality of second trenches are formed on the second side. A second capacitor is formed extending along the second side and into the second trenches.

Abstract: A semiconductor structure includes an interposer substrate having an upper surface, a lower surface opposite to the upper surface, and a device region. A first redistribution layer is formed on the upper surface of the interposer substrate. A guard ring is formed in the interposer substrate and surrounds the device region. At least a through-silicon via (TSV) is formed in the interposer substrate. An end of the guard ring and an end of the TSV that are near the upper surface of the interposer substrate are flush with each other, and are electrically connected to the first redistribution layer.

Abstract: The present disclosure provides a method for treating arthritis by using a stem cell preparation. The stem cell preparation of the present disclosure can effectively delay cartilage degeneration caused by arthritis, and it is confirmed by whole blood analysis and blood biochemical analysis that the stem cell preparation in the form of three-dimensional stem cell spheres provides a safe treatment for arthritis. The present disclosure also provides a method for preparing the stem cell preparation.

Abstract: An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a connector, an electronic component, and a heat sink. The connector has at least one conductive structure and at least one first heat dissipation structure. The at least one conductive structure and the at least one first heat dissipation structure are physically separated and electrically insulated from each other. The electronic component is electrically connected to the at least one conductive structure. The heat sink is connected to the at least one first heat dissipation structure. The heat sink and the electronic component are disposed on opposite sides of the connector.

Abstract: A capacitor structure comprises a substrate having a first side and a second side opposite to the first side; a plurality of first trenches formed on the first side of the substrate; a plurality of second trenches formed on the second side of the substrate; a first capacitor extending along the first side and into the first trenches; and a second capacitor extending along the second side and into the second trenches.

Abstract: An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.

Abstract: An electronic device including a connection element is provided. The connection element includes a first metal layer, a first insulation layer, and a second insulation layer. The first insulation layer is disposed on the first metal layer and has a first hole and a second hole. The second insulation layer is disposed on the first insulation layer. The first hole exposes a portion of the first metal layer, and the second insulation layer extends into the second hole. A method of fabricating an electronic device is also provided.

Abstract: A semiconductor structure, including a substrate and multiple chips, is provided. The chips are stacked on the substrate. Each of the chips has a first side and a second side opposite to each other. Each of the chips includes a transistor adjacent to the first side and a storage node adjacent to the second side. Two adjacent chips are bonded to each other. The transistor of one of the two adjacent chips is electrically connected to the storage node of the other one of the two adjacent chips to form a memory cell.

Abstract: A structure to apply flexing to an object to test resilience to being bent has a first portion and a second portion. The structure includes a base, a rotating member, a pressing plate, and an adjusting assembly. The base defines first and second receiving grooves, and the second receiving groove receives the first portion. The rotating member on the base is partially received in the first receiving groove. An abutting surface of the rotating member is recessed to form a third receiving groove which receives the second portion. The pressing plate on the base presses against the first portion. The adjusting assembly controls the rotating member to rotate towards the base about a desired angle, thereby causing the second portion to be bent with respect to the first portion.

Abstract: A data processing method includes the following steps: generating a machine-learning parameter and obtaining a storage parameter code, wherein the storage parameter code corresponds to a storage space; receiving the machine-learning parameter and the storage parameter code, and storing the machine-learning parameter in the storage space according to the storage parameter code, and generating an event notification when the machine-learning parameter is modified; and generating a loading request according to the event notification, and the loading request is used to request the modified machine-learning parameter, wherein after the loading request is generated, the modified machine-learning parameter is downloaded from the storage space corresponding to the storage parameter code.

Abstract: A semiconductor structure, including a substrate and multiple chips, is provided. The chips are stacked on the substrate. Each of the chips has a first side and a second side opposite to each other. Each of the chips includes a transistor adjacent to the first side and a storage node adjacent to the second side. Two adjacent chips are bonded to each other. The transistor of one of the two adjacent chips is electrically connected to the storage node of the other one of the two adjacent chips to form a memory cell.

Abstract: A vacuum suction pen to take reliable hold of objects of different shapes without manual contact includes a holder with an air duct penetrating the holder. A first sleeve is sleeved on one end of the holder, and a first adsorption module is movably arranged on the first sleeve to move along a first direction. The first suction nozzle can move in the horizontal direction, the second nozzle can move in the vertical direction, and the third suction nozzle can rotate around the holder. The positions and relative positions of each suction nozzle on the product to be lifted and manipulated can be adjusted, so as to more accurately locate the center of gravity of products with irregular shapes or of uneven materials, and so as to secure a stable hold on the objects.

Abstract: A process operating system includes a process control platform, a process operating platform and an endpoint task robot. The process control platform is configured to receive operation information, extract a task from the operation information using a semantic analysis method, and publish the task. The process operating platform is configured to receive the task and store the task in a task queue. After receiving the task, the process operating platform defines a processing flow based on the task, and sorts the order of the task in the task queue. The endpoint task robot is configured to automatically obtain the task from the process operation platform, executes the task according to the processing flow. It then writes the execution result into the log queue and transmits the execution result to the process control platform.

Abstract: The present invention provides a respiratory mask comprising a nose cushion assembly. The nose cushion assembly comprises a base body and a buffering piece. The base body has a base intake portion, a base connection portion, and an air routing piece disposed at the inside of the base body and having a partitioning wall and a wall connection piece. The inside of the partitioning wall encloses an air intake zone. The wall connection piece is disposed outside the partitioning wall and connects with the base intake portion. Between the partitioning wall and the base intake portion there is defined an air outtake zone. The air intake zone is approximately at the center of the base intake portion. The buffering piece connects with the base connection portion and encloses a nose containing room, which in turn connects with the inside of the base body.

Abstract: A semiconductor structure includes an interposer substrate having an upper surface, a lower surface opposite to the upper surface, and a device region. A first redistribution layer is formed on the upper surface of the interposer substrate. A guard ring is formed in the interposer substrate and surrounds the device region. At least a through-silicon via (TSV) is formed in the interposer substrate. An end of the guard ring and an end of the TSV that are near the upper surface of the interposer substrate are flush with each other, and are electrically connected to the first redistribution layer.

Abstract: A method includes: receiving a composite substrate including a first region and a second region, the composite substrate comprising a semiconductor substrate and an insulator layer over the semiconductor substrate; bonding a silicon layer to the composite substrate; depositing a capping layer over the silicon layer; forming a trench through the capping layer, the silicon layer and the insulator layer, the trench exposing a surface of the semiconductor substrate in the first region; growing an initial epitaxial layer in the trench; removing the capping layer to form an epitaxial layer from the silicon layer and the initial epitaxial layer; forming a transistor layer over the epitaxial layer, the transistor layer including a first transistor and a second transistor in the first region and the second region, respectively; and forming an interconnect layer over the transistor layer and electrically coupling the first transistor to the second transistor.

Abstract: The disclosure provides a method for driving an OLED touch-and-display device, a driving circuit, and an OLED touch-and-display device. The method includes: generating gate driving signals that are sequentially shifted based on the first clock signal (GCK); sequentially applying the gate driving signals that are sequentially shifted to the plurality of GLs; writing display data in a display driving period for each row of pixels, to the row of pixels, wherein a time length of the display driving period depends on a corresponding gate driving signal and is smaller than the clock cycle; and for a display driving period for each of at least one row of pixels, setting a touch detection period corresponding to the display driving period or corresponding to the display driving period for previous row of pixels at least partially overlapping with the display driving period in time.

Abstract: An oscillating positive expiratory pressure device includes a housing, a top cover, and an oscillating unit. The housing includes a bottom wall and a surrounding wall. The bottom wall has an inclined enclosing surface extending downwardly and terminating at an opening. The oscillating unit is swingably connected to and disposed within the housing. The oscillating unit includes a swing member, and first and second weighting pieces. The swing member includes a swing arm, and first and second swing blocks connected to the swing arm. The first weighting piece is carried on the first swing block. The second weighting piece is carried on the second swing block. The swing arm is swingable to move the second swing block to block and unblock the opening.

Abstract: A vehicular advertisement playing device includes a frame, first display unit, second display unit, first gas guide unit, second gas guide unit, casing, link unit and playing control unit. The frame is mounted on a vehicle. The playing control unit and link unit send advertisement playing data to the first display unit and second display unit for playing. The playing control unit drives the first gas guide unit and second gas guide unit to carry out heat dissipation. Therefore, the vehicle plays advertisements ubiquitously, instantly, and thus efficiently.

Abstract: A method of forming a structure having a coating layer includes the following steps: providing a substrate; coating a fluid on the surface of the substrate, where the fluid includes a carrier and a plurality of silicon-containing nanoparticles; and performing a heating process to remove the carrier and convert the silicon-containing nanoparticles into a silicon-containing layer, a silicide layer, or a stack layer including the silicide layer and the silicon-containing layer.