Abstract: A calibration method and a calibration apparatus for a knob applicable to a touch panel are provided. The knob includes at least one sensing pad. The calibration method includes: obtaining sensed position(s) of each sensing pad by sensing a position of the sensing pad through the touch panel; and calculating a position of a center of the knob by using a formula of a radius of a circumscribed circle according the sensed position(s) of each sensing pad.

Abstract: A touch signal processing method, for a touch display integrated device including a plurality of touch display units, is provided. Each of the plurality of touch display units includes a touch microcontroller unit (MCU). The touch signal processing method includes sensing, by a sensing module of each of the plurality of touch display units, a physical area corresponding to each of the plurality of touch display units to generate a plurality of sensing raw data; passing, by an (n?1)-th touch MCU of the plurality of touch display units, a plurality of overlap sensing raw data corresponding to an overlap area of the physical area to an n-th touch MCU; and determining, by each of the touch MCU of the plurality of touch display units, a coordinate information corresponding to a touch location of a processing area.

Abstract: A calibration method and a calibration apparatus for a knob applicable to a touch panel are provided. The knob includes at least one sensing pad. The calibration method includes: obtaining sensed position(s) of each sensing pad by sensing a position of the sensing pad through the touch panel; and calculating a position of a center of the knob by using a formula of a radius of a circumscribed circle according the sensed position(s) of each sensing pad.

Abstract: A touch screen includes a touch panel including a plurality of touch blocks, and a knob, being touch-sensitive and rotatable, disposed on top of the touch panel. An area of the touch panel not covered with the knob is defined as a first area, an area of the touch panel covered with the knob is defined as a second area, and touch blocks belonging to both the first area and the second area are defined as overlapped blocks. Sense signals associated with the overlapped blocks are de-emphasized.

Abstract: A knob device is applicable to a touch panel. The knob device includes a knob cover, a plurality of sensing pads and a rotation sensing element. The plurality of sensing pads are fixedly arranged on the touch panel. A gap is form between two sensing pads. The plurality of sensing pads and gaps are distributed in a ring area around a center of an orthographic projection of the knob cover. The rotation sensing element is connected to the knob cover. When the knob cover is turned to be rotated, the rotation sensing element is rotated synchronously. When a user touches the knob device and the rotation sensing element overlaps one of the plurality of sensing pads, the touch panel generates a rotation sensing signal in response to a location of the rotation sensing element.

Abstract: A touch signal processing method, for a touch display integrated device including a plurality of touch display units, is provided. Each of the plurality of touch display units includes a touch microcontroller unit (MCU). The touch signal processing method includes sensing, by a sensing module of each of the plurality of touch display units, a physical area corresponding to each of the plurality of touch display units to generate a plurality of sensing raw data; passing, by an (n?1)-th touch MCU of the plurality of touch display units, a plurality of overlap sensing raw data corresponding to an overlap area of the physical area to an n-th touch MCU; and determining, by each of the touch MCU of the plurality of touch display units, a coordinate information corresponding to a touch location of a processing area.

Abstract: A knob device is applicable to a touch panel. The knob device includes a knob cover, a plurality of sensing pads and a rotation sensing element. The plurality of sensing pads are fixedly arranged on the touch panel. A gap is form between two sensing pads. The plurality of sensing pads and gaps are distributed in a ring area around a center of an orthographic projection of the knob cover. The rotation sensing element is connected to the knob cover. When the knob cover is turned to be rotated, the rotation sensing element is rotated synchronously. When a user touches the knob device and the rotation sensing element overlaps one of the plurality of sensing pads, the touch panel generates a rotation sensing signal in response to a location of the rotation sensing element.

Abstract: A knob device is applicable to a touch panel. The knob device includes a knob cover; and a rotation sensing element. The rotation sensing element includes a base and a plurality of sensing pads connected to the knob cover. The rotation sensing element is arranged between the touch panel and the knob cover. The base is connected to the knob cover. When a user touches the knob device, the touch panel generates a rotation sensing signal in response to a location of the plurality of sensing pads. An orthographic projection of the knob cover on the touch panel is divided into a plurality of parts, the plurality of parts are distributed radially from a center of the orthographic projection of the knob cover, each sensing pad is located in a part and connected to another sensing pad located in another part adjacent to the part.

Abstract: A knob device is applicable to a touch panel. The knob device includes a knob cover; and a rotation sensing element. The rotation sensing element includes a base and a plurality of sensing pads connected to the knob cover. The rotation sensing element is arranged between the touch panel and the knob cover. The base is connected to the knob cover. When a user touches the knob device, the touch panel generates a rotation sensing signal in response to a location of the plurality of sensing pads. An orthographic projection of the knob cover on the touch panel is divided into a plurality of parts, the plurality of parts are distributed radially from a center of the orthographic projection of the knob cover, each sensing pad is located in a part and connected to another sensing pad located in another part adjacent to the part.

Abstract: A knob device is applicable to a touch panel. The touch panel includes a plurality of panel sensors. The knob device includes a knob cover, a sensing pad, a compensation sensor and a switch. The sensing pad is arranged between the knob cover and the touch panel. The switch is configured to selectively connect the sensing pad to the compensation sensor. When a move event of the knob device occurs, the switch is turned on and the sensing pad is electrically connected to the compensate sensor through the switch, such that a feedback loop is generated by the sensing pad, the compensation sensor and the touch panel to change a quantity of electric charge of at least one of the plurality of panel sensors. When a touch and rotation event of the knob device occurs, a location of the sensing pad controls a rotation sensing signal.

Abstract: A cordless clinching tool has a case body, a nail clamping unit, a nail transportation unit, a pushing device, a driving device, and a cell assembly. The case body has a cell engaging portion. The nail clamping unit is mounted in the case body. The nail transportation unit is mounted on a side of the case body and has a nail track. The pushing device is mounted in the case body and pushes the nail clamping unit. The driving device is mounted in the case body and drives the pushing device. The cell assembly is mounted on the cell engaging portion and provides a power for the driving device.

Abstract: A cordless clinching tool has a case body, a nail clamping unit, a nail transportation unit, a pushing device, a driving device, and a cell assembly. The case body has a cell engaging portion. The nail clamping unit is mounted in the case body. The nail transportation unit is mounted on a side of the case body and has a nail track. The pushing device is mounted in the case body and pushes the nail clamping unit. The driving device is mounted in the case body and drives the pushing device. The cell assembly is mounted on the cell engaging portion and provides a power for the driving device.

Abstract: A micro BGA package comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board has a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces between the die-attaching surface and the surface-mounting surface. The package body has a fastener covering and extending around the lateral surfaces of the wiring board for improving the bonding strength between wiring board and die and avoiding delamination. Preferably, the wiring board has a plurality of support bars for supporting the wiring board during molding.

Abstract: A micro BGA package comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board has a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces between the die-attaching surface and the surface-mounting surface. The package body has a fastener covering and extending around the lateral surfaces of the wiring board for improving the bonding strength between wiring board and die and avoiding delamination. Preferably, the wiring board has a plurality of support bars for supporting the wiring board during molding.

Abstract: A method for bonding inner leads of lead frame to substrate includes the steps of: (a) providing a substrate, the substrate having a plurality of connection pads formed on the electrical bonding surface of the substrate; (b) providing a lead frame with a dam tape adhered on of the inner leads of the lead frame; (c) thermally compressing the inner leads of lead frame onto the substrate, wherein a solder material is formed between the inner end and the corresponding connection pad of the substrate and the solder material is limited by the dam tape during inner lead bonding, so that there is stable electrical and mechanical connection between inner leads and the substrate.

Abstract: A semiconductor package is disclosed, such as QFN, SON. The semiconductor package includes a die, a package body for protection of a die, and a plurality of leads. A metal pad formed by some partial downside surface of each lead is located on a downside surface of the package body with coplanarity. Each lead has a cutting surface exposed on a corresponding lateral surface of the package body. The cutting surface has an interval with the plane of forming the metal pads by means of selectively self-etching the leads or stamping to bend the leads in order to avoid forming a cutting sharp edge in the brim of the metal pad after cutting.