Abstract: A transfer system adaptable to performing levelling alignment includes a transfer head that picks up micro devices, the transfer head having a plurality of pick-up heads protruded from a bottom surface of the transfer head; and a levelling fixture configured to perform levelling alignment for the transfer head, the levelling fixture having a plurality of cavities that are concave downwards to correspondingly accommodate the pick-up heads respectively.

Abstract: An integrated device includes a laser ranging module, a dual-branched fiber bundle, a beam splitter, and an image receiving module. The laser ranging module includes a light source, an optical receiver and a computing unit. The fiber bundle is disposed between the laser ranging module and the beam splitter. A target reflects a measuring beam emitted by the light source to form a reflected beam. The beam splitter splits the reflected beam into a first reflected beam and a second reflected beam. The first reflected beam is transmitted to the optical receiver through the fiber bundle to generate a measurement signal. The computing unit receives the measurement signal to calculate a distance between the target and the fiber bundle. The image receiving module is disposed on the optical path of the second reflected beam to receive the second reflected beam and displays the image of the target.

Abstract: The present invention provides a reflective condensing interferometer for focusing on a preset focus. The reflective condensing interferometer includes a concave mirror set, a convex mirror, a light splitting element, and a reflecting element. The concave mirror set has first and second concave surface portions which are oppositely located on two sides of a central axis passing through the preset focus and are concave on a surface facing the central axis and the preset focus. Light is preset to be incident in parallel to the central axis in use. The convex mirror is disposed between the concave mirror set and the preset focus on the central axis, and is convex away from the preset focus. The light splitting element vertically intersects with the central axis between the convex mirror and the preset focus. The reflecting element is disposed between the light splitting element and the convex mirror.

Abstract: A transfer system adaptable to performing levelling alignment includes a transfer head that picks up micro devices, the transfer head having a plurality of pick-up heads protruded from a bottom surface of the transfer head; and a levelling fixture configured to perform levelling alignment for the transfer head, the levelling fixture having a plurality of cavities that are concave downwards to correspondingly accommodate the pick-up heads respectively.

Abstract: A support structure for a light-emitting diode utilizes the configuration of a sacrifice structure to achieve safe separation of a light-emitting diode from a carrier substrate. Specifically, when an external force is applied on the light-emitting diode or the carrier substrate, a breaking layer of the sacrifice structure is the first layer to be broken, so that the light-emitting diode and carrier substrate will become separated from each other.

Abstract: The present invention provides a reflective condensing interferometer for focusing on a preset focus. The reflective condensing interferometer includes a concave mirror set, a convex mirror, a light splitting element, and a reflecting element. The concave mirror set has first and second concave surface portions which are oppositely located on two sides of a central axis passing through the preset focus and are concave on a surface facing the central axis and the preset focus. Light is preset to be incident in parallel to the central axis in use. The convex mirror is disposed between the concave mirror set and the preset focus on the central axis, and is convex away from the preset focus. The light splitting element vertically intersects with the central axis between the convex mirror and the preset focus. The reflecting element is disposed between the light splitting element and the convex mirror.

Abstract: An integrated device includes a laser ranging module, a dual-branched fiber bundle, a beam splitter, and an image receiving module. The laser ranging module includes a light source, an optical receiver and a computing unit. The fiber bundle is disposed between the laser ranging module and the beam splitter. A target reflects a measuring beam emitted by the light source to form a reflected beam. The beam splitter splits the reflected beam into a first reflected beam and a second reflected beam. The first reflected beam is transmitted to the optical receiver through the fiber bundle to generate a measurement signal. The computing unit receives the measurement signal to calculate a distance between the target and the fiber bundle. The image receiving module is disposed on the optical path of the second reflected beam to receive the second reflected beam and displays the image of the target.

Abstract: A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.

Abstract: A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.

Abstract: A support structure for a light-emitting diode utilizes the configuration of a sacrifice structure to achieve safe separation of a light-emitting diode from a carrier substrate. Specifically, when an external force is applied on the light-emitting diode or the carrier substrate, a breaking layer of the sacrifice structure is the first layer to be broken, so that the light-emitting diode and carrier substrate will become separated from each other.

Abstract: This invention discloses a mechanism with a component position adjusting function, comprising a drive unit, a drive shaft, a plate body, a drive wheel, at least one passive component and a brake. The drive unit performs a forward or reverse rotating shift and drives the drive shaft to rotate. The unidirectional component has a through hole, and disposes at the plate body. An end of the drive shaft is passed through the through hole and exposed from the plate body. The drive shaft synchronously drives the plate body and the drive wheel to rotate forward. The passive component is arranged at the plate body and contacted with the drive shaft with synchronously drives and rotates the passive component. The plate body remains still through the rotation of the unidirectional component and the contact of the brake with the plate body.

Abstract: This invention discloses a mechanism with a component position adjusting function, comprising a drive unit, a drive shaft, a plate body, a drive wheel, at least one passive component and a brake. The drive unit performs a forward or reverse rotating shift and drives the drive shaft to rotate. The unidirectional component has a through hole, and disposes at the plate body. An end of the drive shaft is passed through the through hole and exposed from the plate body. The drive shaft synchronously drives the plate body and the drive wheel to rotate forward. The passive component is arranged at the plate body and contacted with the drive shaft with synchronously drives and rotates the passive component. The plate body remains still through the rotation of the unidirectional component and the contact of the brake with the plate body.

Abstract: A method of manufacturing a spacer for a substrate having a gate structure formed thereon. The method comprises steps of forming a first oxide layer over the substrate and forming a nitride layer on the first oxide layer. A first asymmetric etching process is performed to remove a portion of the nitride layer until a portion of a top surface of the first oxide layer is exposed. A second asymmetric etching process is performed to remove a portion of the first oxide layer by using the remaining nitride layer as a mask until about 50% to 90% portion of the first oxide layer is removed. A quick wet etching process is performed to remove a portion of the remaining first oxide located on the top of the gate structure and on the substrate.

Abstract: A method of forming damascene structures. A substrate including a dielectric layer thereon is provided. The dielectric layer has a plurality of via holes. A gap filler is formed into each via hole. Subsequently, a first anti-reflective coating (ARC) film and a second ARC film are consecutively formed on the dielectric layer. A photoresist pattern for defining a trench pattern is formed on the second ARC film. Following that, an etching process is performed to remove an upper part of the dielectric layer left uncovered by the photoresist pattern to form a plurality of trenches.

Abstract: A method of manufacturing a spacer for a substrate having a gate structure formed thereon. The method comprises steps of forming a first oxide layer over the substrate and forming a nitride layer on the first oxide layer. A first asymmetric etching process is performed to remove a portion of the nitride layer until a portion of a top surface of the first oxide layer is exposed. A second asymmetric etching process is performed to remove a portion of the first oxide layer by using the remaining nitride layer as a mask until about 50% to 90% portion of the first oxide layer is removed. A quick wet etching process is performed to remove a portion of the remaining first oxide located on the top of the gate structure and on the substrate.

Abstract: A substrate including a dielectric layer thereon is provided. The dielectric layer has a plurality of via holes. A gap filler is formed into each via hole. Subsequently, a first anti-reflective coating (ARC) film and a second ARC film are consecutively formed on the dielectric layer. A photoresist pattern for defining a trench pattern is formed on the second ARC film. Following that, an etching process is performed to remove an upper part of the dielectric layer left uncovered by the photoresist pattern to form a plurality of trenches.

Abstract: A gap-filling process is provided. A substrate having a dielectric layer thereon is provided. The dielectric layer has an opening therein. A gap-filling material layer is formed over the dielectric layer and inside the opening. A portion of the gap-filling material is removed from the gap-filling material layer to expose the dielectric layer. A gap-filling material treatment of the surface of the gap-filling material layer and the dielectric layer is carried out to planarize the gap-filling material layer so that a subsequently formed bottom anti-reflection coating or material layer over the gap-filling material layer can have a high degree of planarity.

Abstract: A gap-filling process is provided. A substrate having a dielectric layer thereon is provided. The dielectric layer has an opening therein. A gap-filling material layer is formed over the dielectric layer and inside the opening. A portion of the gap-filling material is removed from the gap-filling material layer to expose the dielectric layer. A gap-filling material treatment of the surface of the gap-filling material layer and the dielectric layer is carried out to planarize the gap-filling material layer so that a subsequently formed bottom anti-reflection coating or material layer over the gap-filling material layer can have a high degree of planarity.

Abstract: A package with high heat dissipation, comprising a carrier and a chip located thereon, with electric connection between the chip to the carrier. A molding compound is used to encapsulate the chip, part of the carrier, and the connection between the chip and the carrier. A heat pipe is provided such that one end thereof is embedded in the molding compound, is close to the active surface of the chip and is substantially normal to the chip, and the other end thereof is extended outside of the molding compound.

Abstract: A package with high heat dissipation, comprising a carrier and a chip located thereon, with electric connection between the chip to the carrier. A molding compound is used to encapsulate the chip, part of the carrier, and the connection between the chip and the carrier. A heat pipe is provided such that one end thereof is embedded in the molding compound, is close to the active surface of the chip and is substantially normal to the chip, and the other end thereof is extended outside of the molding compound.