Patents by Inventor Chun-Jung Chang

Chun-Jung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10643298
    Abstract: A video processing system includes a main chip and a processing chip. The main chip receives first data. The processing chip is coupled to the main chip, and receives second data and to perform a video processing on at least one of the first data transmitted from the main chip and the second data, in order to drive a display panel. First video carried on the first data or second video on the second data has a first resolution, and the first resolution is at least 8K ultra high definition.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: May 5, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Yi-Shu Chang, Cheng-Hsin Chang, Hsu-Jung Tung, Chun-Hsing Hsieh, Sen-Huang Tang
  • Publication number: 20200129646
    Abstract: A radioactive labeled long-acting peptide-targeting pharmaceutical and production method, in which the peptide targeted pharmaceutical is firstly dissolved in a solution, followed by labeling the radioactive at a high temperature, and the dosage of the pharmaceutical with radioactive labeling is expected to be reduced and labeling efficiency is improved, and no further purification by filtration is required, which shortens the preparation process and reduces personnel exposure in the working environment. The radioactive labeled long-acting peptide-targeting pharmaceutical can increase the specific binding capacity of tumors and reduce the non-specific accumulation in normal tissues. It can be applied to the field of tumor and nuclear medicine for diagnosis and treatment of tumors and/or tumor metastases with efficacy and precision treatment.
    Type: Application
    Filed: October 31, 2018
    Publication date: April 30, 2020
    Inventors: Ming-Hsin Li, Chih-Hsien Chang, Su-Jung Chen, Shih-Ying Lee, Sheng-Nan Lo, Ming-Wei Chen, Yuan-Ruei Huang, Chun-Fang Feng, Shih-Wei Lo, Cheng-Hui Chuang
  • Publication number: 20200118852
    Abstract: A method of monitoring a fluid includes: applying the fluid from within a nozzle to a surface of a wafer outside of the nozzle; emitting light, by a light source, from the nozzle to the surface; receiving light reflected from the surface by a light sensor and causing the reflected light to propagate into the nozzle; and determining whether a variation of the fluid occurs according to the reflected light.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 16, 2020
    Inventors: KAI-LIN CHUANG, TSUNG-CHI CHEN, PEI-JUNG CHANG, CHUN-WEI HUANG, JUN XIU LIU
  • Publication number: 20200117236
    Abstract: A display device including a casing, a frame member, a plate member and a display panel is provided. The frame member includes a frame body and a protruding column disposed on the frame body and protruded in a direction from the frame body towards the casing. The plate member is disposed on the frame body and has an opening, which allows the protruding column to pass through, wherein the protruding column fixes relative position between the frame body and the plate member. The display panel is disposed on the frame body.
    Type: Application
    Filed: April 15, 2019
    Publication date: April 16, 2020
    Applicant: Qisda Corporation
    Inventors: Chun-Jung CHEN, Yung-Yeh CHANG, Shih-An LIN, Hsiao-Yun CHEN
  • Patent number: 10620097
    Abstract: A biological sample processing device includes a base, a purification unit, a metering unit and a first tube. The purification unit is disposed on the base and is configured to purify a sample. The metering unit is disposed on the base and has an inlet, at least one metering trough and an overflow trough. The inlet is connected to the purification unit via the first tube, and the metering trough is connected between the inlet and the overflow trough. The sample from the purification unit is configured to enter the metering unit through the inlet to be moved toward the metering trough, and to be moved toward the overflow trough after the metering trough is filled with the sample.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: April 14, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-An Chen, Wen-Ching Lee, Tzu-Hui Wu, Pei-Shin Jiang, Ping-Jung Wu, Ruey-Shyan Hong, Hsiao-Jou Chang, Chun-Chieh Huang, Ting-Hsuan Chen, Chih-Lung Lin
  • Publication number: 20200111739
    Abstract: A method for forming a semiconductor contact structure is provided. The method includes depositing a dielectric layer over a substrate. The method also includes etching the dielectric layer to expose a sidewall of the dielectric layer and a top surface of the substrate. In addition, the method includes forming a silicide region in the substrate. The method also includes applying a plasma treatment to the sidewall of the dielectric layer and the top surface of the substrate to form a nitridation region adjacent to a periphery of the silicide region. The method further includes depositing an adhesion layer on the dielectric layer and the silicide region.
    Type: Application
    Filed: December 9, 2019
    Publication date: April 9, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Wen CHENG, Wei-Yip LOH, Yu-Hsiang LIAO, Sheng-Hsuan LIN, Hong-Mao LEE, Chun-I TSAI, Ken-Yu CHANG, Wei-Jung LIN, Chih-Wei CHANG, Ming-Hsing TSAI
  • Patent number: 10608355
    Abstract: The present disclosure provides a computing device. The computing device includes an electronic component. The computing device also includes a printed circuit board assembly (PCBA). The PCBA includes at least two latch receiving spaces. The two latch receiving spaces are positioned on the PCBA to accommodate various sizes of the electronic component. The computing device also includes a latch assembly for securing the electronic component. The latch assembly is connected to the PCBA at one of the at least two latch receiving spaces.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: March 31, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yaw-Tzorng Tsorng, Jui-Tang Chang, Chun Chang
  • Publication number: 20200074903
    Abstract: A display device includes a display module and a color calibrator. The display module includes a first casing and a circuit board. The first casing has a positioning recess and an accommodating recess. The circuit board has a first electrical connecting portion. The circuit board is disposed corresponding to the positioning recess and the first electrical connecting portion is exposed from the positioning recess. The color calibrator includes a second casing, a second electrical connecting portion and a sensor. The second casing has a protruding portion. The color calibrator is selectively accommodated in the accommodating recess or connected to the positioning recess by the protruding portion. When the protruding portion of the color calibrator is connected to the positioning recess, the first electrical connecting portion is electrically connected to the second electrical connecting portion and the sensor faces a display area of the display module.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 5, 2020
    Inventors: Chun-Jung Chen, Yung-Yeh Chang
  • Patent number: 10580693
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back by a wet etching process. After etching back the portion of the barrier layer, an underlying dielectric welding layer is exposed. A conductive material is formed along the barrier layer.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: March 3, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ken-Yu Chang, Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin
  • Patent number: 10581359
    Abstract: An output torque calculation device and a method thereof is provided, and the output torque calculation device includes a first sensor, a second sensor, a rotor, a reducer, a processor, and an elastic device. An input portion of the reducer and an output portion of the reducer are respectively connected to the rotor and an input portion of the elastic device, and an output portion of the elastic device is configured to connect to a load. The output torque calculation method comprises: detecting a first angle of the rotor by the first sensor; detecting a second angle of the output portion of the elastic device by the second sensor; and calculating a torque carried by a final output end of the output torque calculation device by the processor according to the first angle and the second angle.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: March 3, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-An Lin, Hsi-Chih Chang, Hsin-Hung Chou, Wen-Che Shen, Kuan-Jung Lin
  • Publication number: 20200027750
    Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 23, 2020
    Inventors: Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang, Chun-Che Chen, Jhih-Ming Lin, Chih-Ching Lin, Shih-Wen Huang, Chun Hua Chang, Tsung-Yang Hsieh
  • Publication number: 20200017414
    Abstract: The invention relates to a water-based ceramic three-dimensional laminate material and a method for using the same material to manufacture the ceramic objects, comprising: a step Sa of preparing a plurality of projected slice graphics and a slurry, wherein the projected slice graphics are formed by slicing a three-dimensional image along a specific direction with a specific thickness, the slurry is prepared by mixing the material powder, the photo-curing resin, the solvent and the additive; a step Sb of uniformly laying the slurry on the substrate to form a sacrificial layer; and a step Sc of uniformly laying the slurry on the slurry to form a reaction layer on the sacrificial layer; a step Sd of irradiating the reaction layer with a light beam according to one of the plurality of projected slice graphics, and the slurry is cured after being irradiated; a step Se of repeating steps Sc and Sd until a ceramic body is formed; a step Sf of washing the ceramic body with water or an organic solvent; and a step Sg o
    Type: Application
    Filed: May 6, 2019
    Publication date: January 16, 2020
    Inventors: Chun-Jung YEN, Feng-Ming YEN, Ching-Hsing CHANG, Chun-Yen TUNG, Shih-Wei CHENG
  • Publication number: 20200020578
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back by a wet etching process. After etching back the portion of the barrier layer, an underlying dielectric welding layer is exposed. A conductive material is formed along the barrier layer.
    Type: Application
    Filed: July 11, 2018
    Publication date: January 16, 2020
    Inventors: Ken-Yu Chang, Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin
  • Patent number: 10504758
    Abstract: A nozzle for emitting a fluid comprises a channel, a light source and a light sensor. The channel is configured to flow the fluid. The light source is configured to emit light towards a surface on which the fluid is applied and the light sensor is configured to receive reflected light from the surface.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: December 10, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Kai-Lin Chuang, Tsung-Chi Chen, Pei-Jung Chang, Chun-Wei Huang, Jun Xiu Liu
  • Patent number: 10504834
    Abstract: A semiconductor device and method of forming the same that includes forming a dielectric layer over a substrate and patterning a contact region in the dielectric layer, the contact region having side portions and a bottom portion that exposes the substrate. The method can also include forming a dielectric barrier layer in the contact region to cover the side portions and the bottom portion, and etching the dielectric barrier layer to expose the substrate. Subsequently, a conductive layer can be formed to cover the side portions and the bottom portion of the contact region and the conductive layer can be annealed to form a silicide region in the substrate beneath the bottom portion of the contact region, and the conductive layer can then be selectively removed on the side portions of the contact region.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: December 10, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee, Chun-I Tsai, Ken-Yu Chang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20190273042
    Abstract: A semiconductor device and method of forming the same that includes forming a dielectric layer over a substrate and patterning a contact region in the dielectric layer, the contact region having side portions and a bottom portion that exposes the substrate. The method can also include forming a dielectric barrier layer in the contact region to cover the side portions and the bottom portion, and etching the dielectric barrier layer to expose the substrate. Subsequently, a conductive layer can be formed to cover the side portions and the bottom portion of the contact region and the conductive layer can be annealed to form a silicide region in the substrate beneath the bottom portion of the contact region, and the conductive layer can then be selectively removed on the side portions of the contact region.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee, Chun-I Tsai, Ken-Yu Chang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20190251651
    Abstract: A video processing system includes a main chip and a processing chip. The main chip receives first data. The processing chip is coupled to the main chip, and receives second data and to perform a video processing on at least one of the first data transmitted from the main chip and the second data, in order to drive a display panel. First video carried on the first data or second video on the second data has a first resolution, and the first resolution is at least 8K ultra high definition.
    Type: Application
    Filed: September 25, 2018
    Publication date: August 15, 2019
    Inventors: Yi-Shu CHANG, Cheng-Hsin Chang, Hsu-Jung Tung, Chun-Hsing Hsieh, Sen-Huang Tang
  • Patent number: 10361120
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: July 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin
  • Publication number: 20190164824
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.
    Type: Application
    Filed: November 29, 2018
    Publication date: May 30, 2019
    Inventors: Yu Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin
  • Publication number: 20190164823
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 30, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu Shih WANG, Chun-I TSAI, Shian Wei MAO, Ken-Yu CHANG, Ming-Hsing TSAI, Wei-Jung LIN