Patents by Inventor Chun Li

Chun Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240021431
    Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.
    Type: Application
    Filed: July 28, 2023
    Publication date: January 18, 2024
    Inventors: Wan Hsuan Hsu, Jao Sheng Huang, Yen-Chiu Kuo, Yu-Li Cheng, Ya Tzu Chen, Neng-Jye Yang, Chun-Li Chou
  • Patent number: 11874969
    Abstract: The disclosure provides a method for determining a two-handed gesture, a host, and a computer readable medium. The method includes: providing a visual content of a reality system; tracking a first hand gesture and a second hand gesture perform by two hands; in response to determining that the first hand gesture and the second hand gesture form a two-handed gesture, activating a system function of the reality system, wherein the system function of the reality system is independent to the visual content.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: January 16, 2024
    Assignee: HTC Corporation
    Inventors: Chun-Li Wang, Caesar Tan, Yi-Cheng Lai
  • Publication number: 20230410856
    Abstract: A memory chip, a memory device and an operation method are disclosed. The memory chip includes a number of memory units and a control logic circuit. The memory units could be configured as TLC, MLC or SLC. The control logic circuit is configured to use TLC programming approach to program MLC and SLC.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 21, 2023
    Inventors: Yung-Chun LI, Yu-Ming HUANG
  • Publication number: 20230403526
    Abstract: An audio data processing method, an audio data processing apparatus, a terminal, and a computer-readable storage medium are disclosed. In the embodiments of the present invention, a multi-channel audio is processed into left and right channel audio, and the users can experience the effect of surround sound when listening to a target audio.
    Type: Application
    Filed: October 25, 2021
    Publication date: December 14, 2023
    Applicant: SHENZHEN TCL DIGITAL TECHNOLOGY LTD.
    Inventors: Chun Li, Yu Qin
  • Patent number: 11843322
    Abstract: The invention provides a power converter apparatus for converting an alternating current (AC) power input to a direct current (DC) power output. The apparatus comprises a plurality of n single-phase power converting circuits arranged in parallel, where n is equal to or greater than 2, wherein one of said n single-phase power converting circuits comprises a single-stage AC/DC converter module having an operating AC/DC converter; and each of a remaining n?1 of said single-phase power converting circuits comprises a two-stage converter module having an AC/DC converter as an input stage and a DC/DC transformer as an output stage.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: December 12, 2023
    Assignee: Hong Kong Applied Science And Technology Research Institute Co., Ltd
    Inventors: Sui Pung Cheung, Qing Chun Li, Tin Ho Li
  • Patent number: 11835392
    Abstract: An apparatus includes a temperature sensor configured to measure a temperature of a dry-type transformer, and the temperature sensor is arranged on or proximate a conductor of the dry-type transformer and is covered by an insulating layer of the conductor. The apparatus further includes a passive wireless communication module configured to transmit the measured temperature to a reader. The temperature of the dry-type transformer can be measured accurately, thereby improving the reliability and safety of the dry-type transformer. Accordingly, temperature measurement for the dry-type transformer can work appropriately in a cost-effective and efficient way.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: December 5, 2023
    Assignee: HITACHI ENERGY LTD
    Inventors: YiBo Zhang, Delun Meng, Jiansheng Chen, Chun Li
  • Patent number: 11826894
    Abstract: Disclosed is a tool bar. The tool bar comprises a head part, a tail part, a pipe connection assembly, a backstop mechanism and a bushing member. The head part and the tail part are connected with each other by the pipe connection assembly. The bushing comprises a cone section and a cylinder section; one end of the head part passes through the cylinder section and connected to an inner thread of the cone section; the outer side of the cone section is configured to secure with a tool head; an external thread is provided on an outer surface of the cylinder section. The backstop mechanism comprises an intermediate member and a lock cap; the intermediate member is a hollow cylinder.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: November 28, 2023
    Inventors: Changzhi Fu, Xiaolin Fu, Yuxuan Fu, Chun Li, Dongjian Jin, Xiongjun Ren
  • Patent number: 11825285
    Abstract: The present disclosure provides a speaker diaphragm and a speaker. The speaker diaphragm comprises a thermoplastic polyester elastomer film layer (11), wherein a thermoplastic polyester elastomer is a copolymer composed of a polyester hard segment A and a polyether or aliphatic polyester soft segment B, and the thermoplastic polyester elastomer film layer has a glass transition temperature being less than or equal to 20° C., and a thermoplastic temperature being 50° C.-200° C. The use of the thermoplastic polyester elastomer film layer enables the speaker diaphragm to have a good flexibility, a high reliability, and a good durability, and improves the anti-destructive ability of the speaker.
    Type: Grant
    Filed: October 13, 2018
    Date of Patent: November 21, 2023
    Assignee: Goetek Inc.
    Inventors: Ting Wang, Guodong Zhao, Jie Zhu, Chun Li, Chunfa Liu
  • Patent number: 11817253
    Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: November 14, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: Feng-Lung Chien, Tsang-Feng Wu, Yuan Han, Tzu-Chieh Kao, Chien-Hung Lin, Kuang-Lun Lee, Hsiang-Hui Hsu, Shu-Yi Tsui, Kuo-Jui Lee, Kun-Ying Lee, Mao-Chun Chen, Tai-Hsien Yu, Wei-Yu Chen, Yi-Ju Li, Kuei-Yuan Chang, Wei-Chun Li, Ni-Ni Lai, Sheng-Hao Luo, Heng-Sheng Peng, Yueh-Hui Kuan, Hsiu-Chen Lin, Yan-Bing Zhou, Chris T. Burket
  • Patent number: 11818559
    Abstract: The present disclosure provides a speaker diaphragm and a speaker. The diaphragm includes two surface layers compounded together and at least one intermediate layer located between the two surface layers, at least one of the surface layers is a thermoplastic polyester elastomer film layer, and at least one of the intermediate layers is an adhesive layer, wherein the thermoplastic polyester elastomer film layer has a Young's module of 1-1000 MPa, a loss factor being greater than or equal to 0.015, and an elastic recovery rate after 10% strain being greater than or equal to 80%. The speaker diaphragm may be made very thin, thus reducing the weight of the speaker diaphragm, improving the space allowance for vibration, improving the sensitivity, and making the F0 of the speaker lower. Further, elastic area of the speaker diaphragm is wider and the resilience performance is excellent.
    Type: Grant
    Filed: October 13, 2018
    Date of Patent: November 14, 2023
    Assignee: Goertek Inc.
    Inventors: Ting Wang, Guodong Zhao, Jie Zhu, Chun Li, Chunfa Liu
  • Publication number: 20230362170
    Abstract: Method, systems, and computer program products for access configuration in hybrid network environments are disclosed. According to the method, an access configuration request is received from a client device in a first network environment, wherein the access configuration request is associated with an access to a network resource in a second network environment and comprises first authentication information associated with the client device. Further, second authentication information associated with the network resource is obtained. The first and second authentication information is further used to determine whether the access configuration request is verified. If the access configuration request is verified, connectivity between the client device and the network resource can be automatically established.
    Type: Application
    Filed: May 6, 2022
    Publication date: November 9, 2023
    Inventors: Qian Xia Song, Xiao Ling Chen, Ai Ping Feng, CHUN LI JIA, Jin Jin Yang, Kui Zhang, Dong Chen
  • Publication number: 20230352012
    Abstract: Disclosed is a speech skill jumping method for man-machine dialogue applied to an electronic device, comprising constructing a field migration map in advance based on user's historical man-machine dialogue data, the field migration map being a directed map including a plurality of dialogue fields; receiving external speech; determining a dialogue field that the external speech hits; and judging whether the hit dialogue field belongs to one of the plurality of dialogue fields in the field migration map, and ignoring the external speech if not, or jumping to a speech skill corresponding to the hit dialogue field if yes. A field migration map is generated based on a user's historical man-machine dialogue data which reflects the user's interaction habits, and whether to perform a speech skill jump is judged based on the field migration map., obviously abnormal input content can be shielded, improving the task completion and interaction efficiency.
    Type: Application
    Filed: October 21, 2020
    Publication date: November 2, 2023
    Inventors: Hongbo SONG, Shuai FAN, Chun LI
  • Publication number: 20230345178
    Abstract: A diaphragm and a sound generating apparatus. The diaphragm comprises at least one elastomer layer, and the elastomer layer is made of a rubber compound. The rubber compound comprises nitrile rubber and hydrogenated nitrile rubber. Both the nitrile rubber and the hydrogenated nitrile rubber contain acrylonitrile blocks. In terms of mass percentage, the range of the content of acrylonitrile blocks is 20% to 80%. The described diaphragm has excellent mechanical strength, cold resistance, and resilience, and has high damping performance.
    Type: Application
    Filed: August 25, 2021
    Publication date: October 26, 2023
    Inventors: Cuicui WANG, Bing HUI, Fengguang LING, Chun LI
  • Patent number: 11800288
    Abstract: Disclosed are a diaphragm for a sound generating device and a sound generating device. The diaphragm comprising at least one elastomer layer, wherein the elastomer layer is made of an ethylene propylene diene monomer; and the ethylene propylene diene monomer is formed by polymerizing three monomers, the three monomers being an ethylene monomer, a propylene monomer and a non-conjugated diene monomer respectively, a mass ratio of the ethylene monomer to the propylene monomer ranging from 0.25 to 4, and content of the non-conjugated diene monomer being 1%-15% of total content of the ethylene monomer and the propylene monomer. The ethylene propylene diene monomer has excellent high-temperature resistance and thermo-oxidative aging resistance; and after the rubber is made into the diaphragm, the diaphragm is capable of working in a high-temperature environment for a long time, maintaining not only excellent elasticity but also excellent anti-fatigue characteristic, thereby possessing excellent reliability.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: October 24, 2023
    Assignee: Goertek Inc.
    Inventors: Shuqiang Wang, Bing Hui, Fengguang Ling, Chun Li, Chunfa Liu
  • Patent number: 11800287
    Abstract: The present disclosure provides a speaker diaphragm and a speaker. The diaphragm includes two surface layers compounded together and at least one intermediate layer located between the two surface layers, wherein at least one of the surface layers is a thermoplastic polyester elastomer film layer, at least one of the intermediate layers is an adhesive layer, a thermoplastic polyester elastomer is a copolymer composed of a polyester hard segment A and a polyether or aliphatic polyester soft segment B, a thickness of the thermoplastic polyester elastomer film layer is 5-70 ?m, and a thickness of the adhesive layer is 1-40 ?m.
    Type: Grant
    Filed: October 13, 2018
    Date of Patent: October 24, 2023
    Assignee: Goertek Inc.
    Inventors: Ting Wang, Guodong Zhao, Jie Zhu, Chun Li, Chunfa Liu
  • Publication number: 20230314105
    Abstract: The present disclosure relates to laminated armor materials for enhanced ballistic protection. In particular, the present disclosure relates to laminated armor materials comprising first and second armor materials and a laminated adhesive layer comprising nanomaterial fillers.
    Type: Application
    Filed: August 3, 2021
    Publication date: October 5, 2023
    Inventors: Chun Li, Saleema Noormohammed, Yadienka Martinez-Rubi, Michael Benson Jakubinek, Behnam Ashrafi
  • Patent number: 11776818
    Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: October 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wan Hsuan Hsu, Jao Sheng Huang, Yen-Chiu Kuo, Yu-Li Cheng, Ya Tzu Chen, Neng-Jye Yang, Chun-Li Chou
  • Publication number: 20230307333
    Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes a redistribution layer including a first conductive feature and a second conductive feature, a first contact feature disposed over and electrically coupled to the first conductive feature, a second contact feature disposed over and electrically coupled to the second conductive feature, and a passivation feature extending from between the first conductive feature and the second conductive feature between the first contact feature and the second contact feature. The passivation feature includes a dielectric feature and a dielectric layer. The dielectric layer is disposed on a planar top surface of the dielectric feature and a composition of the dielectric feature is different from a composition of the dielectric layer.
    Type: Application
    Filed: June 5, 2023
    Publication date: September 28, 2023
    Inventors: Hsiang-Ku Shen, Chun-Li Lin, Dian-Hau Chen
  • Patent number: 11756904
    Abstract: A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: September 12, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuanhao Yu, Cheng-Lin Ho, Yu-Lin Shih, Shih-Chun Li
  • Publication number: 20230279347
    Abstract: The present disclosure describes the use of ectopic SOX2 to promote nerve growth and regeneration, particularly in the context of nerve deficit stemming from trauma and disease, by reprogramming non-nerve cells into neuronal cells. In particular, the disclosure provides for the use of SOX2 therapy, optionally combined with neurogenic growth factors, to treat nerve deficit conditions.
    Type: Application
    Filed: October 28, 2022
    Publication date: September 7, 2023
    Applicant: The Board of Regents of the University of Texas System
    Inventors: Chun-Li Zhang, Lei-Lei Wang, Yuhua Zou, Wenjiao Tai, Wenze Niu