Abstract: A stylus pen includes a penholder comprising a rod body and an electrode structure disposed on the rod body and a pen core comprising a tip portion located at one end of the rod body and an insertion portion connected to the tip portion and removably inserted into the rod body, the tip portion is spaced apart from the electrode structure, the insertion portion is electrically conductive, and the tip portion is made of material being electrically conductive and writable on paper.

Abstract: The present disclosure relates to an LED chip transfer method and a display panel. The LED chip transfer method includes: setting a pyrolytic adhesive film on a chip bearing surface of a first substrate, the pyrolytic adhesive film covering a plurality of LED chips on the chip bearing surface; bonding one surface of a second substrate to the pyrolytic adhesive film, and separating the LED chips from the first substrate; picking up a target LED chip to be transferred on the second substrate by using a transfer head, and heating the pyrolytic adhesive film until the target LED chip is separated from the pyrolytic adhesive film; and bonding the target LED chip on the transfer head to a drive substrate.

Abstract: The present disclosure relates to a transfer device and a transfer method. The transfer device comprises at least one transfer unit, the transfer unit comprises: an exporting device comprising a gas flow inlet, a micro-component inlet and a micro-component exporting port, wherein the gas flow inlet, the micro-component inlet and the micro-component, exporting port are in communication with each other; a micro-component source device for storing a solution and one or more micro-components, wherein the micro-component source device comprises a micro-component outlet, and the micro-component outlet is in communication with the micro-component inlet; and a gas flow output device comprising a gas flow outlet, wherein the gas flow inlet is in communication with the gas flow outlet, and the gas flow output device is used for outputting a gas flow to the exporting device.

Abstract: A method for mass transfer, a light-emitting diode (LED) display device, and a display apparatus are provided. The method includes: applying an insulating-adhesive on a growth substrate, where the insulating-adhesive applied is between two adjacent LED chips; placing the growth substrate above a display backplane, where a distance between the growth substrate and the display backplane after placing is greater than a height of an LED chip; forming an insulating-adhesive column between the growth substrate and the display backplane by softening the insulating-adhesive through heating, where the softened insulating-adhesive subjected to heating is adhered to the display backplane; separating the LED chip from the growth substrate, to make the separated LED chip fall onto a corresponding pad-group through a channel formed by insulating-adhesive columns around the separated LED chip; and bonding the fallen LED chip with the corresponding pad-group on the display backplane.

Abstract: A circuit-board component and a manufacturing method thereof, and a light-emitting component and a manufacturing method thereof are provided in the disclosure. The light-emitting component includes the circuit-board component. The circuit-board component includes a circuit hoard, where multiple chip bonding areas are defined on the circuit board, and a weakening layer disposed on the circuit board and defining multiple cavities, where one chip bonding area corresponds to one cavity.

Abstract: A light-emitting chip transfer system and a light-emitting chip transfer method are provided. The light-emitting chip transfer system includes a growth substrate (1) grown with light-emitting chip (2), where the light-emitting chip (2) is magnetic and is bonded to the growth substrate (1) through a laser dissociation layer; a laser device configured to irradiate a laser to the laser dissociation layer to dissociate the laser dissociation layer; and a magnetic field generating device capable of generating a magnetic field in a gap between the light-emitting chip (2) and a chip bonding area corresponding to the light-emitting chip.

Abstract: The disclosure relates to a micro component structure and a manufacturing method thereof, and a transfer method for a light-emitting diode (LED) chip. The micro component structure includes a substrate (300), multiple stacked adhesive layer structures spaced on a first surface (300a) of the substrate (300), and multiple LED chips (20) correspondingly disposed on the multiple stacked adhesive layer structures. Each of the multiple LED chips (20) has two extraction electrodes (21) at a surface facing toward the multiple stacked adhesive layer structures. Each of the multiple stacked adhesive layer structures includes a photolysis adhesive layer (31?) and a pyrolysis adhesive layer (32?) that are stacked. The photolysis adhesive layer (31?) is in contact with the first surface (300a). The pyrolysis adhesive layer (32?) is located between the two extraction electrodes (21) and has a thickness greater than a height of each of the two extraction electrodes (21).

Abstract: The present application relates to a chip removal head, a chip removal system and a chip removal method. The chip removal head has a heating portion (14) and an attractive force guide portion, wherein the heating portion (14) includes a bottom surface (141) and a top surface (142), which are opposite to each other, and the bottom surface (141) is a surface in contact with a to-be-removed chip; the heating portion (14) is connected to an external power supply, and generates a dissociation heat under the action of the external power supply, so as to release a connection between the to-be-removed chip and an external substrate; and the attractive force guide portion is configured to guide the to-be-removed chip, for which the connection has been released, to be adsorbed on the bottom surface (141) of the heating portion (14).

Abstract: A transfer device, and a manufacturing method, a detection method and a detection device of the transfer device are provided. The transfer device includes a transfer head. A colloidal crystal layer is formed on at least one bulge of the transfer head. Based on the characteristics that a Bragg reflection effect of a colloidal crystal microsphere structure can present different light colors, whether the bulge is abnormal or not is determined according to light reflected by the colloidal crystal layer on each bulge.

Abstract: A temporary chip assembly, a display panel, and manufacturing methods of the temporary chip assembly and the display panel are provided. In the display panel, welding points between a micro light-emitting chip and corresponding bonding pads on a display backboard are covered with pyrolytic adhesive to block water and oxygen, thereby slowing down or avoiding the oxidation of the welding points.

Abstract: The present disclosure relates to a red LED chip component, a red LED chip, a display panel and a manufacturing method. The red LED chip component includes an insulating substrate and a plurality of red LED chips arranged on the insulating substrate. The red LED chip and the insulating substrate are bonded by a thermal release adhesive layer.

Abstract: A power control device for a computer system includes a detecting module, configured to detect an open/close state of a display device to generate an open/close signal; and a controller, coupled to the detecting module and coupled to a power supply device through a system management bus, configured to generate an enabling signal to conduct or block a power source of the computer system provided by the power supply device, and to wake up the power supply device, which is in a power saving mode, according to the open/close signal.

Abstract: A power control device for a computer system includes a detecting module, configured to detect an open/close state of a display device to generate an open/close signal; and a controller, coupled to the detecting module and coupled to a power supply device through a system management bus, configured to generate an enabling signal to conduct or block a power source of the computer system provided by the power supply device, and to wake up the power supply device, which is in a power saving mode, according to the open/close signal.

Abstract: An over-current protection system used in a computer system is disclosed. The computer system includes a current supply module, a processor, and a battery. The over-current protection system commands the processor to disable its boost state if a first current generated by the current supply module when the processor is in the boost state is greater than a second current affordable by the current supply module.

Abstract: A computer system includes a first electronic device configured to be operated by utilizing a regular voltage, a second electronic device configured to be operated by utilizing the regular voltage, and a power supply device for providing the regular voltage. The power supply device includes a voltage regulator coupled to the first electronic device for transforming a supply voltage to output the regular voltage to the first electronic device, a control logic circuit for generating an enable signal according to a control signal, and a load switch circuit coupled to the control logic circuit, the voltage regulator and the second electronic device for outputting the regular voltage to the second electronic device according to the enable signal.

Abstract: A connector mechanism for connecting a board card is disclosed. The connector mechanism includes a circuit board, and a connector installed on the circuit board. An end of the board card is for inserting into the connector. The connector mechanism further includes a socket installed on the circuit board and located on a side of the connector, a rotating component pivoted to the socket, and at least one connecting component slidably installed on the rotating component and coupled to the circuit board for contacting with the other end of the board card so as to electrically connect to the board card as the end of the board card is inserted into the connector and the rotating component rotates to a connection position.

Abstract: An over-current protection system used in a computer system is disclosed. The computer system includes a current supply module, a processor, and a battery. The over-current protection system commands the processor to disable its boost state if a first current generated by the current supply module when the processor is in the boost state is greater than a second current affordable by the current supply module.

Abstract: A connector mechanism for connecting a board card is disclosed. The connector mechanism includes a circuit board, and a connector installed on the circuit board. An end of the board card is for inserting into the connector. The connector mechanism further includes a socket installed on the circuit board and located on a side of the connector, a rotating component pivoted to the socket, and at least one connecting component sliably installed on the rotating component and coupled to the circuit board for contacting with the other end of the board card so as to electrically connect to the board card as the end of the board card is inserted into the connector and the rotating component rotates to a connection position.