Patents by Inventor Chun Shih
Chun Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250063936Abstract: A compound E1 capable of functioning as an emitter an organic light emitting device (OLED) at room temperature is provided. The compound is a metal coordination complex; the metal coordination complex comprises a first ligand, LA, that comprises a first group; and the metal coordination complex comprises a covalent bond between the metal and the first group; wherein the transition dipole moment (TDM) of the emissive state of the complex has a vector, wherein an angle formed between the TDM vector and the covalent bond between the metal and the first group is less than or equal to 40°, and wherein an excited state of the metal coordination complex has a LC character localized on the first group of greater than or equal to 45%. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: July 23, 2024Publication date: February 20, 2025Applicant: Universal Display CorporationInventors: Tyler FLEETHAM, Eric A. MARGULIES, Jui-Yi TSAI, Sean Michael RYNO, Wei-Chun SHIH
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Publication number: 20250042928Abstract: A compound of formula Ir(LA)x(LB)y(LC)z, where x and y are 1 or 2; z is 0 or 1; and x+y+z=3. In the compound, LA comprises Formula I, ligand LB comprises Formula II, and ligand LC is a bidentate ligand. In Formulas I and II, moiety A is a monocyclic ring or a polycyclic fused ring system; each of X1 to X14 is C or N; Y is a linking group; each R1-R2, R, R?, and RA-RE is hydrogen or a General Substituent defined herein; at least one of R1 and R2 is a tertiary alkyl group; and (1) at least one pair of RB or RC substituents are joined or fused to form a ring, or (2) at least one RC or RB comprises an electron-withdrawing group other than nitrile, or (3) X11 is N, R1 is a tertiary alkyl group. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: August 21, 2024Publication date: February 6, 2025Applicant: UNIVERSAL DISPLAY CORPORATIONInventors: Alexey Borisovich DYATKIN, Jerald FELDMAN, Wei-Chun SHIH, Pierre-Luc T. BOUDREAULT, Derek Ian WOZNIAK
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Publication number: 20250034189Abstract: A compound comprising a first ligand LA of Formula I, is provided. In Formula I, moiety A is a 5-membered or 6-membered ring; moiety B is a fused ring structure comprising at least four rings; K is a direct bond, O, or S; each of Z1 and Z2 is independently C or N; each RA and RB is independently hydrogen or a General Substituent; at least one RB comprises a cyclic group or an electron-withdrawing group; LA is coordinated to a metal M that has an atomic mass of at least 40 and is optionally coordinated to other ligands; and the ligand LA is optionally linked with other ligands. Formulations, OLEDs, and consumer products including the compound are also provided.Type: ApplicationFiled: August 23, 2024Publication date: January 30, 2025Applicant: Universal Display CorporationInventors: Jui-Yi TSAI, Alexey Borisovich Dyatkin, Walter Yeager, Pierre-Luc T. Boudreault, Hsiao-Fan Chen, Wei-Chun Shih, Derek Ian Wozniak
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Publication number: 20250034188Abstract: Provided are organometallic compounds. Also provided are formulations comprising these organometallic compounds. Further provided are OLEDs and related consumer products that utilize these organometallic compounds.Type: ApplicationFiled: August 2, 2024Publication date: January 30, 2025Applicant: Universal Display CorporationInventors: Zhiqiang JI, Pierre-Luc T. BOUDREAULT, Wei-Chun SHIH, Alan DEANGELIS
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Patent number: 12210055Abstract: In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.Type: GrantFiled: June 20, 2023Date of Patent: January 28, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Harry-Hak-Lay Chuang, Chih-Yang Chang, Ching-Huang Wang, Tien-Wei Chiang, Meng-Chun Shih, Chia Yu Wang
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Patent number: 12211579Abstract: A memory device, such as an MRAM memory, includes a memory array with a plurality of bit cells. The memory array is configured to store trimming information and store user data. A sense amplifier is configured to read the trimming information from the memory array, and a trimming register is configured to receive the trimming information from the sense amplifier. The sense amplifier is configured to receive the trimming information from the trimming register so as to operate in a trimmed mode for reading the user data from the memory array.Type: GrantFiled: January 26, 2024Date of Patent: January 28, 2025Assignee: Taiwain Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Chun Shih, Chia-Fu Lee, Yu-Der Chih
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Patent number: 12205017Abstract: Disclosed is a methods and apparatus which can improve defect tolerability of a hardware-based neural network. In one embodiment, a method for performing a calculation of values on first neurons of a first layer in a neural network, includes: receiving a first pattern of a memory cell array; determining a second pattern of the memory cell array according to a third pattern; determining at least one pair of columns of the memory cell array according to the first pattern and the second pattern; switching input data of two columns of each of the at least one pair of columns of the memory cell array; and switching output data of the two columns in each of the at least one pair of columns of the memory cell array so as to determine the values on the first neurons of the first layer.Type: GrantFiled: August 8, 2023Date of Patent: January 21, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Win-San Khwa, Yu-Der Chih, Yi-Chun Shih, Chien-Yin Liu
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Patent number: 12205632Abstract: A memory cell includes a memory circuit and a multiplier circuit. The multiplier circuit includes an output node configured to output the output signal, a first transistor and an initialization circuit. The first transistor is coupled to the output node and the memory circuit, and is configured to receive at least the second signal. The initialization circuit is coupled to the first transistor by the output node, and is configured to initialize the multiplier circuit in response to at least a third signal or a fourth signal. The memory circuit is configured to store a first value of a first signal of a first storage node. The multiplier circuit is coupled to the memory circuit. The multiplier circuit is configured to generate an output signal in response to the first signal and a second signal. The output signal corresponds to a product of the first signal and the second signal.Type: GrantFiled: January 27, 2022Date of Patent: January 21, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hon-Jarn Lin, Chia-Fu Lee, Yi-Chun Shih
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Patent number: 12206320Abstract: A DCR current sensing circuit used in a switching converter having a power switch and an inductor. The DCR current sensing circuit has a current sensing capacitor coupled in series with a current sensing resistor to form a RC circuit, a current mirror, a first and a second compensation circuits, wherein the RC circuit is coupled in parallel with the inductor. The current mirror generates a first mirror current signal and a second mirror current signal based on a voltage across the current sensing capacitor. The first compensation circuit receives the first mirror current signal and generates a first current sensing signal for meeting a first requirement of the switching converter. The second compensation circuit receives the second mirror current signal and generates a second current sensing signal for meeting a second requirement of the switching converter.Type: GrantFiled: March 4, 2022Date of Patent: January 21, 2025Assignee: Chengdu Monolithic Power Systems Co., Ltd.Inventors: Chun Shih Huang, Chia Chun Hsiao
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Publication number: 20250011355Abstract: A compound of Formula Ir(LA)x(LB)y(LC)z is provided. In Formula Ir(LA)x(LB)y(LC)z, x, Y, and z are non-negative integers; x+y+z=3; LA has a structure of Formula I, LB and LC are bidentate ligands; moiety A is a monocyclic ring or a polycyclic fused ring system; ring C is a 5- or 6-membered heterocyclic ring; each of Z, Z1, X1 to X6 is independently C or N; each of X and Y is a linker that is one-atom in length; each independently represents a single bond or a double bond; each R, R?, RA, RB, and RC is hydrogen or a General Substituent defined herein. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: June 4, 2024Publication date: January 9, 2025Applicant: Universal Display CorporationInventors: Zhiqiang JI, Jui-Yi TSAI, Wei-Chun SHIH, Alexey Borisovich DYATKIN, Elena SHEINA, Pierre-Luc T. BOUDREAULT
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Patent number: 12191262Abstract: A package structure includes a mounting pad having a mounting surface; a semiconductor chip having a magnetic device, a first magnetic field shielding, and a molding. The semiconductor chip comprises a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface, wherein the second surface is attached to the mounting surface of the mounting pad, and a third surface connecting the first surface and the second surface. The first magnetic field shielding including a plurality of segments laterally at least partially surrounding the semiconductor chip, wherein a bottom surface of the first magnetic field shielding is attached to the mounting surface of the mounting pad, wherein the mounting surface comprises first portion free from overlapping with the first magnetic field shielding from a top view perspective. The molding surrounding the mounting pad and in direct contact with the mounting surface.Type: GrantFiled: July 18, 2023Date of Patent: January 7, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Harry-Hak-Lay Chuang, Chia-Hsiang Chen, Meng-Chun Shih, Ching-Huang Wang, Tien-Wei Chiang
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Publication number: 20250002778Abstract: A compound of formula Ir(LA)x(LB)y(LC)z, where x and y are 1 or 2; z is 0 or 1; and x+y+z=3. In the compound, LA comprises Formula I, ligand LB comprises Formula II, and ligand LC is a bidentate ligand. In Formulas I and II, moiety A is a monocyclic ring or a polycyclic fused ring system; each of X1 to X14 is C or N; Y is a linking group; each R1-R2, R, R?, and RA-RE is hydrogen or a General Substituent defined herein; at least one of R1 and R2 is a tertiary alkyl group; and (1) at least one pair of RB or RC substituents are joined or fused to form a ring, or (2) at least one RC or RB comprises an electron-withdrawing group other than nitrile, or (3) X11 is N, R1 is a tertiary alkyl group. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: May 17, 2024Publication date: January 2, 2025Applicant: Universal Display CorporationInventors: Alexey Borisovich DYATKIN, Jerald FELDMAN, Wei-Chun SHIH, Pierre-Luc T. BOUDREAULT
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Publication number: 20250002516Abstract: Provided are compounds having a ligand LA of Formula I that are useful as emissive compounds in organic light emitting devices.Type: ApplicationFiled: August 27, 2024Publication date: January 2, 2025Applicant: Universal Display CorporationInventors: Wei-Chun SHIH, Hsiao-Fan CHEN, Pierre-Luc T. BOUDREAULT, Bert ALLEYNE, Zhiqiang JI
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Publication number: 20240425539Abstract: A compound of Ir(LA)m(LB)3-m, having a structure of is provided. In Formula I or Formula II, moieties A and B are each either a monocyclic ring or a polycyclic fused ring system; X1 to X8 and Z1 to Z4 are C or N; Y is a single atom linker, which can be substituted; each R1, R2, R3, R4, and R5 is hydrogen or a General Substituent; m is 1 or 2; at least one of R1, R2, and R3 comprises at least one first electron-withdrawing group; and at least one of R4 and R5 comprises at least one second electron-withdrawing group. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: August 23, 2024Publication date: December 26, 2024Applicant: Universal Display CorporationInventors: Alexey Borisovich Dyatkin, Wei-Chun Shih, Jui-Yi Tsai, Chun Lin, Derek Ian Wozniak
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Publication number: 20240425538Abstract: A compound having a first ligand LA including a structure of Formula I: In Formula I, ring A is 5-membered heterocyclic ring; each of Z1, Z2, and X1 to X5 is C or N; Y is a linking group; K is a direct bond or a linking group; RZ is a General Substituent defined herein; each other substituent is hydrogen or a General Substituent defined herein; and (1) two RC substituents are joined together to form a ring, or (2) the compound comprises an electron-withdrawing group. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: May 17, 2024Publication date: December 26, 2024Applicant: Universal Display CorporationInventors: Wei-Chun SHIH, Jui-Yi TSAI, Pierre-Luc T. BOUDREAULT, Chun LIN, Alexey Borisovich DYATKIN
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Patent number: 12176063Abstract: Systems and methods are provided for a computing-in memory circuit that includes a bit line and a plurality of computing cells connected to the bit line. Each of the plurality of computing cells includes a memory element, having a data output terminal; a logic element, having a first input terminal, a second input terminal and an output terminal, wherein the first input terminal is coupled to the data output terminal of the memory element, the second input terminal receives a select signal; and a capacitor, having a first terminal and a second terminal, where the first terminal is coupled to the output terminal of the logic element, the second terminal is coupled to the bit line. A voltage of the bit line is driven by the plurality of computing cells.Type: GrantFiled: August 10, 2022Date of Patent: December 24, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Chun Shih, Chia-Fu Lee, Yu-Der Chih, Jonathan Tsung-Yung Chang
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Patent number: 12176016Abstract: A memory device includes a plurality of circuit layers, a plurality of first conductive through via structures and a plurality of bitlines. The circuit layers are disposed one above another, and each circuit layer includes one or more memory cell arrays. The first conductive through via structures penetrates though the circuit layers. Each of the bitlines includes a plurality of bitline segments disposed on the circuit layers respectively. The bitline segments are electrically connected through one of the first conductive through via structures. Each bitline segment is coupled to a plurality of memory cells of a memory cell array of a circuit layer where the bitline segment is disposed.Type: GrantFiled: September 22, 2023Date of Patent: December 24, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Shih-Lien Linus Lu, Fong-Yuan Chang, Yi-Chun Shih
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Publication number: 20240423085Abstract: A compound comprising a first ligand LA of Formula I, is provided. In the compound, ring B is a 5- or 6-membered ring; each of Z and X1 to X4 is C or N; Y is a linking atom; K is a direct bond or a linking atom; each R*, RA, RB, and RC is hydrogen or a General Substituent defined herein; a total of at least two of RB and/or RC substituents are independently electron-withdrawing groups; and LA is coordinated to a metal M, having an atomic mass of at least 40. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: May 17, 2024Publication date: December 19, 2024Applicant: Universal Display CorporationInventors: Wei-Chun SHIH, Alexey Borisovich DYATKIN, Jerald FELDMAN
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Patent number: 12170105Abstract: A memory device includes a plurality of magnetoresistive random-access memory (MRAM) cells including a first one-time programmable (OTP) MRAM cell. A first OTP select transistor is connected to the first OTP MRAM cell. The first OTP select transistor configured to selectively apply a breakdown current to the first OTP MRAM cell to write the first OTP MRAM cell to a breakdown state.Type: GrantFiled: February 27, 2023Date of Patent: December 17, 2024Assignee: Taiwan Semiconductor Manufacturing Company, LtdInventors: Po-Hao Lee, Chia-Fu Lee, Yi-Chun Shih
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Publication number: 20240415003Abstract: A compound comprising a first ligand LA of Formula I, is provided. In Formula I, moiety A is a monocyclic ring or a polycyclic fused ring system, moiety B is a polycyclic fused ring system; each of Z1 to Z4 is C or N; each of K1 and K2 is a direct bond or a linker; at least one RB or RA comprises, where T is B, C, N, Si, Ge, Bi, or P; V is a direct bond or a linker; R1 and R2 are present, and R3 is optionally present; each substituent is independently hydrogen or a General Substituent defined herein; and at least two of R1, R2, and R3 has two or more carbon atoms. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: May 8, 2024Publication date: December 12, 2024Applicant: Universal Display CorporationInventors: Alexey Borisovich DYATKIN, Wei-Chun SHIH