Patents by Inventor Chun Yeh

Chun Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD WITH THERMALLY CONDUCTIVE LAYERS AND MANUFACTURING METHOD THEREFOR
    Publication number: 20130164556
    Abstract: An exemplary method for manufacturing a circuit board includes, firstly, providing a substrate made of heat conductive, electrically insulative material. Then a copper layer is formed on the substrate. After that, nickel is plated on the copper layer to form a nickel layer. Finally, gold is and plated on the nickel layer to form a gold layer.
    Type: Application
    Filed: August 15, 2012
    Publication date: June 27, 2013
    Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.
    Inventors: SUNG-HSIANG YANG, WEI-CHUN YEH, CHENG-CHAO CHAO
  • FLEXIBLE DISPLAY AND CONTROLLING METHOD THEREOF
    Publication number: 20130162546
    Abstract: A flexible display and a controlling method thereof are provided. The flexible display includes a plurality of pressure sensors, a display unit and a processing unit, wherein the processing unit is connected to the pressure sensors and the display unit. The processing unit obtains pressure values from each of the pressure sensors within a time unit and generates a pressure area and a pressure variance according to the pressure values from each of the pressure sensors. The processing unit further determines a display mode of the display unit according to the pressure area and the pressure variance. Therefore, the flexible display is capable of providing several kinds of display mode only based on the equipped pressure sensors.
    Type: Application
    Filed: March 30, 2012
    Publication date: June 27, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Po-Chun Yeh, Heng-Yin Chen, Yung-Hsiang Chiu, Wei-Yen Lee
  • LIGHT EMITTING DIODE (LED) LAMP ASSEMBLY
    Publication number: 20130163262
    Abstract: A lamp assembly comprises a lamp body, a bracket, and a securing member. The lamp body comprises a leg. The lamp body is arranged on the bracket. The securing member is mounted on the bracket and capable of moving relative to the bracket to press or away from the leg of the lamp body to achieve an assembly of the lamp body to the bracket or a disassembly of the lamp body from the bracket. The lamp body includes a plurality of light emitting diodes as a light source.
    Type: Application
    Filed: March 28, 2012
    Publication date: June 27, 2013
    Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.
    Inventors: SUNG-HSIANG YANG, WEI-CHUN YEH, CHENG-CHAO CHAO
  • THREE-DIMENSION CIRCUIT STRUCTURE AND SEMICONDUCTOR DEVICE
    Publication number: 20130154015
    Abstract: A three-dimension circuit structure includes a substrate, a first conductive layer, a filled material and a second conductive layer. The substrate has an upper surface and a cavity located at the upper surface. The first conductive layer covers the inside walls of the cavity and protrudes out the upper surface. The filled material fills the cavity and covers the first conductive layer. The second conductive layer covers the filled material and a portion of the first conductive layer, and the first conductive layer and the second conductive layer encapsulate the filled material. The material of the filled material is different from that of the first conductive layer and the second conductive layer.
    Type: Application
    Filed: August 13, 2012
    Publication date: June 20, 2013
    Applicant: E Ink Holdings Inc.
    Inventors: Wei-Chou Lan, Ted-Hong Shinn, Henry Wang, Chia-Chun Yeh
  • SELF-ASSEMBLY COATING MATERIAL, HEAT SINK AND METHOD OF FORMING HEAT SINK
    Publication number: 20130157041
    Abstract: A self-assembly coating material including carbon particles and polymer shells is provided. The polymer shells respectively cover and are bonded to the carbon particles, wherein each polymer shell has both a first functional group for adsorbing on a surface of a substrate and a second functional group for self cross-linking. The first functional groups include thiol groups. The second functional groups include epoxy groups or carboxylic groups. The self-assembly coating material can be applied to a metal substrate to form a heat dissipation layer.
    Type: Application
    Filed: September 12, 2012
    Publication date: June 20, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lin Hsin, Chih-Kuang Chang, Mei-Hua Wang, Ting-Yao Su, Hsiao-Chun Yeh
  • LIGHT SENSING DEVICE
    Publication number: 20130119372
    Abstract: A light sensing device is disclosed. The light sensing device includes a first light sensor and a second light sensor. The first light sensor formed on a substrate includes a first metal oxide semiconductor layer for absorbing a first light having a first waveband. The second light sensor formed on the substrate includes a second metal oxide semiconductor layer and an organic light-sensitive layer on the second metal oxide semiconductor layer for absorbing a second light having a second waveband.
    Type: Application
    Filed: July 17, 2012
    Publication date: May 16, 2013
    Applicant: E INK HOLDINGS INC.
    Inventors: Chia-Chun YEH, Henry WANG, Wei-Chou LAN, Ted-Hong SHINN
  • ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20130105789
    Abstract: Disclosed herein is a method for manufacturing an array substrate. The method includes forming a source electrode and a drain electrode on a substrate. A semiconductor layer, an organic insulating layer, and a gate electrode layer are sequentially formed to cover the substrate, the source electrode, and the drain electrode. A patterned photoresist layer is formed on the gate electrode layer. The exposed portion of the gate electrode layer, and a portion of the organic insulative layer and a portion of the semiconductor layer thereunder are removed to form a gate electrode. An organic passivation layer is formed on the gate electrode, the source electrode, and the drain electrode. The organic passivation layer has a contact window to expose a portion of the drain electrode. A pixel electrode is formed on the organic passivation layer and the exposed portion of the drain electrode.
    Type: Application
    Filed: June 21, 2012
    Publication date: May 2, 2013
    Applicant: E Ink Holdings Inc.
    Inventors: Wei-Chou LAN, Ted-Hong SHINN, Henry WANG, Chia-Chun YEH
  • METAL OXIDE THIN FILM TRANSISTOR
    Publication number: 20130087781
    Abstract: A metal oxide thin film transistor (TFT) includes a gate electrode, a gate insulating layer, a metal oxide active layer, a source electrode, and a drain electrode. The gate electrode is formed on a substrate. The gate insulating layer is formed on the substrate and covers the gate electrode. The metal oxide active layer is formed on the gate insulating layer. The drain electrode and the source electrode are formed on two opposite ends of the metal oxide active layer in a spaced-apart manner, in which at least one of the orthographic projection of the source electrode and the orthographic projection of the drain to electrode on the substrate does not overlap the gate electrode.
    Type: Application
    Filed: August 22, 2012
    Publication date: April 11, 2013
    Applicant: E INK HOLDINGS INC.
    Inventors: Chia-Chun YEH, Henry WANG, Xue-Hung TSAI, Chih-Hsuan WANG
  • Catalyst carrier, catalyst thereon and C-C coupling method use the same
    Patent number: 8415504
    Abstract: The disclosure provides a catalyst carrier, including a nano carbon material; and a polymer grafted on the nano carbon material, wherein the polymer has a repetitive unit comprising a phosphorous atom. The disclosure further provides a catalyst deposited on the catalyst carrier of the disclosure. The catalyst of the disclosure has high reactivity, and is easy to be recovered in C—C coupling reactions such as a Suzuki-Miyaura coupling reaction.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: April 9, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Mao-Lin Hsueh, Cheng-Wei Yeh, Kuo-Chen Shih, Hsiao-Chun Yeh, Yi-Zhen Chen
  • Method of selective photo-enhanced wet oxidation for nitride layer regrowth on substrates
    Patent number: 8409892
    Abstract: Various embodiments of the present disclosure pertain to selective photo-enhanced wet oxidation for nitride layer regrowth on substrates. In one aspect, a method may comprise: forming a first III-nitride layer with a first low bandgap energy on a first surface of a substrate; forming a second III-nitride layer with a first high bandgap energy on the first III-nitride layer; transforming portions of the first III-nitride layer into a plurality of III-oxide stripes by photo-enhanced wet oxidation; forming a plurality of III-nitride nanowires with a second low bandgap energy on the second III-nitride layer between the III-oxide stripes; and selectively transforming at least some of the III-nitride nanowires into III-oxide nanowires by selective photo-enhanced oxidation.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: April 2, 2013
    Assignee: Opto Tech Corporation
    Inventors: Lung-Han Peng, Jeng-Wei Yu, Po-Chun Yeh
  • Light-emitting diode array
    Patent number: D681559
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: May 7, 2013
    Assignee: Epistar Corporation
    Inventors: Chien-Fu Shen, Tsun-Kai Ko, Hui-Chun Yeh
  • Light-emitting diode array
    Patent number: D681560
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: May 7, 2013
    Assignee: Epistar Corporation
    Inventors: Chien-Fu Shen, Tsun-Kai Ko, Hui-Chun Yeh
  • Light-emitting diode array
    Patent number: D681561
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: May 7, 2013
    Assignee: Epistar Corporation
    Inventors: Chien-Fu Shen, Tsun-Kai Ko, Hui-Chun Yeh
  • Light-emitting diode array
    Patent number: D681562
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: May 7, 2013
    Assignee: Epistar Corporation
    Inventors: Chien-Fu Shen, Tsun-Kai Ko, Hui-Chun Yeh
  • Light-emitting diode array
    Patent number: D681565
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: May 7, 2013
    Assignee: Epistar Corporation
    Inventors: Hui-chun Yeh, Chien-Fu Shen, Tsun-Kai Ko
  • Light-emitting diode array
    Patent number: D681566
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: May 7, 2013
    Assignee: Epistar Corporation
    Inventors: Chao-Hsing Chen, Hui-chun Yeh, Chien-Fu Shen
  • Light-emitting diode array
    Patent number: D681568
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: May 7, 2013
    Assignee: Epistar Corporation
    Inventors: Hui-chun Yeh, Chien-Fu Shen, Tsun-Kai Ko
  • Light-emitting diode array
    Patent number: D681569
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: May 7, 2013
    Assignee: Epistar Corporation
    Inventors: Hui-chun Yeh, Chien-Fu Shen, Tsun-Kai Ko
  • LED lamp cover
    Patent number: D681866
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: May 7, 2013
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chu-Keng Lin, Sung-Hsiang Yang, Wei-Chun Yeh
  • Light-emitting diode array
    Patent number: D684550
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: June 18, 2013
    Assignee: Epistar Corporation
    Inventors: Hui-chun Yeh, Chien-fu Shen, Tsun-kai Ko