Patents by Inventor Chun-Yen Tsai
Chun-Yen Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240111138Abstract: A catadioptric optical membrane, which is disposed on a surface of a substrate, includes a reflection membrane and a matting membrane. The reflection membrane is disposed on an effective optical path area of the substrate and includes a reflection metal membrane and a reflection oxidation membrane. The reflection oxidation membrane includes a first reflection oxidation membrane and a second reflection oxidation membrane. The reflection metal membrane is farther away from the substrate than the first reflection oxidation membrane. The second reflection oxidation membrane is farther away from the substrate than the reflection metal membrane. The matting membrane is disposed on a non-effective optical path area of the substrate. The matting membrane includes a deep-color membrane and a first anti-reflection membrane. The deep-color membrane includes a deep-color metal membrane and a deep-color oxidation membrane. The deep-color membrane is farther away from the substrate than the first anti-reflection membrane.Type: ApplicationFiled: September 27, 2023Publication date: April 4, 2024Inventors: Wen-Yu TSAI, Shih-Han CHEN, Chun-Yen CHEN, Cheng-Yu TSAI, Chun-Hung TENG
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Patent number: 11944412Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.Type: GrantFiled: June 2, 2021Date of Patent: April 2, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
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Patent number: 11937903Abstract: A blood pressure device includes a first blood pressure measuring device, a second blood pressure measuring device, and a controller. The first blood pressure measuring device is to be worn on a first position of a wrist so as to obtain a first blood pressure information of the first position. The second blood pressure measuring device is to be worn on a second position of the wrist so as to obtain a second blood pressure information of the second position. The controller is electrically coupled to the first blood pressure measuring device and the second blood pressure measuring device so as to adjust tightness between the expanders and the user's skin, respectively. The controller receives, processes, and calculates a pulse transit time between the first blood pressure information and the second blood pressure information, and the controller obtains at least one blood pressure value based on the pulse transit time.Type: GrantFiled: December 29, 2020Date of Patent: March 26, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Yung-Lung Han, Chi-Feng Huang, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Chin-Wen Hsieh
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Publication number: 20240071981Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.Type: ApplicationFiled: November 1, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo-Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo, Yu-Chia Lai, Chih-Hsuan Tai
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Patent number: 11231468Abstract: Inspection apparatus is provided for inspecting a first electronic device and a second electronic device. The inspection apparatus includes a first signal transfer unit, a second signal transfer unit, a first signal output unit and a second signal output unit. The first signal transfer unit is adapted to receive a first input signal. The second signal transfer unit is adapted to receive a second input signal. The first signal output unit is selectively coupled to the first signal transfer unit or the second signal transfer unit to output a first output signal to inspect the first electronic device. The second signal output unit is selectively coupled to the first signal transfer unit or the second signal transfer unit to output a second output signal to inspect the second electronic device. The inspection apparatus can realize automatic inspection.Type: GrantFiled: June 26, 2019Date of Patent: January 25, 2022Assignee: WISTRON CORP.Inventors: Chung Kai Han, Yu Shan Huang, Po-Chuan Ku, Chun Yen Tsai
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Publication number: 20200284848Abstract: Inspection apparatus is provided for inspecting a first electronic device and a second electronic device. The inspection apparatus includes a first signal transfer unit, a second signal transfer unit, a first signal output unit and a second signal output unit. The first signal transfer unit is adapted to receive a first input signal. The second signal transfer unit is adapted to receive a second input signal. The first signal output unit is selectively coupled to the first signal transfer unit or the second signal transfer unit to output a first output signal to inspect the first electronic device. The second signal output unit is selectively coupled to the first signal transfer unit or the second signal transfer unit to output a second output signal to inspect the second electronic device. The inspection apparatus can realize automatic inspection.Type: ApplicationFiled: June 26, 2019Publication date: September 10, 2020Inventors: Chung Kai HAN, Yu Shan HUANG, Po-Chuan KU, Chun Yen TSAI
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Patent number: 10469726Abstract: A reversing display system with wireless switching multi-view images and a method thereof are disclosed. A remote controller is used to select an image area of a reversing image. A reversing display camera receives image area information and a partial enlargement instruction from the remote controller through a wireless receiver connected to the remote controller, enlarges the selected image area according to the partial enlargement instruction to produce a partial enlarged image, and transmits the partial enlarged image to an onboard display device for display. The system and method allow manipulation of reversing images through remote controller and can provide partial enlarged images to be displayed by the onboard display device.Type: GrantFiled: September 19, 2018Date of Patent: November 5, 2019Assignee: INVENTEC BESTA CO., LTD.Inventor: Chun-Yen Tsai
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Publication number: 20190208154Abstract: A reversing image display system with packet selection mechanism and a method thereof are provided. A reversing image display device is interconnected with a wireless receiver which receives wireless packet wirelessly. The wireless packet corresponding to the reversing image display device is filtered out, and an authentication identifier and a control signal are parsed from the filtered wireless packet for authentication. The control signal is transmitted to the reversing image display device after the authentication identifier passes authentication. As a result, the reversing image display device can perform function according to the control signal. Therefore, the efficiency of providing wireless packet filtered by the wireless receiver which is interconnected with reversing image display device may be achieved.Type: ApplicationFiled: December 29, 2017Publication date: July 4, 2019Inventor: Chun-Yen TSAI
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Patent number: 9279831Abstract: A probe card includes a circuit board and an integrated circuit (IC) test interface. The IC test interface includes a first probe assembly, disposed on a terminal of the circuit board, and a second probe assembly, disposed on another terminal of the circuit board, wherein the first probe assembly and the second probe assembly are separated to allow being independently assembled to, or disassembled from, the circuit board. Each of the first probe assembly and the second probe assembly includes a probe base, disposed on the circuit board; a plurality of needles, which are cantilever needles; and a covering layer, for covering the plurality of needles, and fixed on a surface of the probe base.Type: GrantFiled: August 16, 2012Date of Patent: March 8, 2016Assignee: NOVATEK Microelectronics Corp.Inventors: Chun-Yen Tsai, Nien-Tsung Hsueh
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Publication number: 20130162281Abstract: A probe card includes a circuit board and an integrated circuit (IC) test interface. The IC test interface includes a first probe assembly, disposed on a terminal of the circuit board, and a second probe assembly, disposed on another terminal of the circuit board, wherein the first probe assembly and the second probe assembly are separated to allow being independently assembled to, or disassembled from, the circuit board. Each of the first probe assembly and the second probe assembly includes a probe base, disposed on the circuit board; a plurality of needles, which are cantilever needles; and a covering layer, for covering the plurality of needles, and fixed on a surface of the probe base.Type: ApplicationFiled: August 16, 2012Publication date: June 27, 2013Inventors: Chun-Yen Tsai, Nien-Tsung Hsueh