Patents by Inventor Cindy Kay Goldberg

Cindy Kay Goldberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a copper layer over a semiconductor wafer
    Patent number: 6297155
    Abstract: A method for electroplating a copper layer (118) over a wafer (20) powers a cathode of an electroplating system (10) in a manner that obtains improved copper interconnects. A control system (34) powers the cathode of the system (10) with a mix of two or more of: (i) positive low-powered DC cycles (201 or 254); (ii) positive high-powered DC cycles (256 or 310); (iii) low-powered, pulsed, positive-power cycles (306 or 530); (iv) high-powered, pulsed, positive-powered cycles (212, 252, 302, or 352); and/or (v) negative pulsed cycles (214, 304, 510, 528, or 532). The collection of these cycles functions to electroplate copper or a like metal (118) onto the wafer (20). During electroplating, insitu process control and/or endpointing (506, 512, or 520) is performed to further improve the resulting copper interconnect.
    Type: Grant
    Filed: May 3, 1999
    Date of Patent: October 2, 2001
    Assignee: Motorola Inc.
    Inventors: Cindy Reidsema Simpson, Robert Douglas Mikkola, Matthew T. Herrick, Brett Caroline Baker, David Moralez Pena, Edward Acosta, Rina Chowdhury, Marijean Azrak, Cindy Kay Goldberg, Mohammed Rabiul Islam