Patents by Inventor Clifford Lee Henderson

Clifford Lee Henderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymers, methods of use thereof, and methods of decomposition thereof
    Patent number: 8956805
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: February 17, 2015
    Assignee: Georgia Tech Research Corporation
    Inventors: Paul A. Kohl, Sue Ann Bidstrup-Allen, Clifford Lee Henderson
  • POLYMERS, METHODS OF USE THEREOF, AND METHODS OF DECOMPOSITION THEREOF
    Publication number: 20130244181
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Application
    Filed: May 7, 2013
    Publication date: September 19, 2013
    Applicant: Georgia Tech Research Corporation
    Inventors: Paul A. Kohl, Sue Ann Bidstrup-Alllen, Clifford Lee Henderson
  • Polymers, methods of use thereof, and methods of decomposition thereof
    Patent number: 8455174
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: June 4, 2013
    Assignee: Georgia Tech Research Corporation
    Inventors: Paul A. Kohl, Sue Ann Bidstrup-Allen, Clifford Lee Henderson
  • Polymers, Methods Of Use Thereof, And Methods Of Decomposition Thereof
    Publication number: 20110136932
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Application
    Filed: October 28, 2010
    Publication date: June 9, 2011
    Applicant: GEORGIA TECH RESEARCH CORPORATION
    Inventors: Paul A. Kohl, Sue Ann Bidstrup-Allen, Clifford Lee Henderson
  • Polymers, methods of use thereof, and methods of decomposition thereof
    Patent number: 7799516
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: September 21, 2010
    Assignee: Georgia Tech Research Corporation
    Inventors: Paul A. Kohl, SueAnn Bidstrup Allen, Xiaoqun Wu, Clifford Lee Henderson
  • Polymers, Methods Of Use Thereof, And Methods Of Decomposition Thereof
    Publication number: 20100203294
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Application
    Filed: April 26, 2010
    Publication date: August 12, 2010
    Applicant: GEORGIA TECH RESEARCH CORPORATION
    Inventors: Paul A. Kohl, Sue Ann Bidstrup Allen, Xiaoqun Wu, Clifford Lee Henderson
  • Polymers, methods of use thereof, and methods of decomposition thereof
    Patent number: 7745100
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: June 29, 2010
    Assignee: Georgia Tech Research Corporation
    Inventors: Paul A. Kohl, SueAnn Bidstrup Allen, Xiaoqun Wu, Clifford Lee Henderson
  • Polymers, Methods Of Use Thereof, And Methods Of Decomposition Thereof
    Publication number: 20090069458
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Application
    Filed: June 17, 2008
    Publication date: March 12, 2009
    Applicant: GEORGIA TECH RESEARCH CORPORATION
    Inventors: Paul A. Kohl, Sue Ann Bidstrup Allen, Xiaoqun Wu, Clifford Lee Henderson
  • Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
    Patent number: 6888249
    Abstract: A method of forming an air gap or gaps within solid structures and specifically semiconductor structures to reduce capacitive coupling between electrical elements such as metal lines, wherein a sacrificial material is used to occupy a closed interior volume in a semiconductor structure is disclosed. The sacrificial material is caused to decompose into one or more gaseous decomposition products which are removed, in one embodiment by diffusion, through an overcoat layer. The decomposition of the sacrificial material leaves an air gap or gaps at the closed interior volume previously occupied by the sacrificial material. The air gaps may be disposed between electrical leads to minimize capacitive coupling therebetween. Also disclosed are methods of forming multi-level air gaps and methods or forming over-coated conductive lines or leads wherein a portion of the overcoating is in contact with at least one air gap.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: May 3, 2005
    Assignee: Georgia Tech Research Corporation
    Inventors: Paul Albert Kohl, Sue Ann Bidstrup Allen, Clifford Lee Henderson, Hollie Ann Reed, Dhananjay M. Bhusari
  • Polymers, methods of use thereof, and methods of decomposition thereof
    Publication number: 20040132855
    Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.
    Type: Application
    Filed: October 16, 2003
    Publication date: July 8, 2004
    Inventors: Paul A. Kohl, SueAnn Bidstrup Allen, Xiaoqun Wu, Clifford Lee Henderson
  • Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
    Publication number: 20040038513
    Abstract: A method of forming an air gap or gaps within solid structures and specifically semiconductor structures to reduce capacitive coupling between electrical elements such as metal lines, wherein a sacrificial material is used to occupy a closed interior volume in a semiconductor structure is disclosed. The sacrificial material is caused to decompose into one or more gaseous decomposition products which are removed, in one embodiment by diffusion, through an overcoat layer. The decomposition of the sacrificial material leaves an air gap or gaps at the closed interior volume previously occupied by the sacrificial material. The air gaps may be disposed between electrical leads to minimize capacitive coupling therebetween.
    Type: Application
    Filed: August 25, 2003
    Publication date: February 26, 2004
    Inventors: Paul Albert Kohl, Sue Ann Bidstrup Allen, Clifford Lee Henderson, Hollie Ann Reed, Dhananjay M. Bhusari
  • Fabrication of semiconductor device with air gaps for ultra low capacitance interconnections and methods of making same
    Patent number: 6610593
    Abstract: A method of forming an air gap or gaps within solid structures and specifically semiconductor structures to reduce capacitive coupling between electrical elements such as metal lines, wherein a sacrificial material is used to occupy a closed interior volume in a semiconductor structure is disclosed. The sacrificial material is caused to decompose into one or more gaseous decomposition products which are removed, in one embodiment by diffusion, through an overcoat layer. The decomposition of the sacrificial material leaves an air gap or gaps at the closed interior volume previously occupied by the sacrificial material. The air gaps may be disposed between electrical leads to minimize capacitive coupling therebetween. Also disclosed are methods of forming multi-level air gaps and methods or forming over-coated conductive lines or leads wherein a portion of the overcoating is in contact with at least one air gap.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: August 26, 2003
    Assignee: Georgia Tech Research Corporation
    Inventors: Paul Albert Kohl, Sue Ann Bidstrup Allen, Clifford Lee Henderson, Hollie Anne Reed, Dhananjay M. Bhusari
  • Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
    Publication number: 20020081787
    Abstract: A method of forming an air gap or gaps within solid structures and specifically semiconductor structures to reduce capacitive coupling between electrical elements such as metal lines, wherein a sacrificial material is used to occupy a closed interior volume in a semiconductor structure is disclosed. The sacrificial material is caused to decompose into one or more gaseous decomposition products which are removed, in one embodiment by diffusion, through an overcoat layer. The decomposition of the sacrificial material leaves an air gap or gaps at the closed interior volume previously occupied by the sacrificial material. The air gaps may be disposed between electrical leads to minimize capacitive coupling therebetween.
    Type: Application
    Filed: August 31, 2001
    Publication date: June 27, 2002
    Inventors: Paul Albert Kohl, Sue Ann Bldstrup Allen, Clifford Lee Henderson, Hollie Anne Reed, Dhananjay M. Bhusari