Patents by Inventor Cora Lynn Mau

Cora Lynn Mau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230289319
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Application
    Filed: April 12, 2023
    Publication date: September 14, 2023
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Patent number: 11657016
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: May 23, 2023
    Assignee: Altera Corporation
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Publication number: 20220066977
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Application
    Filed: November 9, 2021
    Publication date: March 3, 2022
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Patent number: 11169951
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: November 9, 2021
    Assignee: Altera Corporation
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Publication number: 20210064566
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Application
    Filed: November 12, 2020
    Publication date: March 4, 2021
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Patent number: 10936531
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: March 2, 2021
    Assignee: Altera Corporation
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Publication number: 20200183877
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Application
    Filed: February 17, 2020
    Publication date: June 11, 2020
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Patent number: 10565155
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: February 18, 2020
    Assignee: Altera Corporation
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Publication number: 20190179792
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 13, 2019
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Patent number: 10162789
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: December 25, 2018
    Assignee: Altera Corporation
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Publication number: 20170068638
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Application
    Filed: September 3, 2015
    Publication date: March 9, 2017
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau