Patents by Inventor Corinna Koepernik

Corinna Koepernik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer substrate, MEMS device and corresponding manufacturing method
    Patent number: 11623860
    Abstract: An interposer substrate, a MEMS device and a corresponding manufacturing method. The interposer substrate is equipped with a front side and a rear side, a cavity starting from the rear side, which extends up to a first depth, a through-opening and a sunken area situated between the cavity and the through-opening, which is sunken from the rear side up to a second depth in relation to the rear side, the first depth being greater than the second depth.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: April 11, 2023
    Assignee: ROBERT BOSCH GMBH
    Inventors: Corinna Koepernik, Joerg Muchow, Rainer Straub, Stefan Mark
  • Micromechanical component and method for producing a micromechanical component
    Patent number: 10866407
    Abstract: A micromechanical component includes a micromirror connected to a mounting support via at least one spring such that the micromirror is adjustable about at least one axis of rotation relative to the mounting support, where the micromirror includes a reflective surface developed at least partially on a first diaphragm surface of a mounted diaphragm of the micromirror, the diaphragm including a second diaphragm surface that faces away from the first diaphragm surface and that is mounted in air or vacuum.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: December 15, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Daniel Maier, Joerg Muchow, Corinna Koepernik, Helmut Grutzeck, Rainer Straub, Stefan Mark, Thorsten Balslink
  • INTERPOSER SUBSTRATE, MEMS DEVICE AND CORRESPONDING MANUFACTURING METHOD
    Publication number: 20200346921
    Abstract: An interposer substrate, a MEMS device and a corresponding manufacturing method. The interposer substrate is equipped with a front side and a rear side, a cavity starting from the rear side, which extends up to a first depth, a through-opening and a sunken area situated between the cavity and the through-opening, which is sunken from the rear side up to a second depth in relation to the rear side, the first depth being greater than the second depth.
    Type: Application
    Filed: November 30, 2018
    Publication date: November 5, 2020
    Inventors: Corinna Koepernik, Joerg Muchow, Rainer Straub, Stefan Mark
  • MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
    Publication number: 20190146210
    Abstract: A micromechanical component includes a micromirror connected to a mounting support via at least one spring such that the micromirror is adjustable about at least one axis of rotation relative to the mounting support, where the micrimirror includes a reflective surface developed at least partially on a first diaphragm surface of a mounted diaphragm of the micromirror, the diaphragm including a second diaphragm surface that faces away from the first diaphragm surface and that is mounted in air or vacuum.
    Type: Application
    Filed: November 14, 2018
    Publication date: May 16, 2019
    Inventors: Daniel Maier, Joerg Muchow, Corinna Koepernik, Helmut Grutzeck, Rainer Straub, Stefan Mark, Thorsten Balslink