Patents by Inventor Cristiano Gianluca STELLA

Cristiano Gianluca STELLA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130285230
    Abstract: A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink.
    Type: Application
    Filed: April 26, 2013
    Publication date: October 31, 2013
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Gaetano Pignataro, Maurizio Maria Ferrara
  • Patent number: 8472176
    Abstract: An integrated power adapter system for a portable computer may include a power adapter for providing power to the portable computer, extractable elements for connection to an external socket, and a dissipation grid for reducing the temperature of the cover screen. The power adapter system may be a slim power adapter system being removable from and integrated with the cover screen of the portable computer.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: June 25, 2013
    Assignee: STMicroelectronics S.R.L.
    Inventors: Cristiano Gianluca Stella, Giuseppe Consentino
  • Patent number: 8453917
    Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: June 4, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Concetto Privitera, Cristiano Gianluca Stella
  • Publication number: 20130003312
    Abstract: An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Cristiano Gianluca Stella, Concetto Privitera
  • Publication number: 20130003305
    Abstract: A device includes a first switch and a second switch, each switch being integrated on a chip having a back surface and an opposite front surface. Each chip includes a first conduction terminal and a control terminal on the front surface, while a second conduction terminal of the switch is located on the back surface. The first switch and the second switch are connected in a half-bridge configuration with the first switch's second conduction terminal electrically connected to the second switch's first conduction terminal. The chips are installed in a common package comprising an insulating body with an embedded heat sink. The chips of the switches are mounted on the heat sink such that the second conduction terminal of the first switch and the first conduction terminal of the second switch are in contact with the heat sink, with the heat sink providing the electrical connection between the two switches.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 3, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: Cristiano Gianluca Stella
  • Publication number: 20130003308
    Abstract: An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink extends above the free surface. The external heat-sink includes a first dissipative portion and a second dissipative portion for contacting the first and second heat-sinks on the free surface, respectively, as well as an insulating portion for electrically insulating the first dissipative portion from the second dissipative portion. The first dissipative portion and the second dissipative portion are symmetrical with respect to the insulating portion. An extension of the external heat-sink may provide a stabilizing element. The extension of the external heat-sink may alternatively thermally and electrically interconnect two insulating bodies, each body embedding at least one integrated circuit chip.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 3, 2013
    Applicant: STMicroelectronics S.r.l.
    Inventor: Cristiano Gianluca Stella
  • Publication number: 20130001763
    Abstract: An electronic device includes at least one electronic component chip having a first conduction terminal and a control terminal on a first surface of the chip and a second conduction terminal on a second surface opposite the first surface of the chip. An insulating body embeds the chip. The insulating body includes a mounting surface and an electrically conductive heat-sink connected to the first conduction terminal on the first surface of the chip, but insulated from the control terminal. An opening in a first surface of the insulating body exposes a surface of the electrically conductive heat sink. The electrically conductive heat sink includes a perimeter cavity configured for alignment with an encircling configuration of the control terminal, wherein the perimeter cavity contains a material that insulates the control terminal from the heat sink.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 3, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: Cristiano Gianluca Stella
  • Publication number: 20130001764
    Abstract: An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 3, 2013
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Agatino Carmelo Minotti
  • Publication number: 20130003309
    Abstract: An electronic device includes a first and second integrated chip switch, each having a back (drain) surface and an opposite front (source) surface. An insulating package embeds the switches along with first, second and third heat sinks. The front surface of the first switch and back surface of the second switch are mounted to the first heat sink to couple first switch source to the second switch drain through the first heat sink in a half-bridge configuration. The first switch back surface is mounted to the second heat sink and the second switch front surface is mounted to the third heat sink. The package includes first, second and third openings which expose, respectively, the first, second and third heat sinks. The first heat sink opening is provided on one surface of the package, while the second and third heat sink openings are provided on an opposite surface of the package.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 3, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: Cristiano Gianluca Stella
  • Publication number: 20130003313
    Abstract: An insulating body incorporates at least one integrated circuit chip and includes a mounting surface for mounting to a board and a free surface opposite the mounting surface. A heatsink is attached to the insulating body at the free surface. The heatsink includes at least one stabilizing element. The stabilizing element includes an attachment portion extending at least partially transversely to the free surface beyond a peripheral boundary of the free surface when considered in plan view. The attachment portion has a binding end bound to the free surface and a free end opposite the binding end. The stabilizing element also has a mounting portion extending from the free end of the attachment portion at least up to a plane of the mounting surface.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Concetto Privitera
  • Publication number: 20130003311
    Abstract: First and second electronic devices each include an insulating package embedding a chip of semiconductor material which integrates at least one electronic component. Each insulating package has a mounting surface for mounting the respective electronic device on a substrate and an opposite free surface. A heatsink is fixed to the free surfaces through respective first and second base portions. A connection element is configured to connect the first base portion to the second base portion. The heatsink also includes, for each electronic device, at least one stabilizing element extending from the respective base portion to make contact with a substrate to which the mounting surfaces of the first and second electronic devices are attached.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Concetto Privitera, Cristiano Gianluca Stella
  • Publication number: 20120014057
    Abstract: An integrated power adapter system for a portable computer may include a power adapter for providing power to the portable computer, extractable elements for connection to an external socket, and a dissipation grid for reducing the temperature of the cover screen. The power adapter system may be a slim power adapter system being removable from and integrated with the cover screen of the portable computer.
    Type: Application
    Filed: July 18, 2011
    Publication date: January 19, 2012
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca STELLA, Giuseppe Consentino