Patents by Inventor Cyndi L Brodbeck

Cyndi L Brodbeck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7019399
    Abstract: The invention relatse to a copper diffusion barrier which includes a diamond-like material includes carbon, hydrogen, silicon, oxygen and a metal and is a copper diffusion barrier. Another aspect of the invention relates to an integrated circuit which includes a copper interconnect, a dielectric material and the copper diffusion barrier.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: March 28, 2006
    Assignee: N.V. Bekaert S.A.
    Inventors: Chandra Venkatraman, Cyndi L Brodbeck, Matthew P. Kirk
  • Publication number: 20040124531
    Abstract: The invention relatse to a copper diffusion barrier which includes a diamond-like material includes carbon, hydrogen, silicon, oxygen and a metal and is a copper diffusion barrier. Another aspect of the invention relates to an integrated circuit which includes a copper interconnect, a dielectric material and the copper diffusion barrier.
    Type: Application
    Filed: January 30, 2004
    Publication date: July 1, 2004
    Inventors: Chandra Venkatraman, Cyndi L Brodbeck, Matthew P Kirk
  • Publication number: 20030141499
    Abstract: The invention relates to a material including carbon, oxygen, silicon and hydrogen and having a dielectric constant of from about 2.1 to about 3.0 where an FTIR scan of the material includes at least two major peaks signifying Si—CH3 bonding. The invention further relates to a material which has a variable dielectric constant through the thickness of the material. Another aspect of the invention is the method of making the material.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 31, 2003
    Inventors: Chandra Venkatraman, Cyndi L Brodbeck