Abstract: The invention concerns a control device comprising a circuit generating REF reference voltages (VPOL1, VPOL2) comprising three P-type MOS transistors (M12, M13 and M14) connected in series between a high-voltage input node (EHV) and the earth (GND), and supplying on the drain and the source of the middle transistor (M13) reference voltages (VPOL1, VPOL2). ?Said device comprises means for controlling the reference transistors either, in a first operating mode, to force the first reference transistor (M12) in current source, the second reference transistor (M13) in off-state and short-circuit the third reference transistor (M14) to the earth, or, in a second operating mode, in connecting each of said transistors in diode, their gate and their drain being connected, on the basis of a logic control signal (/WR). Thus, the resulting reference voltages in output are based on said logic signal.

Abstract: The FAMOS memory location comprises a single floating gate (GR) overlapping an active surface of a semiconductor substrate according to at least two asymmetrical overlap profiles (PF1, PF2) so as to define at least two electrodes in the active region. Memory location programming means (MC, SW) are capable of selectively applying different predetermined sets of bias voltages to the electrodes so as to confer at least three programming logic levels on the memory location.

Abstract: The semiconductor memory device includes a non-volatile programmable and electrically erasable memory cell with a single layer of gate material and a floating gate transistor and a control gate, within an active semiconducting area formed in a region of the substrate and delimited by an isolation region. The layer of gate material in which the floating gate is made extends integrally above the active area without overlapping part of the isolation region, and the transistor is electrically isolated from the control gate by PN junctions that will be inverse polarized.

Abstract: An FAMOS memory includes memory cells, with each memory cell including an insulated gate transistor, and a first access transistor having a drain connected to a source of the insulated gate transistor. The FAMOS memory also includes an insulation transistor having a drain and a source respectively connected to the source of the insulated gate transistors of two adjacent cells of a same row. Each insulated gate transistor has a ring structure, and a ladder-shaped separation region insulates the cells of the same row.

Abstract: A FAMOS memory cell is electrically erased. The FAMOS memory cell may be electrically erased by applying to the substrate a voltage having a value at least 4 volts higher than the lower of a voltage applied to the source and a voltage applied to the drain. The voltage applied to the substrate is also less than a predetermined limit above which the memory cell is destroyed.

Abstract: A non-volatile memory architecture with a word-based organization includes one selection transistor per word. This selection transistor is used for the selection of the word by the source of the memory cells. In this way, the selection may be done directly by the ouput signals from the address decoders using low voltage. The switching of a high voltage to the gates and the drains of the memory cells is done independently of this selection. This enables the required number of high voltage switches to be reduced.

Abstract: A non-volatile memory cell includes a MOS transistor having a ring arrangement and comprising a floating gate, a center electrode at a center of the ring arrangement and surrounding the floating gate, and at least one peripheral electrode along a periphery of the ring arrangement.

Abstract: A high voltage switching device includes a switching circuit for switching a high voltage to an output line and for providing a control signal. The high voltage switching device also includes a switching transistor connected to the switching circuit for switching a low voltage to the output line based upon the control signal. The output signal is controlled by a control circuit that sets up a control loop between the drop in the gate voltage level of the switching transistor and the voltage level of the output line that is controlled by the switching circuit.

Abstract: The FAMOS memory location comprises a single floating gate (GR) overlapping an active surface of a semiconductor substrate according to at least two asymmetrical overlap profiles (PF1, PF2) so as to define at least two electrodes in the active region. Memory location programming means (MC, SW) are capable of selectively applying different predetermined sets of bias voltages to the electrodes so as to confer at least three programming logic levels on the memory location.

Abstract: A non-volatile memory architecture with a word-based organization includes one selection transistor per word. This selection transistor is used for the selection of the word by the source of the memory cells. In this way, the selection may be done directly by the output signals from the address decoders using low voltage. The switching of a high voltage to the gates and the drains of the memory cells is done independently of this selection. This enables the required number of high voltage switches to be reduced.

Abstract: An FAMOS memory includes memory cells, with each memory cell including an insulated gate transistor, and a first access transistor having a drain connected to a source of the insulated gate transistor. The FAMOS memory also includes an insulation transistor having a drain and a source respectively connected to the source of the insulated gate transistors of two adjacent cells of a same row. Each insulated gate transistor has a ring structure, and a ladder-shaped separation region insulates the cells of the same row.

Abstract: A FAMOS memory cell is electrically erased. The FAMOS memory cell may be electrically erased by applying to the substrate a voltage having a value at least 4 volts higher than the lower of a voltage applied to the source and a voltage applied to the drain. The voltage applied to the substrate is also less than a predetermined limit above which the memory cell is destroyed.

Abstract: A high voltage switching device includes a switching circuit for switching a high voltage to an output line and for providing a control signal. The high voltage switching device also includes a switching transistor connected to the switching circuit for switching a low voltage to the output line based upon the control signal. The output signal is controlled by a control circuit that sets up a control loop between the drop in the gate voltage level of the switching transistor and the voltage level of the output line that is controlled by the switching circuit.

Abstract: A non-volatile memory cell includes a MOS transistor having a ring arrangement and comprising a floating gate, a center electrode at a center of the ring arrangement and surrounding the floating gate, and at least one peripheral electrode along a periphery of the ring arrangement.