Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.

Abstract: Disclosed is a method of establishing secure communications between nodes in a cloud environment. The method includes receiving a log-in of a first user, receiving a log-in of a second user and presenting to the first user one or more options to use a secure inter-user communication security service leveraging quantum teleportation in order to communication with the second user, wherein the secure inter-user communication security service optionally uses a quantum EPR processor (QEP). The one or more options include applying the secure inter-user communication security service using QEP to generate EPR Bell state pairs and applying security via quantum teleportation for communications between the first user and the second user and applying the secure inter-user communication security service to securely control communication between a first container associated with the first user and a second container associated with the second user and associated daemons leveraging the QEP.

Abstract: An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.

Abstract: The present technology pertains to a distributed server system for verifying vendors. The distributed server system comprises one or more nodes on a distributed network; a communication interface of a first node that communicates over a communication network with the one or more nodes on the distributed network, wherein the communication interface receives information about a unique seal associated with a product in response to a query; and a processor of the first node that executes instructions stored in memory, wherein execution of the instructions by the processor verifies that a vendor is associated with the unique seal has been appended to a distributed ledger, determines a match between the unique seal and the vendor; and, after determining the match, confirms that the vendor is a certified vendor of the product.

Abstract: In one embodiment, a method includes receiving power delivered over a data fiber cable at an optical transceiver installed at a network communications device and transmitting data and the power from the optical transceiver to the network communications device. The network communications device is powered by the power received from the optical transceiver. An apparatus is also disclosed herein.

Abstract: The techniques described herein relate to an apparatus including: a support structure of an integrated circuit device; and an elongated cavity formed in the support structure of the integrated circuit device, wherein an interior of the elongated cavity is plated with a conductive material separated into a first power connection portion and a first ground connection portion.

Abstract: In one embodiment, a method includes receiving power delivered over a data fiber cable at an optical transceiver installed at a network communications device and transmitting data and the power from the optical transceiver to the network communications device. The network communications device is powered by the power received from the optical transceiver. An apparatus is also disclosed herein.

Abstract: A communication interconnect system is described. The system may include a co-packaged cables (CPC) tile with a slot formed from a first surface to slot surface at a first depth in the CPC tile and a plurality of channels formed between the slot surface and a second surface opposite the first surface. The system may also include a twinaxial cable with a pair of conductors positioned in the slot such that the pair of conductors are inserted in a pair of channels of the plurality of channels to establish an electrical connection between the twinaxial cable and the pair of channels. The system also includes a plurality of elastomer pins positioned in the plurality of channels adjacent to the second surface.

Abstract: Disclosed are a system and method of establishing secure communications between nodes in a cloud environment. The method includes receiving a registration of a first user at a quantum processor service provider, receiving at the quantum processor service provider a request for authentication of the first registered user, the request comprising at least the password and the registration number, when the password and registration number match stored data at the quantum processor service provider for the first registered user, generating an EPR entangled pair and transmitting the EPR entangled pair to a first computing device of the first registered user, wherein the first registered user utilizes the EPR entangled pair in order to communicate with a second computing device associated with a second registered user. The quantum processor service provider can include a quantum EPR (Einstein Podoslky and Rosen) processor (QEP) and a logically co-located computer server.

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

Abstract: Disclosed are a system and method of establishing secure communications between nodes in a cloud environment. The method includes receiving a registration of a first user at a quantum processor service provider, receiving at the quantum processor service provider a request for authentication of the first registered user, the request comprising at least the password and the registration number, when the password and registration number match stored data at the quantum processor service provider for the first registered user, generating an EPR entangled pair and transmitting the EPR entangled pair to a first computing device of the first registered user, wherein the first registered user utilizes the EPR entangled pair in order to communicate with a second computing device associated with a second registered user. The quantum processor service provider can include a quantum EPR (Einstein Podoslky and Rosen) processor (QEP) and a logically co-located computer server.

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

Abstract: A composite connector includes modular data connectors, electrical power connectors, a fluid exchange connector, an alignment feature, and a housing. The modular data connectors include electrical data connectors and optical data connectors and are configured to carry data. The electrical power connectors are configured to carry electrical power, and the fluid exchange connector is configured to carry cooling fluid. The composite connector includes an alignment feature to align the composite connector with a complementary connector. The housing of the composite connector is configured to contain the modular data connectors, the electrical power connectors, the fluid exchange connector, and the alignment feature in a confined physical space.

Abstract: A system includes a cage and a first coil. The cage includes a first end and a second end opposite the first end. The first end is arranged to receive an electrical connector. The second end is arranged to receive a pluggable module such that the electrical connector forms an electrical connection with the pluggable module. The first coil is positioned on or in the cage such that the first coil is arranged to deliver electric power to the pluggable module by inducing an electric current in a second coil positioned in or on the pluggable module when the pluggable module is connected to the electrical connector in the cage.

Abstract: Disclosed herein are systems, methods, and computer-readable media for causing an user equipment (UE) to connect to a non-public network (NPN) while meeting time and location requirements. In one aspect, a method includes receiving, by the UE and from a home public land mobile network (h-PLMN), a steering of roaming update providing a steering of roaming record. In one aspect, the UE, is configured based on the steering of roaming record, to connect to the non-public network (NPN) when a context of the UE meets time and location requirements. In one aspect, the method includes establishing, by the UE, a session with the NPN when the context of the UE meets the time and location requirements.

Abstract: A multi-layer substrate stacking a plurality of insulating substrates supports one or more devices. Each substrate includes a face supporting conductive traces and edges surrounding the face at a substantially perpendicular angle. The multi-layer substrate includes a ground plane on a first substrate and a power plane on a second substrate. The ground plane is connected to at least one ground pad disposed on a first edge of the first substrate, which provides a low inductance ground path to the ground plane. The power plane is connected to at least one power pad disposed on a second edge of the second substrate, which provides a low inductance power path to the power plane.

Abstract: An apparatus is provided that includes a thin-film interconnect structure that comprises one or more polymeric layers and conductive plating, a first surface of the thin-film interconnect structure being configured to receive one or more dies, and a second surface of the thin-film interconnect structure being configured to receive a substrate. A method of assembling the apparatus into an integrated circuit assembly is also provided.

Abstract: Embodiments presented in this disclosure generally relate to techniques for interconnecting integrated circuits. More specifically, embodiments disclosed herein provide a back mounted interposer (BMI) to facilitate interconnecting of integrated circuits. One example apparatus includes an integrated circuit, an interposer, and a circuit board, at least a portion of the circuit board being disposed between the integrated circuit and the interposer, where the circuit board is configured to provide electrical connection between the interposer and the integrated circuit via connection elements on a first surface of the interposer. The apparatus also includes an interface on a second surface of the interposer, the interface being configured to provide signals from the integrated circuit to an electrical component.