Patents by Inventor Dae Jin SHIM

Dae Jin SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250104915
    Abstract: A release film including: a base film; and a release layer disposed on one surface of the base film, wherein the release layer is a cured layer of a release composition including a heterocyclic compound including nitrogen and polydimethylsiloxane, and when analyzing a surface using X-ray photoelectron spectroscopy (XPS), the release layer has an atomic ratio of nitrogen (N) to silicon (Si) (N/Si) of 0.6 to 1.1.
    Type: Application
    Filed: June 4, 2024
    Publication date: March 27, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jin SHIM, Jung Jin PARK, Jung Jin PARK, Jae Won KIM, Hyo Sung CHOI, Nam Ju YOO, Jung Hee KIM, Jong Ho LEE
  • Publication number: 20240249882
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes, and including first and second surfaces, third and fourth surfaces, fifth and sixth surfaces, external electrodes disposed on the third and fourth surfaces, and side margin portions disposed on the fifth and sixth surfaces. The side margin portions include a first region adjacent to the internal electrodes and a second region adjacent to outside of the side margin portions. In a Raman spectra obtained by analyzing one point located in the first and second region respectively, peak X appears in a Raman shift of 450 cm?1 to 600 cm?1. When a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the first region is ?(cm?1), a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the second region is ?+0.75 cm?1 or greater.
    Type: Application
    Filed: November 6, 2023
    Publication date: July 25, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yun JEONG, Dong Jun JUNG, Hyun Sik CHAE, Ji Eun PARK, Sim Chung KANG, Dae Jin SHIM, Eun Jung LEE
  • Publication number: 20240203661
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction; external electrodes disposed on the body; and side margin portions disposed on the body, wherein an average content of Sn included in the side margin portion is 0.1 mol % or more and 4.0 mol % or less, wherein a Ba/Ti ratio of the side margin portion is greater than 1.040 and less than 1.070, and wherein an average size of a plurality of dielectric grains included in the side margin portion satisfies 100 nm or more and 290 nm or less.
    Type: Application
    Filed: October 27, 2023
    Publication date: June 20, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sim Chung KANG, Jong Ho LEE, Eun Jung LEE, Hyun Sik CHAE, Sun Mi KIM, Dae Jin SHIM
  • Publication number: 20240170216
    Abstract: A film for manufacturing an electronic component includes a polymer layer and conductive nanowires and magnetic nanoparticles dispersed in the polymer layer.
    Type: Application
    Filed: July 5, 2023
    Publication date: May 23, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Jin PARK, Dae Jin SHIM, Jung Jin PARK, Jae Won KIM, Hyo Sung CHOI, Ho Sam CHOI, Sun Mi KIM, Jong Ho LEE
  • Publication number: 20230156896
    Abstract: A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.
    Type: Application
    Filed: June 2, 2022
    Publication date: May 18, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jin SHIM, Jung Jin PARK, Su Min KIM, Jong Ho LEE, Eun Jung LEE, Jung Jin PARK