Patents by Inventor Daichi Okamoto

Daichi Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9891523
    Abstract: Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: February 13, 2018
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Daichi Okamoto, Nobuhito Ito, Shoji Minegishi
  • Patent number: 9540850
    Abstract: A vehicle door handle device, which is mounted on a side of a vehicle door facing a passenger compartment, includes: a door lock knob provided on a base member such that the door lock knob is pivotable between a locking position for placing the door in a locked state and an unlocking position for placing the door in an unlocked position; and a stopper provided on the base member between the locking position and the unlocking position for limiting pivoting movement of the door lock knob. The stopper has an elastic section, and the door lock knob has a locking surface section for abutting against the elastic section of the stopper when the door lock knob is in the locking position and an unlocking surface section for abutting against the elastic section of the stopper when the door lock knob is in the unlocking position.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: January 10, 2017
    Assignees: HONDA MOTOR CO., LTD, ALPHA CORPORATION
    Inventors: Kenichi Tanoguchi, Daichi Okamoto, Katsuya Ashizawa, Yutaka Saito
  • Patent number: 9497856
    Abstract: A laminated structure including a base material and resin insulating layers formed on the base material. The resin insulating layers include a resin insulating layer (A) containing a curing accelerator composed of an N atom-containing basic compound such that the resin insulating layer (A) is in contact with the base material. The laminated structure includes a resin insulating layer (B) which contains a P atom-containing curing accelerator in addition to the resin insulating layer (A).
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: November 15, 2016
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Daichi Okamoto, Shoji Minegishi, Masao Arima
  • Patent number: 9388308
    Abstract: The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: July 12, 2016
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Daichi Okamoto, Shoji Minegishi
  • Patent number: 9298096
    Abstract: An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30° C. and Tgy<0° C. and the thermosetting component (B) having a glass transition point Tgz, which satisfies Tgz?Tgy+20° C. Moreover, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are obtained.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: March 29, 2016
    Assignee: Taiyo Ink Mfg. Co., Ltd.
    Inventors: Kazuya Okada, Shuichi Yamamoto, Shoji Minegishi, Daichi Okamoto, Xiaozhu Wei
  • Publication number: 20150382473
    Abstract: Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 31, 2015
    Applicant: Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Daichi OKAMOTO, Nobuhito ITO, Shoji MINEGISHI
  • Publication number: 20150240071
    Abstract: The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition.
    Type: Application
    Filed: September 26, 2013
    Publication date: August 27, 2015
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Daichi Okamoto, Shoji Minegishi
  • Publication number: 20150010735
    Abstract: An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30° C. and Tgy<0° C. and the thermosetting component (B) having a glass transition point Tgz, which satisfies Tgz?Tgy+20° C. Moreover, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are obtained.
    Type: Application
    Filed: July 7, 2014
    Publication date: January 8, 2015
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Kazuya OKADA, Shuichi YAMAMOTO, Shoji MINEGISHI, Daichi OKAMOTO, Xiaozhu WEI
  • Publication number: 20140374143
    Abstract: The present invention provides a dry film which can obtain a solder resist having an excellent resolution while maintaining various characteristics including PCT resistance, a laminated structure such as a printed writing board, and a method of producing the laminated structure. A dry film comprising: a film; and a photosensitive resin layer formed on the film, wherein the absorption coefficient (?) of the photosensitive resin layer at a wavelength of 365 nm has an increase gradient or a decrease gradient from a surface of the photosensitive resin layer toward a surface of the film.
    Type: Application
    Filed: December 25, 2012
    Publication date: December 25, 2014
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Daichi Okamoto, Nobuhito Ito, Shoji Minegishi
  • Publication number: 20140217756
    Abstract: A vehicle door handle device, which is mounted on a side of a vehicle door facing a passenger compartment, includes: a door lock knob provided on a base member such that the door lock knob is pivotable between a locking position for placing the door in a locked state and an unlocking position for placing the door in an unlocked position; and a stopper provided on the base member between the locking position and the unlocking position for limiting pivoting movement of the door lock knob. The stopper has an elastic section, and the door lock knob has a locking surface section for abutting against the elastic section of the stopper when the door lock knob is in the locking position and an unlocking surface section for abutting against the elastic section of the stopper when the door lock knob is in the unlocking position.
    Type: Application
    Filed: February 3, 2014
    Publication date: August 7, 2014
    Applicants: ALPHA Corporation, Honda Motor Co., Ltd.
    Inventors: Kenichi Tanoguchi, Daichi Okamoto, Katsuya Ashizawa, Yutaka Saito
  • Patent number: 8702153
    Abstract: Provided is a vehicular door including a load transfer member. The load transfer member includes a transfer member body disposed in a wide-thickness portion in a door body, and a projection projecting downward from the transfer member body. The transfer member body has a lower region whose surface on a door-outer-panel side abuts on, or comes close to, the inner surface of the door outer panel, and an inclined region whose door-outer-panel side surface is inclined to come apart from the door outer panel and whose surface on a door-inner-panel side abuts on, or comes close to, the inner surface of the door inner panel. The thickness of the lower region and the inclined region in a door-thickness direction is set narrower than the width of an insertion portion between the door inner panel and a door beam.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: April 22, 2014
    Assignee: Honda Motor Co., Ltd
    Inventors: Kiyohito Kurokawa, Masakazu Takahashi, Itaru Genpei, Shingo Hakamata, Isamu Nakanishi, Tomofumi Ichinose, Daichi Okamoto, Hakurei Watanabe, Mai Kato, Yuji Nozawa, Yoshihisa Sugamata
  • Publication number: 20130256017
    Abstract: [Problems] The present invention provides a laminated structure comprising resin insulating layers which exhibits excellent adhesion to a base material and has excellent insulation reliability; and a dry film used for the production of the laminated structure. [Means for Solution] Provided is a laminated structure comprising a base material and a plurality of resin insulating layers formed thereon, which is characterized in that a layer of the plurality of resin insulating layers, which is in contact with the base material, is a resin insulating layer (A) which contains a curing accelerator composed of an N atom-containing basic compound; and that the laminated structure comprises a resin insulating layer (B) which contains a P atom-containing curing accelerator in addition to the resin insulating layer (A) which contains a curing accelerator composed of an N atom-containing basic compound.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 3, 2013
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Daichi OKAMOTO, Shoji Minegishi, Masao Arima
  • Patent number: 8528949
    Abstract: A door handle stroke change structure includes a latch mechanism, an electric latch drive mechanism, a mechanical latch drive mechanism, and an operation member which operates the electric latch drive mechanism and the mechanical latch drive mechanism. The operation member is moveable among a closed position, a first position at which the electric latch drive mechanism is operated, and a second position at which the mechanical latch drive mechanism is operated. A motion to move the operation member from the closed position to the first position is a same motion as a motion to move the operation member from the closed position to the second position. A movement amount of the operation member from the closed position to the first position is greater than a movement amount of the operation member from the closed position to the second position by the motion.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: September 10, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Naoki Katsumata, Daichi Okamoto, Katsuya Ashizawa
  • Publication number: 20120308838
    Abstract: Disclosed are: a photocurable resin composition which may be developed with an alkali, has excellent resolution properties, and enables a cured article having excellent (humidity) heat resistance and thermal impact resistance to be formed; a dry film; a cured article thereof; and a printed wiring board using the cured article. The photocurable resin composition of the present invention is characterized by containing a carboxyl group-containing resin, a photopolymerization initiator, and surface-treated Neuburg siliceous earth particles.
    Type: Application
    Filed: February 2, 2011
    Publication date: December 6, 2012
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Nobuhito Ito, Daichi Okamoto, Takahiro Yoshida, Masao Arima
  • Publication number: 20110101709
    Abstract: A door handle stroke change structure includes a latch mechanism, an electric latch drive mechanism, a mechanical latch drive mechanism, and an operation member which operates the electric latch drive mechanism and the mechanical latch drive mechanism. The operation member is moveable among a closed position, a first position at which the electric latch drive mechanism is operated, and a second position at which the mechanical latch drive mechanism is operated. A motion to move the operation member from the closed position to the first position is a same motion as a motion to move the operation member from the closed position to the second position. A movement amount of the operation member from the closed position to the first position is greater than a movement amount of the operation member from the closed position to the second position by the motion.
    Type: Application
    Filed: October 5, 2010
    Publication date: May 5, 2011
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Naoki KATSUMATA, Daichi Okamoto, Katsuya Ashizawa