Abstract: A pattern forming method included applying a photoresist composition on a substrate to form a resist film on the substrate. The resist film is exposed. The exposed resist film is developed with a developer to form a pattern. The pattern is contacted with a processing liquid to process the pattern. The photoresist composition includes a polymer [A] and a radiation-sensitive acid generator [B]. The polymer includes a structural unit (I) including an acid-dissociable group that dissociates due to action of an acid. The polymer has solubility to the developer that reduces due to dissociation of the acid-dissociable group. The processing liquid exhibits acidity.

Abstract: A method of producing a partition wall comprises (a) forming a film using a photosensitive composition, (b) exposing the thus formed film, (c) developing the thus exposed film with an aqueous alkaline solution, and (d) applying wind to the thus developed film. The partition wall compartmentalizes a housing space which is formed between first and second electrode layer stacks and which contains a polar liquid and a non-polar liquid that are immiscible with each other.

Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.

Abstract: Provided by the present invention is a liquid crystal display element including: two substrates disposed oppositely, an interlayer insulating film laminated on the inner face side of at least one of the substrates, and a liquid crystal layer being provided between the substrates, and being formed from a polymerizable liquid crystal composition, in which a resin constituting the interlayer insulating film has a crosslinking moiety of a polymer represented by the following formula (1):

Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.

Abstract: A radiation sensitive resin composition for forming a protective film, comprising: [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an epoxy group-containing unsaturated compound and (a3) an unsaturated compound different from the components (a1) and (a2); [B] a monofunctional polymerizable unsaturated compound having a molecular weight of 180 or more and a carboxyl group; [C] a polyfunctional polymerizable unsaturated compound; and [D] a photopolymerization initiator, a method of forming a protective film from the above composition and a protective film formed from the above composition. The composition can provide a cured film having high flatness, has high developability and heat resistance, is advantageously used to form a protective film for liquid crystal display devices and solid-state image sensing devices, and has high storage stability as a composition.

Abstract: A radiation sensitive resin composition for forming a protective film, comprising: [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an epoxy group-containing unsaturated compound and (a3) an unsaturated compound different from the components (a1) and (a2); [B] a monofunctional polymerizable unsaturated compound having a molecular weight of 180 or more and a carboxyl group; [C] a polyfunctional polymerizable unsaturated compound; and [D] a photopolymerization initiator, a method of forming a protective film from the above composition and a protective film formed from the above composition. The composition can provide a cured film having high flatness, has high developability and heat resistance, is advantageously used to form a protective film for liquid crystal display devices and solid-state image sensing devices, and has high storage stability as a composition.

Abstract: A negative type radiation sensitive resin composition comprising: (A) an alkali-soluble resin containing the polymerized unit of a polymerizable unsaturated compound having a phenolic hydroxyl group and having a weight average molecular weight of 4,100 to 20,000 and a weight average molecular weight/number average molecular weight ratio of more than 1.25 to not more than 2.00; (B) a radiation sensitive acid generating agent; and (C) an acid crosslinking agent. This composition can be used with an alkali developer having a normal concentration, can form a high-resolution rectangular line-and-space resist pattern, and provides a chemically amplified negative type resist which is free from a resist pattern defect (bridging or chip line) after development and has excellent sensitivity, developability and dimensional fidelity.

Abstract: A negative type radiation sensitive resin composition comprising: