Abstract: A microelectronic device includes one or more electronic components attached to a package substrate which has an exposed surface to provide an area for mounting a heatsink. The microelectronic device includes one or more leads that are electrically connected to the electronic component. The lead extends away from the exposed surface of the package substrate. The microelectronic device includes a shielding dielectric material that laterally surrounds the lead and extends over the lead between the lead and the exposed surface of the package substrate. An electronic system includes the microelectronic device and a circuit board electrically connected to the lead. The electronic system also includes a heatsink attached to the exposed surface of the package substrate.

Abstract: A wafer chip-scale package (WCSP) includes a substrate including a semiconductor surface layer including circuitry configured for at least one function having at least a top metal interconnect layer thereon that includes at least one bond pad coupled to a node in the circuitry. A redistribution layer (RDL) including a bump pad is coupled by a trace to metal filled plugs through a passivation layer to the bond pad. A solder ball is on the bump pad, and a dielectric ring is on the bump pad that has an inner area that is in physical contact with the solder ball.

Abstract: A display device with improved viewing angle characteristics is provided. A display device with suppressed mixture of colors between adjacent pixels is provided. The display device includes a first coloring layer, a second coloring layer, and a structure body therebetween. The structure body has a portion closer to a display surface side than a bottom surface of the first coloring layer or a bottom surface of the second coloring layer.

Abstract: An integrated circuit (IC) package comprises a semiconductor die having a first surface with a Hall-effect sensor circuit and a second surface. A plurality of through substrate vias (TSV) each having a metal layer extend from the first surface of the semiconductor die to the second surface. The IC package includes a portion of a leadframe having a first set of leads and a second set of leads. The first set of leads provide a field generating current path for directing a magnetic field toward the Hall-effect sensor circuit. The second set of leads are attached to bond pads on the semiconductor die. A first side of an insulator is attached to the leadframe using a die attach material, and a second side of the insulator is attached to the first side of the semiconductor die using a bonding material.

Abstract: An electronic device includes a leadframe that includes pins, where the pins have a proximate end and a distal end. A die is attached to the proximate end of the pins of the leadframe and a mold compound encapsulates the die. An electronic component is attached to the leadframe. The distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of the remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.

Abstract: An electronic device includes a semiconductor substrate having a first conductive routing structure on a first side of the semiconductor substrate, and a low aspect ratio via opening extending from the first side to an opposite second side. The electronic device includes a transparent cover over a portion of the first side and covering the patterned first conductive routing structure, as well as an insulator layer including a photo-imageable material on the second side and along a sidewall of the via opening, and a second conductive routing structure on an outer side of the insulator layer and extending through the via opening and directly contacting a portion of the first conductive routing structure.

Abstract: An electronic device includes a substrate and a die having an active surface where the die is disposed on the substrate. A sensor is disposed on the active surface of the die such that the sensor is exposed to an external environment. Electrical interconnects are disposed on the active surface of the die near a perimeter of the die. Conductive terminals have a first end attached to a contact surface of the electrical interconnects and a second end that attaches to an external terminal.

Abstract: An example method includes placing a semiconductor die on a bonding surface of metal substrate. The die includes metal pillars extending from a surface of the die aligned with respective bonding locations on the bonding surface of the substrate. The pillars and the substrate can be formed of a common type of metal. The method also includes controlling a laser to emit laser light to heat the substrate at respective bonding locations to bond the metal pillars with the substrate at the respective bonding locations.

Abstract: This control device for controlling an inverter circuit calculates an input current of the inverter circuit on the basis of an output current instruction value for controlling an output current of the inverter circuit, and calculates, on the basis of the calculated input current, an output voltage compensation amount according to the fluctuation amount of an input voltage of the inverter circuit.

Abstract: An integrated circuit package includes a die attach pad (DAP) having a top surface and a layer of insulating material applied to the top surface of the DAP. A silicon-on-insulator (SOI) device is mounted on the insulating material using a die attach paste or film. A plurality of leads are coupled to the SOI device using bond wires. A mold compound covers at least a portion of the DAP and the SOI device. The insulating material may be polyimide or polyamide-imide that has been inkjet printed or screen printed on the DAP. The insulating material may be a parylene material that is applied to the top surface of the DAP using chemical vapor deposition. The insulating material has a thickness of 1-25 um and has a breakdown voltage of approximately 250V/um.

Abstract: An integrated circuit package includes a semiconductor die having a first surface and a second surface. The first surface is attached to a top surface of a die attach pad, and the second surface has a sensing area thereon. A mold compound covers or encapsulates at least a portion of the die attach pad and the semiconductor die. A channel is formed in a top portion of the mold compound. The channel extends from a first side of the mold compound to a second side of the mold compound. A cavity is formed between the channel and the sensing area so that the sensing area is exposed to the environment.

Abstract: An extender lens changes a focal length of an entire lens system after replacement to a longer focal length side than a focal length of a master lens by replacing a part of the master lens with the extender lens. The extender lens consists of, in order from an object side to an image side, a first lens group, and a negative second lens group. The first lens group is a lens group that has a positive refractive power as a whole and has a shortest focal length among lens groups consisting of one lens component or a plurality of consecutively arranged lens components. The extender lens satisfies a predetermined conditional expression.

Abstract: A zoom lens consists of, in order from the object side, a first lens group that has a positive refractive power, a middle group that includes a plurality of lens groups in which the spacings between adjacent lens groups change during zooming, and the final lens group. The focusing group that moves during focusing is disposed in the middle group. The zoom lens satisfies predetermined conditional expressions.

Abstract: The zoom lens consists of, in order from the object side, a first lens group that has a positive refractive power, a second lens group that has a positive refractive power, and a subsequent group. During zooming, a spacing between the first lens group and the second lens group changes, and a spacing between the second lens group and the subsequent group changes. The subsequent groups include a focusing group that moves during focusing.

Abstract: This control device for controlling an inverter circuit calculates an input current of the inverter circuit on the basis of an output current instruction value for controlling an output current of the inverter circuit, and calculates, on the basis of the calculated input current, an output voltage compensation amount according to the fluctuation amount of an input voltage of the inverter circuit.

Abstract: The variable magnification optical system consists of, in order from an object side to an image side, a first lens group that has a positive refractive power, a plurality of lens groups, and a final lens group that has a positive refractive power. During changing magnification, a spacing between the first lens group and the lens group closest to the object side among the plurality of lens groups changes, all spacings between adjacent lens groups in the plurality of lens groups change, and a spacing between the lens group closest to the image side and the final lens group among the plurality of lens groups changes.

Abstract: Provided is a battery system in which a battery cell does not exceed a use limit temperature, and a time taken for returning to the charging/discharging process is shortened even if a frequency for the battery system to stop a charging/discharging process is reduced and the charging/discharging process is stopped. The battery system disclosed in the invention includes a plurality of battery cells and a control circuit which controls a charging/discharging current of the battery cell. The control circuit performs a plurality of temperature rising estimations on the basis of a battery temperature, a charging/discharging current, and a time width of a time window. The control circuit selects the charging/discharging current corresponding to a temperature rising estimation in which the temperature of the battery cell does not exceed a use limit temperature among the temperature rising estimations.

Abstract: An object of the present invention is provide a coded aperture imaging apparatus that has a refocusing function and can change an angle of view. An imaging apparatus includes an imaging apparatus main body including a coded aperture, an imaging element that outputs a signal indicating a projected image of a subject, and an image restoration unit that reconstructs an image of a spatial domain based on the signal, and a lens attached to the imaging apparatus main body on a subject side from the coded aperture and changes an imaging angle of view in a state where the lens is attached to the imaging apparatus main body with respect to an imaging angle of view in a state where the lens is not attached to the imaging apparatus main body, in which the projected image is formed on the imaging element by the lens and the coded aperture.

Abstract: A battery control device which obtains a state of charge of a secondary battery from characteristics representing a relationship of a state of charge and a voltage of the secondary battery comprises a calling unit which calls a first characteristic among a plurality of the characteristics stored in advance based on use history information of the secondary battery, a correction limit width designation unit which designates a correction limit width for prescribing a tolerance level of correcting the first characteristic, and a direct detection correction unit which creates a second characteristic in which the first characteristic has been corrected according to the correction limit width based on a current value and a voltage value of the secondary battery, wherein the state of charge of the secondary battery is obtained using the second characteristic.

Abstract: An integrated circuit (IC) package includes an encapsulation package that contains an integrated circuit die attached to a lead frame. A set of contacts is formed on the package that each have an exposed contact sidewall surface and an exposed contact lower surface. A protective layer of solder wettable material covers each contact sidewall surface.