Patents by Inventor Daiping Tang

Daiping Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230027340
    Abstract: A power supply circuit in a wireless communications system includes an envelope tracking modulator coupled to a first power amplifier circuit and a second power amplifier circuit, so that the power supply circuit supplies power to the first power amplifier circuit and the second power amplifier circuit. When a transmit signal output by a processor is within a first bandwidth range, the power supply circuit supplies power to the first power amplifier circuit, and the first power amplifier circuit amplifies power of the transmit signal. When the transmit signal output by the processor meets a second bandwidth range, the power supply circuit supplies power to the second power amplifier circuit, and the second power amplifier circuit amplifies the transmit signal.
    Type: Application
    Filed: December 25, 2020
    Publication date: January 26, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hsiang Hui CHANG, Daiping TANG, Feiyang HU
  • Publication number: 20220022320
    Abstract: An circuit board assembly includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.
    Type: Application
    Filed: September 28, 2021
    Publication date: January 20, 2022
    Inventors: Hui WANG, Dan QIU, Zhijun CHEN, Daiping TANG
  • Patent number: 11166374
    Abstract: An electronic device includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: November 2, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hui Wang, Dan Qiu, Zhijun Chen, Daiping Tang
  • Patent number: 10904054
    Abstract: This application discloses a communications chip structure, including: a channel selection module, configured to receive an input signal, where the input signal is a signal of a preset narrow bandwidth span or a signal of a preset wide bandwidth span; and a digital baseband module, configured to control the channel selection module to select a first sampling and quantification channel when the input signal is a signal of the preset narrow bandwidth span, or control the channel selection module to select a second sampling and quantification channel when the input signal is a signal of the preset wide bandwidth span. The channel selection module is further configured to send the input signal to the first sampling and quantification channel or the second sampling and quantification channel for sampling and quantification.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: January 26, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Mingjun Fan, Jianhua Zheng, Daiping Tang
  • Publication number: 20210014971
    Abstract: An electronic device includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.
    Type: Application
    Filed: March 15, 2018
    Publication date: January 14, 2021
    Inventors: Hui WANG, Dan QIU, Zhijun CHEN, Daiping TANG
  • Publication number: 20200162294
    Abstract: This application discloses a communications chip structure, including: a channel selection module, configured to receive an input signal, where the input signal is a signal of a preset narrow bandwidth span or a signal of a preset wide bandwidth span; and a digital baseband module, configured to control the channel selection module to select a first sampling and quantification channel when the input signal is a signal of the preset narrow bandwidth span, or control the channel selection module to select a second sampling and quantification channel when the input signal is a signal of the preset wide bandwidth span. The channel selection module is further configured to send the input signal to the first sampling and quantification channel or the second sampling and quantification channel for sampling and quantification.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Inventors: Mingjun Fan, Jianhua Zheng, Daiping Tang