Patents by Inventor Daishi Yokoyama

Daishi Yokoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160194451
    Abstract: [Problem] An object of the present invention is to provide a composite of silicon oxide nanoparticles and a silsesquioxane polymer, from which a cured film having a low refractive index can be formed inexpensively. [Means for Solution] Provided are a method of producing a composite of silicon oxide nanoparticles and a silsesquioxane polymer, the method comprising reacting a silsesquioxane polymer having a silanol group at a terminal or a silane monomer with silicon oxide nanoparticles having a hydroxyl group or an alkoxy group on the surface in a mixed solvent of an aqueous solvent and an organic solvent in the presence of a phase transfer catalyst, and a composite produced by the method.
    Type: Application
    Filed: December 19, 2013
    Publication date: July 7, 2016
    Applicant: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
    Inventors: Naofumi YOSHIDA, Yuji TASHIRO, Daishi YOKOYAMA, Toshiaki NONAKA
  • Publication number: 20150331319
    Abstract: [Object] To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. [Means] The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having an ureido bond, a polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, and developed, so that a cured film can be obtained without carrying out post-exposure baking.
    Type: Application
    Filed: April 5, 2013
    Publication date: November 19, 2015
    Inventors: Daishi Yokoyama, Atsuko Noya, Yuji Tashiro, Naofumi Yoshida, Yasuaki Tanaka, Takashi Fuke, Megumi Takahashi, Katsuto Taniguchi, Toshiaki Nonaka
  • Publication number: 20150329679
    Abstract: [Problem] An object of the present invention is to provide a composite of metal oxide nanoparticles and a silsesquioxane polymer, which can form a high-quality cured film wherein aggregation and the like of metal oxide do not occur during a curing process and the metal oxide is uniformly dispersed. [Means for Solution] Provided are: a method of producing a composite of metal oxide nanoparticles and a silsesquioxane polymer, the method comprising reacting a silsesquioxane polymer having a silanol group at a terminal, or a silane monomer with metal oxide nanoparticles having a hydroxyl group or an alkoxy group on the surface in an aqueous solvent in the presence of a phase transfer catalyst; and a composite produced by the method.
    Type: Application
    Filed: December 19, 2013
    Publication date: November 19, 2015
    Inventors: Naofumi YOSHIDA, Yuji TASHIRO, Daishi YOKOYAMA, Yasuaki TANAKA, Takashi FUKE, Megumi TAKAHASHI, Toshiaki NONAKA
  • Patent number: 9164386
    Abstract: [Object] To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. [Means] The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having a pKa of 2.0 to 15.7, a photo-polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, developed with an inorganic developer, and heated, so that a cured film can be obtained.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: October 20, 2015
    Assignee: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
    Inventors: Daishi Yokoyama, Atsuko Noya, Yuji Tashiro, Naofumi Yoshida, Yasuaki Tanaka, Takashi Fuke, Megumi Takahashi, Katsuto Taniguchi, Toshiaki Nonaka
  • Patent number: 9091920
    Abstract: [Object] To provide a photosensitive siloxane resin composition excellent in alkali-solubility and in sensitivity, and also to provide a pattern-formation method employing that. [Means] The present invention provides a photosensitive siloxane resin composition comprising: a siloxane resin having silanol groups or alkoxysilyl groups, a crown ether, a photosensitive material, and an organic solvent. This photosensitive composition is cast on a substrate, subjected to imagewise exposure, treated with an alkali aqueous solution, and cured to form a pattern.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: July 28, 2015
    Assignee: Merck Patent GmbH
    Inventors: Takashi Sekito, Daishi Yokoyama, Takashi Fuke, Yuki Tashiro, Toshiaki Nonaka, Yasuaki Tanaka
  • Patent number: 8993214
    Abstract: A positive photosensitive siloxane composition comprising at least three types of following polysiloxanes (A), (B) and (C) obtained by hydrolyzing and condensing a silane compound represented by general formula (1) R1nSi (OR2)4-n, a diazonaphthoquinone derivative, and a solvent: a polysiloxane (A) such that if pre-baked the film thereof will be soluble in a 5 weight % TMAH aqueous solution and the solution rate of said film will be 1,000 ?/sec or less; a polysiloxane (B) such that if pre-baked the solution rate of the film thereof will be 4,000 ?/sec or more relative to a 2.38 weight % TMAH aqueous solution; and a polysiloxane (C) such that if pre-baked the solution rate of the film thereof will be between 200 and 3,000 ?/sec relative to a 2.38 weight % TMAH aqueous solution.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: March 31, 2015
    Assignee: AZ Electronic Materials USA Corp.
    Inventors: Daishi Yokoyama, Takashi Fuke, Yuji Tashiro, Takashi Sekito, Toshiaki Nonaka
  • Publication number: 20150064613
    Abstract: [Object] To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. [Means] The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having a pKa of 2.0 to 15.7, a photo-polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, developed with an inorganic developer, and heated, so that a cured film can be obtained.
    Type: Application
    Filed: April 5, 2013
    Publication date: March 5, 2015
    Inventors: Daishi Yokoyama, Atsuko Noya, Yuji Tashiro, Naofumi Yoshida, Yasuaki Tanaka, Takashi Fuke, Megumi Takahashi, Katsuto Taniguchi, Toshiaki Nonaka
  • Patent number: 8906993
    Abstract: [Object] To provide a coating composition excellent in coatability and free from viscosity increase caused by degradation over time, and also to provide a hardened film-formation method employing that. [Means] The present invention provides a coating composition comprising: a siloxane resin having silanol groups or alkoxysilyl groups, and a polyol having hydroxyl groups at both ends of a straight 2 to 5 carbon atom hydrocarbon chain. This coating composition enables to form a hardened film of high transparency, of high insulation and of low dielectricity.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: December 9, 2014
    Assignee: AZ Electronic Materials USA Corp.
    Inventors: Takashi Sekito, Daishi Yokoyama, Takashi Fuke, Yuji Tashiro, Toshiaki Nonaka, Yasuaki Tanaka
  • Publication number: 20140335452
    Abstract: A positive photosensitive siloxane composition comprising at least three types of following polysiloxanes (A), (B) and (C) obtained by hydrolyzing and condensing a silane compound represented by general formula (1) R1nSi (OR2)4-n, a diazonaphthoquinone derivative, and a solvent: a polysiloxane (A) such that if pre-baked the film thereof will be soluble in a 5 weight % TMAH aqueous solution and the solution rate of said film will be 1,000 ?/sec or less; a polysiloxane (B) such that if pre-baked the solution rate of the film thereof will be 4,000 ?/sec or more relative to a 2.38 weight % TMAH aqueous solution; and a polysiloxane (C) such that if pre-baked the solution rate of the film thereof will be between 200 and 3,000 ?/sec relative to a 2.38 weight % TMAH aqueous solution.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 13, 2014
    Applicant: AZ ELECTRONIC MATERIALS USA CORP.
    Inventors: Daishi Yokoyama, Takashi Fuke, Yuji Tashiro, Takashi Sekito, Toshiaki Nonaka
  • Publication number: 20140335448
    Abstract: [Object] To provide a photosensitive siloxane resin composition excellent in alkali-solubility and in sensitivity, and also to provide a pattern-formation method employing that. [Means] The present invention provides a photosensitive siloxane resin composition comprising: a siloxane resin having silanol groups or alkoxysilyl groups, a crown ether, a photosensitive material, and an organic solvent. This photosensitive composition is cast on a substrate, subjected to imagewise exposure, treated with an alkali aqueous solution, and cured to form a pattern.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 13, 2014
    Applicant: AZ ELECTRONIC MATERIALS USA CORP.
    Inventors: Takashi Sekito, Daishi Yokoyama, Takashi Fuke, Yuki Tashiro, Toshiaki Nonaka, Yasuaki Tanaka
  • Patent number: 8883397
    Abstract: A positive photosensitive siloxane composition containing: a polysiloxane (Ia), which is obtained by hydrolyzing and condensing the silane compound represented by RSi(OR1)3 in general formula (1) and the silane compound represented by Si(OR1)4 in general formula (2) in the presence of a basic catalyst, and a pre-baked film of which has a dissolution rate of 1,000 ?/second or less in a 5 wt % TMAH aqueous solution; a polysiloxane (Ib), which is obtained by hydrolyzing and condensing at least the silane compound represented by general formula (1) in the presence of an acid or basic catalyst, and a pre-baked film of which has a dissolution rate of 100 ?/second or more in a 2.38 wt % TMAH aqueous solution; and a diazonaphthoquinone derivative and solvent.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: November 11, 2014
    Assignee: AZ Electronic Materials USA Corp.
    Inventors: Daishi Yokoyama, Takashi Fuke, Yuji Tashiro, Takashi Sekito, Toshiaki Nonaka
  • Publication number: 20140024758
    Abstract: [Object] To provide a coating composition excellent in coatability and free from viscosity increase caused by degradation over time, and also to provide a hardened film-formation method employing that. [Means] The present invention provides a coating composition comprising: a siloxane resin having silanol groups or alkoxysilyl groups, and a polyol having hydroxyl groups at both ends of a straight 2 to 5 carbon atom hydrocarbon chain. This coating composition enables to form a hardened film of high transparency, of high insulation and of low dielectricity.
    Type: Application
    Filed: April 11, 2012
    Publication date: January 23, 2014
    Applicant: AZ ELECTRONIC MATERIALS USA CORP.
    Inventors: Takashi Sekito, Daishi Yokoyama, Takashi Fuke, Yuji Tashiro, Toshiaki Nonaka, Yasuaki Tanaka
  • Publication number: 20130216952
    Abstract: A positive photosensitive siloxane composition containing: a polysiloxane (Ia), which is obtained by hydrolyzing and condensing the silane compound represented by RSi(OR1)3 in general formula (1) and the silane compound represented by Si(OR1)4 in general formula (2) in the presence of a basic catalyst, and a pre-baked film of which has a dissolution rate of 1,000 ?/second or less in a 5 wt % TMAH aqueous solution; a polysiloxane (Ib), which is obtained by hydrolyzing and condensing at least the silane compound represented by general formula (1) in the presence of an acid or basic catalyst, and a pre-baked film of which has a dissolution rate of 100 ?/second or more in a 2.38 wt % TMAH aqueous solution; and a diazonaphthoquinone derivative and solvent.
    Type: Application
    Filed: August 19, 2011
    Publication date: August 22, 2013
    Applicant: AZ ELECTRONIC MATERIALS USA CORP.
    Inventors: Daishi Yokoyama, Takashi Fuke, Yuji Tashiro, Takashi Sekito, Toshiaki Nonaka