Patents by Inventor Daisuke Konishi

Daisuke Konishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117178
    Abstract: A resin composition containing: a block copolymer (I) having a polymer block (a1) containing a structural unit derived from an aromatic vinyl compound and a polymer block (a2) containing a structural unit derived from a conjugated diene compound; a plasticizer (II); and a biomass-derived polyolefin-based resin (III); in which the plasticizer (II) contains a plasticizer (II-1) containing a biomass-derived raw material; and in which the resin composition has a biobased content of 45% by mass or more, and a molded body obtained by using the resin composition.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Applicant: KURARAY CO., LTD.
    Inventors: Daisuke KONISHI, Hiromitsu SASAKI, Takahiro SEKIGUCHI, Yuta TOMISHIMA, Takumi HASEGAWA
  • Patent number: 11951731
    Abstract: Provided are a multilayer body in which base materials composed of a metal, a resin or the like are firmly bonded to each other even when not subjected to primer treatment or the like, and a method for producing the multilayer body. The multilayer body has a base material (X), an adhesive layer (Y), and a base material (Z) in this order, wherein the adhesive layer (Y) contains a hydrogenated block copolymer (A) obtained by hydrogenating a block copolymer (P) containing a polymer block (a) composed of a structural unit derived from an aromatic vinyl compound and a polymer block (b) composed of a structural unit derived from a conjugated diene, the mass ratio [(a)/(b)] of the polymer block (a) to the polymer block (b) is 1/99 to 50/50, and the adhesive layer (Y) has a storage modulus G? at 100° C. of 1.2×105 to 4.0×105 Pa.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: April 9, 2024
    Assignee: KURARAY CO., LTD.
    Inventors: Daisuke Konishi, Hiromitsu Sasaki, Yuta Tomishima
  • Patent number: 11936985
    Abstract: Provided is a technique capable of more accurately determining a solder protruding defect in an appearance inspection device that acquires an image of an inspection region of an inspection target and measures a height of a predetermined place in the inspection region with a height measurement device. The appearance inspection device includes: an imaging unit (3); a height measurement unit (20); a moving mechanism (5) that moves the imaging unit (3) and the height measurement unit (20). When a restricted region (M) in the inspection target is irradiated with the measurement light emitted from the height measurement unit (20), the determination unit restricts defect determination based on the information on the height of the predetermined place measured by the height measurement unit (20).
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: March 19, 2024
    Assignee: OMRON CORPORATION
    Inventors: Shingo Hayashi, Daisuke Konishi
  • Patent number: 11912859
    Abstract: The purpose of the present invention is to provide: an epoxy resin composition capable of giving cured resins which combine flexural modulus with flexural strain on a high level and have excellent heat resistance; a prepreg comprising the epoxy resin composition and reinforcing fibers; and a fiber-reinforced composite material obtained by curing the prepreg and excellent especially in terms of 0° and 90° bending strength. An embodiment of the epoxy resin composition of the present invention for achieving such purpose is an epoxy resin composition which comprises the following components [A], [B], and [C] and satisfies a specific requirement. Component [A]: a trifunctional amine type epoxy resin. Component [B]: a bisphenol F type epoxy resin which is solid at 25° C. Component [C]: an aromatic amine compound.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: February 27, 2024
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Daisuke Konishi, Yuichi Yamakita, Noriyuki Hirano, Eiki Takahashi
  • Publication number: 20230416448
    Abstract: A purpose of the present invention is to provide a thermosetting epoxy resin composition that manifests latency at a temperature at which the thermosetting resin cures and has an excellent curing rate, and molded articles obtained by thermosetting the same. A further purpose is to provide a fiber-reinforced composite material obtained by blending with reinforcing fibers, a molding material for a fiber-reinforced composite material, and a method for producing a fiber-reinforced composite material. To achieve the above, the thermosetting epoxy resin composition of the present invention is a thermosetting epoxy resin composition including the following constituent elements [a], [b], and [c], wherein the relationship between the curing time (Tc) and the induction time (Ti) satisfies 1<Tc/Ti?9.
    Type: Application
    Filed: December 16, 2021
    Publication date: December 28, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Hiroya TSUCHIDA, Daisuke KONISHI, Nobuyuki TOMIOKA
  • Publication number: 20230406994
    Abstract: The purpose of the present invention is to provide a thermosetting epoxy resin composition that is excellent in terms of both pot life and fast curability at low temperatures and also a molded article that is prepared by thermally curing the thermosetting epoxy resin composition and is excellent in terms of both wet heat resistance and toughness. In order to achieve the purpose, the thermosetting epoxy resin composition of the present invention includes the following components [a], [b], [c], and [d], wherein the stoichiometric ratio of [b] to [a] is in the range from 0.5 to 2.0: [a] an epoxy resin; [b] an isocyanate curing agent; [c] a hydroxyl group capping agent; [d] an epoxy curing catalyst.
    Type: Application
    Filed: November 2, 2021
    Publication date: December 21, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ko MATSUKAWA, Daisuke KONISHI, Nobuyuki TOMIOKA
  • Publication number: 20230279219
    Abstract: An epoxy resin composition is provided that has an elastic modulus, deformability, fracture toughness, and heat resistance in good balance. A prepreg produced from the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg are also provided, where the epoxy resin composition includes the components [A], [B], and [C] and satisfies all of the requirements (1), (2), and (3) as described.
    Type: Application
    Filed: August 6, 2021
    Publication date: September 7, 2023
    Applicant: Toray Industries, Inc.
    Inventors: Yuichi Yamakita, Daisuke Konishi, Hideki Hanabusa, Noriyuki Hirano, Reo Takaiwa
  • Publication number: 20230249850
    Abstract: In a method of controlling a flying object 1, from the flying object 1 that includes a flying object propulsion apparatus 16 and an energy storage apparatus 7, 8 having a plurality of energy storage devices 6 and configured to supply electricity to the flying object propulsion apparatus 16, one or a plurality of the energy storage devices 6 are separated.
    Type: Application
    Filed: April 6, 2021
    Publication date: August 10, 2023
    Inventors: Nan UKUMORI, Daisuke KONISHI
  • Publication number: 20230235162
    Abstract: A thermoplastic elastomer composition including an acrylic block copolymer (I) and a hydrogenated block copolymer (II). The content of the acrylic block copolymer (I) is 70 to 300 parts by mass with respect to 100 parts by mass of the hydrogenated block copolymer (II); the hydrogenated block copolymer (II) is a hydrogenated product of a block copolymer (P) including a polymer block (A1) containing structural units derived from an aromatic vinyl compound, and a polymer block (B1) containing 1 to 100 mass % of structural units (b1) derived from farnesene and 99 to 0 mass % of structural units (b2) derived from a conjugated diene other than farnesene, the mass ratio [(A1)/(B1)] of the polymer block (A1) to the polymer block (B1) being 1/99 to 70/30; and the hydrogenation ratio of carbon-carbon double bonds in the polymer block (B1) is 50 to 100 mol %.
    Type: Application
    Filed: April 8, 2021
    Publication date: July 27, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Moe KAWAHARA, Makoto AKAI, Daisuke KONISHI, Hiromitsu SASAKI
  • Publication number: 20230150680
    Abstract: An energy storage system used in a flight vehicle includes: a plurality of energy storage apparatuses; and a power transfer circuit that is connected to the plurality of energy storage apparatuses and transfer electric power between the plurality of energy storage apparatuses.
    Type: Application
    Filed: April 6, 2021
    Publication date: May 18, 2023
    Inventors: Nan UKUMORI, Daisuke KONISHI
  • Publication number: 20230134512
    Abstract: An energy storage apparatus used in a flight vehicle includes battery circuits connected in series, through which current flows during charge and discharge of the energy storage apparatus. Each of the battery circuits includes: a first electrical path; an energy storage cell connected to an adjacent battery circuit through the first electrical path; a first switch that includes a diode and is provided in the first electrical path such that a forward direction of the diode is a charge direction of the energy storage apparatus; a second electrical path connected to the adjacent battery circuit in parallel with the energy storage cell and the first switch; and a second switch that includes a diode and is provided in the second electrical path such that a forward direction of the diode is a discharge direction of the energy storage apparatus, and is turned on when the first switch is turned off.
    Type: Application
    Filed: March 19, 2021
    Publication date: May 4, 2023
    Inventors: Jiromasa MURAMATSU, Motonobu MURAKAMI, Daisuke KONISHI
  • Publication number: 20230109535
    Abstract: Provided are a multilayer body in which base materials composed of a metal, a resin or the like are firmly bonded to each other even when not subjected to primer treatment or the like, and a method for producing the multilayer body. The multilayer body has a base material (X), an adhesive layer (Y), and a base material (Z) in this order, wherein the adhesive layer (Y) contains a hydrogenated block copolymer (A) obtained by hydrogenating a block copolymer (P) containing a polymer block (a) composed of a structural unit derived from an aromatic vinyl compound and a polymer block (b) composed of a structural unit derived from a conjugated diene, the mass ratio [(a)/(b)] of the polymer block (a) to the polymer block (b) is 1/99 to 50/50, and the adhesive layer (Y) has a storage modulus G? at 100° C. of 1.2×105 to 4.0×105 Pa.
    Type: Application
    Filed: February 25, 2021
    Publication date: April 6, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Daisuke KONISHI, Hiromitsu SASAKI, Yuta TOMISHIMA
  • Publication number: 20230075020
    Abstract: To provide a waterproof sheet for civil engineering, having sufficient strength and elongation even at a low temperature of about ?10° C. and having excellent adhesiveness to a structure such as a tunnel. Disclosed is a waterproof sheet for civil engineering, which has a layer (A) including a composition containing an ethylene-vinyl acetate copolymer (a1) and a thermoplastic resin (a2) other than the ethylene-vinyl acetate copolymer (a1), and a silica-containing layer containing silica, wherein the content of the ethylene-vinyl acetate copolymer (a1) in the composition is 30 to 95% by mass, the content of the thermoplastic resin (a2) is 5 to 70% by mass, and the absolute value of the difference between the SP value of the ethylene-vinyl acetate copolymer (a1) and the SP value of the thermoplastic resin (a2) is less than 0.70 (cal/cm3)1/2.
    Type: Application
    Filed: February 4, 2021
    Publication date: March 9, 2023
    Applicant: KURARAY CO., LTD
    Inventors: Kazumasa KUSUDO, Hiroyuki KAWAI, Takashi KATAYAMA, Shuhei YORIMITSU, Noriko KAWASHIMA, Daisuke KONISHI, Naoyuki YAGUCHI, Kenichi KOJIMA
  • Publication number: 20230036115
    Abstract: A prepreg and an integrally molded article are described, the prepreg including a thermoplastic resin existing on one face of a layer in which reinforcing fibers are impregnated with a thermosetting resin, wherein the prepreg exhibits, in injection molding or press molding, thermal weldability with a member containing a thermoplastic resin, and wherein the thermosetting resin has a specific peak on a loss tangent (tan ?) curve obtained by dynamic mechanical analysis (DMA), so that the prepreg exhibits suitable flexibility and adhesiveness, excellent formability on a complicated mold face, and adhesion to a mold face, causes no positional shift, and can be efficiently reinforced and stiffened at an intended position.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 2, 2023
    Applicant: Toray Industries, Inc.
    Inventors: Miho Onodera, Yoshiki Takebe, Daisuke Konishi, Yuta Naito, Yoshifumi Nakayama, Masato Honma
  • Publication number: 20230025461
    Abstract: A resin composition containing an ethylene-vinyl acetate copolymer (I) and a hydrogenated block copolymer (II), wherein the hydrogenated block copolymer (II) is a hydrogenated product of a block copolymer (P) containing a polymer block (A) containing a structural unit derived from an aromatic vinyl compound and a polymer block (B) containing 1 to 100% by mass of a structural unit (b1) derived from farnesene and 99 to 0% by mass of a structural unit (b2) derived from a conjugated diene other than farnesene, wherein the hydrogenation rate of carbon-carbon double bonds in the structural unit derived from a conjugated diene in the block copolymer (P) is 70 mol % or more, and in the resin composition, the content of the ethylene-vinyl acetate copolymer (I) is 40 to 95% by mass and the content of the hydrogenated block copolymer (II) is 5 to 60% by mass.
    Type: Application
    Filed: February 25, 2021
    Publication date: January 26, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Daisuke KONISHI, Hiromitsu SASAKI, Takumi HASEGAWA, Kazumasa KUSUDO
  • Publication number: 20220403145
    Abstract: Provided are: a resin composition containing a rubber (I), a block copolymer (II) and a crosslinking agent (III), wherein the ratio by mass of the rubber (I) to the block copolymer (II), (I)/(II) is 99/1 to 55/45, and the block copolymer (II) is a block copolymer containing a polymer block (A) that contains an aromatic vinyl compound-derived structural unit and a polymer block (B) that contains a farnesene-derived structural unit (b1), and a molded article of the resin composition.
    Type: Application
    Filed: November 18, 2020
    Publication date: December 22, 2022
    Applicant: KURARAY CO., LTD.
    Inventors: Daisuke KONISHI, Hiromitsu SASAKI, Takumi HASEGAWA
  • Publication number: 20220381700
    Abstract: An object is to shorten time required for visual inspection. A visual inspection device (1) configured to inspect an appearance of an inspection object (30), the visual inspection device (1) including: an imager (3) configured to image the inspection object (30) arranged at a predetermined position of the visual inspection device (1); and a height measurer (11, 12) configured to measure a height of the inspection object (30) carried into the visual inspection device (1) or carried out from the visual inspection device (1).
    Type: Application
    Filed: March 11, 2020
    Publication date: December 1, 2022
    Inventors: Shingo HAYASHI, Daisuke KONISHI
  • Publication number: 20220360720
    Abstract: Provided is a technique capable of more accurately determining a solder protruding defect in an appearance inspection device that acquires an image of an inspection region of an inspection target and measures a height of a predetermined place in the inspection region with a height measurement device. The appearance inspection device includes: an imaging unit (3); a height measurement unit (20); a moving mechanism (5) that moves the imaging unit (3) and the height measurement unit (20). When a restricted region (M) in the inspection target is irradiated with the measurement light emitted from the height measurement unit (20), the determination unit restricts defect determination based on the information on the height of the predetermined place measured by the height measurement unit (20).
    Type: Application
    Filed: March 10, 2020
    Publication date: November 10, 2022
    Inventors: Shingo HAYASHI, Daisuke KONISHI
  • Publication number: 20220177696
    Abstract: The purpose of the present invention is to provide an epoxy resin composition which exhibits a high level of deforming capacity and fracture toughness and from which a resin cured product maintaining heat resistance can be obtained. The epoxy resin composition according to the present invention satisfies condition 1 or condition 2 below, wherein the resin cured product obtained by reacting the epoxy resin composition at 150° C. for 60 minutes has a tensile elongation at break of 7% or more. Condition 1: including all the following components [A], [B], and [C], component [A]: a bifunctional aliphatic epoxy resin having a specific structure, component [B]: a terminal carboxy-modified acrylic rubber, and component [C]: a dicyandiamide.
    Type: Application
    Filed: April 1, 2020
    Publication date: June 9, 2022
    Applicant: Toray Industries, Inc.
    Inventors: Daisuke Konishi, Yuichi Yamakita, Hideki Hanabusa, Noriyuki Hirano, Masahiro Tsuzuki
  • Patent number: 11345808
    Abstract: The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014?(content of component [D]/content of component [C])?0.045, [b]: 0.9?(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])?1.2, and [c]: 14?(content of component [A]/content of component [C])?25.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: May 31, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Eiki Takahashi, Daisuke Konishi, Masayuki Miyoshi, Noriyuki Hirano