Abstract: A method for manufacturing a ball screw according to the present invention includes a seal fixing step of fixing a ring shaped seal to an attachment portion disposed in an end portion of a nut of a ball screw in an axis direction using a fixing member. The attachment portion has an inner circumferential surface having a diameter larger than that of an inner circumferential surface on which a spiral groove of the nut is formed. A through hole is formed in the attachment portion, the through hole penetrating the attachment portion in a radial direction from an outer circumferential surface thereof to the inner circumferential surface thereof. The seal fixing step includes passing the screw through the through hole and engaging the screw with an outer circumferential portion of the ring shaped seal to exert an outward-directed force in the radial direction on the ring shaped seal because of a force of the head pressing the bearing face to fix the ring shaped seal to the nut.

Abstract: A method for manufacturing a ball screw according to the present invention includes a seal fixing step of fixing a ring shaped seal to an attachment portion disposed in an end portion of a nut of a ball screw in an axis direction using a fixing member. The attachment portion has an inner circumferential surface having a diameter larger than that of an inner circumferential surface on which a spiral groove of the nut is formed. A through hole is formed in the attachment portion, the through hole penetrating the attachment portion in a radial direction from an outer circumferential surface thereof to the inner circumferential surface thereof. The seal fixing step includes passing the screw through the through hole and engaging the screw with an outer circumferential portion of the ring shaped seal to exert an outward-directed force in the radial direction on the ring shaped seal because of a force of the head pressing the bearing face to fix the ring shaped seal to the nut.

Abstract: A ball screw device is provided in which a dust-proof member can be simply attached to a nut. The ball screw device (1) is a ball screw device (1) in which a concave portion (6) is formed in an inner circumferential end portion of a nut (4) through which a screw shaft (2) passes and the concave portion (6) is provided with a dust-proof member (5), wherein the dust-proof member (5) is formed of a cylindrical elastic member into which the screw shaft (2) is inserted and includes at least one protrusion (8) protruding in an outward diameter direction from an outer circumferential surface of the dust-proof member (5), and the concave portion (6) has a groove shape to which the dust-proof member (5) is fitted and is provided with a locking portion (7) to which the protrusion (8) is locked.

Abstract: A method for manufacturing a ball screw according to the present invention includes a seal fixing step of fixing a ring shaped seal (4) to an attachment portion (24) disposed in an end portion of a nut (2) of a ball screw in an axis direction using a fixing member (5). The attachment portion has an inner circumferential surface having a diameter larger than that of an inner circumferential surface on which a spiral groove of the nut is formed. A through hole (25a to 25c) is formed in the attachment portion, the through hole (25a to 25c) penetrating the attachment portion in a radial direction from an outer circumferential surface thereof to the inner circumferential surface thereof.

Abstract: A ball screw device is provided in which a dust-proof member can be simply attached to a nut. The ball screw device (1) is a ball screw device (1) in which a concave portion (6) is formed in an inner circumferential end portion of a nut (4) through which a screw shaft (2) passes and the concave portion (6) is provided with a dust-proof member (5), wherein the dust-proof member (5) is formed of a cylindrical elastic member into which the screw shaft (2) is inserted and includes at least one protrusion (8) protruding in an outward diameter direction from an outer circumferential surface of the dust-proof member (5), and the concave portion (6) has a groove shape to which the dust-proof member (5) is fitted and is provided with a locking portion (7) to which the protrusion (8) is locked.

Abstract: There is provided a ball screw apparatus ensuring easy and proper centering between a nut and a stationary member. Therefore, the ball screw apparatus (1) has a threaded shaft (10), a nut (20) that passes through the threaded shaft (10) and is screwed via a rolling body B into the threaded shaft (10) so as to be disposed movable in the axial direction of the threaded shaft (10), and a stationary member (40). The stationary member (40) is secured to an end surface (20a) of the nut (20), and a dustproof member (60) that prevents entry of foreign matter into the nut (20) is secured to the stationary member (40). The end surface (20a) of the nut (20) is provided with a spigot joint portion (20b) fitted to an outer circumferential surface (42a) of a flange part (42) of the stationary member (40).

Abstract: A high conductance, multi-tray film precursor evaporation system coupled with a high conductance vapor delivery system is described for increasing the deposition rate by increasing exposed surface area of film precursor. The multi-tray film precursor evaporation system includes one or more trays. Each tray is configured to support and retain film precursor in, for example, solid powder form or solid tablet form. Additionally, each tray is configured to provide for a high conductance flow of carrier gas over the film precursor while the film precursor is heated. For example, the carrier gas flows inward over the film precursor, and vertically upward through a flow channel within the stackable trays and through an outlet in the solid precursor evaporation system.

Abstract: A CVD film forming apparatus for forming a predetermined film on a target substrate via CVD by reacting a film forming gas on a surface of the substrate while heating the substrate includes a processing chamber capable of being maintained at vacuum, and a stage for mounting thereon the substrate in the processing chamber, the stage having a diameter larger than that of the substrate. Further, the CVD film forming apparatus includes a heating device provided in the stage to heat the substrate, a gas supply unit for supplying the film forming gas into the processing chamber, a gas exhaust device for exhausting the processing chamber to vacuum, and a covering for covering a peripheral region of the stage that surrounds the substrate mounted on the stage to reduce thermal effects from the stage to a peripheral portion of the substrate.

Abstract: A high conductance, multi-tray solid precursor evaporation system coupled with a high conductance vapor delivery system is described for increasing deposition rate by increasing exposed surface area of solid precursor. The multi-tray solid precursor evaporation system includes a base tray with one or more upper trays. Each tray is configured to support and retain film precursor in, for example, solid powder form or solid tablet form. Additionally, each tray is configured to provide for a high conductance flow of carrier gas over the film precursor while the film precursor is heated. For example, the carrier gas flows inward over the film precursor, and vertically upward through a flow channel within the stackable trays and through an outlet in the solid precursor evaporation system.

Abstract: In a solid precursor evaporation system configured for use in a thin film deposition system, such as thermal chemical vapor deposition (TCVD), a method for preparing one or more trays of solid precursor is described. The solid precursor may be formed on a coating substrate, such as a tray, using one or more of dipping techniques, spin-on techniques, and sintering techniques.

Abstract: A replaceable precursor tray for use with a high conductance, multi-tray solid precursor evaporation system coupled with a high conductance vapor delivery system is described for increasing deposition rate by increasing exposed surface area of solid precursor. The multi-tray solid precursor evaporation system is configured to be coupled to the process chamber of a thin film deposition system, and it includes a base tray with one or more stackable upper trays. Each tray is configured to support and retain film precursor in, for example, solid powder form or solid tablet form. Additionally, each tray is configured to provide for a high conductance flow of carrier gas over the film precursor while the film precursor is heated. For example, the carrier gas flows inward over the film precursor, and vertically upward through a flow channel within the stackable trays and through an outlet in the solid precursor evaporation system.

Abstract: A method for depositing a Ru metal layer on a patterned substrate from a film precursor vapor delivered from a multi-tray film precursor evaporation system. The method comprises providing a patterned substrate in a process chamber of a deposition system, and forming a process gas containing Ru3(CO)12 precursor vapor and a carrier gas comprising CO gas. The process gas is formed by: providing a solid Ru3(CO)12 precursor in a plurality of spaced trays within a precursor evaporation system, wherein each tray is configured to support the solid precursor and wherein the plurality of spaced trays collectively provide a plurality of surfaces of solid precursor; heating the solid precursor in the plurality of spaced trays in the precursor evaporation system to a temperature greater than about 60° C.

Abstract: A method for depositing a Ru metal layer on a patterned substrate from a film precursor vapor delivered from a multi-tray film precursor evaporation system. The method comprises providing a patterned substrate in a process chamber of a deposition system, and forming a process gas containing Ru3(CO)12 precursor vapor and a carrier gas comprising CO gas. The process gas is formed by: providing a solid Ru3(CO)12 precursor in a plurality of spaced trays within a precursor evaporation system, wherein each tray is configured to support the solid precursor and wherein the plurality of spaced trays collectively provide a plurality of surfaces of solid precursor; heating the solid precursor in the plurality of spaced trays in the precursor evaporation system to a temperature greater than about 60° C.

Abstract: A high conductance, multi-tray film precursor evaporation system coupled with a high conductance vapor delivery system is described for increasing deposition rate by increasing exposed surface area of film precursor. The multi-tray film precursor evaporation system includes one or more trays. Each tray is configured to support and retain film precursor in, for example, solid powder form or solid tablet form. Additionally, each tray is configured to provide for a high conductance flow of carrier gas over the film precursor while the film precursor is heated. For example, the carrier gas flows inward over the film precursor, and vertically upward through a flow channel within the stackable trays and through an outlet in the solid precursor evaporation system.

Abstract: A high conductance, multi-tray film precursor evaporation system coupled with a high conductance vapor delivery system is described for increasing the deposition rate by increasing exposed surface area of film precursor. The multi-tray film precursor evaporation system includes one or more trays. Each tray is configured to support and retain film precursor in, for example, solid powder form or solid tablet form. Additionally, each tray is configured to provide for a high conductance flow of carrier gas over the film precursor while the film precursor is heated. For example, the carrier gas flows inward over the film precursor, and vertically upward through a flow channel within the stackable trays and through an outlet in the solid precursor evaporation system.

Abstract: A high conductance, multi-tray solid precursor evaporation system coupled with a high conductance vapor delivery system is described for increasing deposition rate by increasing exposed surface area of solid precursor. The multi-tray solid precursor evaporation system includes a base tray with one or more upper trays. Each tray is configured to support and retain film precursor in, for example, solid powder form or solid tablet form. Additionally, each tray is configured to provide for a high conductance flow of carrier gas over the film precursor while the film precursor is heated. For example, the carrier gas flows inward over the film precursor, and vertically upward through a flow channel within the stackable trays and through an outlet in the solid precursor evaporation system.

Abstract: A replaceable precursor tray for use with a high conductance, multi-tray solid precursor evaporation system coupled with a high conductance vapor delivery system is described for increasing deposition rate by increasing exposed surface area of solid precursor. The multi-tray solid precursor evaporation system is configured to be coupled to the process chamber of a thin film deposition system, and it includes a base tray with one or more stackable upper trays. Each tray is configured to support and retain film precursor in, for example, solid powder form or solid tablet form. Additionally, each tray is configured to provide for a high conductance flow of carrier gas over the film precursor while the film precursor is heated. For example, the carrier gas flows inward over the film precursor, and vertically upward through a flow channel within the stackable trays and through an outlet in the solid precursor evaporation system.

Abstract: In a solid precursor evaporation system configured for use in a thin film deposition system, such as thermal chemical vapor deposition (TCVD), a method for preparing one or more trays of solid precursor is described. The solid precursor may be formed on a coating substrate, such as a tray, using one or more of dipping techniques, spin-on techniques, and sintering techniques.

Abstract: In a ball screw device which provides a screw shaft including a ball screw groove in the outer peripheral surface, a ball nut including a ball screw groove formed in the inner peripheral surface opposite to the ball screw groove of the screw shaft, a plurality of balls fitted between the ball screw grooves of the screw shaft and ball nut, and a tube type circulation path for circulating these balls, the ball screw device can reduce the moment of inertia of a rotary portion of the device so as to facilitate the use of the ball screw device of a nut rotation type.

Abstract: At least one end portion of a nut threadably engaged with a screw shaft is provided a mounting member mounting stepped portion, a radial through-hole is formed in the peripheral surface of the stepped portion and a radial pin insertion aperture is formed in the peripheral surface of a mounting member correspondingly to the through-hole, and an engagement recess is formed at a location whereat the through-hole and the pin insertion aperture are connected together. A pin member is provided with a protruded portion on the barrel portion thereof. The pin member is elastically deformed and inserted into the through-hole, and the tip end thereof is brought into engagement with the pin insertion aperture to fix the mounting member and bring the protruded portion into engagement with the engagement recess, thereby preventing the pin member from slipping out.