Patents by Inventor Daisuke Makino

Daisuke Makino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120783
    Abstract: A water-cooled motor includes: an annular stator having a central axis; and an annular housing surrounding the stator around the central axis and provided with a cooling channel within the housing, the housing includes: an annular non-magnetic metal pipe; and a casting member cast to envelop the metal pipe around the central axis, and the metal pipe is located inward of the cooling channel and located outward of an outer surface of the stator, in a radial direction of the stator.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Iori MATSUDA, Tomokazu SUDA, Yuta ABIKO, Akihiro MAKINO, Shotaro OKAMOTO, Daisuke MATSUDA
  • Patent number: 11919550
    Abstract: A rail breakage detection device includes a first core part provided to a first cable connecting an electrical neutral point of an impedance bond that electrically connects a first rail and a second rail to the first rail, a second core part provided to a second cable connecting the electrical neutral point of the impedance bond to the second rail, a first coil wound around the first core part to generate a first electromotive force in accordance with a current variation occurring in the first cable, a second coil connected electrically to the first coil and wound around the second core part to generate a second electromotive force in accordance with a current variation occurring in the second cable, and a CPU to determine that the first or second rail is broken based on an electromotive force that is a sum of the first and second electromotive forces.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: March 5, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tomoaki Takewa, Takafumi Nagano, Yoshitsugu Sawa, Wataru Tsujita, Kenzo Makino, Katsunori Tsuchida, Daisuke Koshino
  • Patent number: 11680193
    Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: June 20, 2023
    Assignees: CEMEDINE CO., LTD., MAZDA MOTOR CORPORATION
    Inventors: Daisuke Makino, Atsuhiko Suzuki, Yusuke Murachi, Motoyasu Asakawa, Katsuya Himuro, Kenichi Yamamoto
  • Patent number: 11618839
    Abstract: Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa·s) when a shearing speed is 5 (sec?1) and is from 1 to 30 (Pa·s) when the shearing speed is 200 (sec?1).
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: April 4, 2023
    Assignees: CEMEDINE CO., LTD., HONDA MOTOR CO., LTD.
    Inventors: Daisuke Makino, Atsuhiko Suzuki, Yuusuke Murachi, Katsutoshi Ando, Koji Oda
  • Publication number: 20220166686
    Abstract: A display control system for displaying a GUI screen on a terminal of a user, the display control system includes: a setting GUI unit, wherein the setting GUI unit is configured to cause the terminal to display a screen depicting a network configuration including a plurality of selectable clouds, and wherein the setting GUI unit is configured to cause the terminal to display a parameter input screen for a connection between a specific cloud and a resource in a case where the specific cloud and the resource to connect to the specific cloud are selected at the terminal.
    Type: Application
    Filed: February 14, 2022
    Publication date: May 26, 2022
    Inventors: Daijiro IKEDA, Daisuke MAKINO, Yoshiharu ISHIYAMA, Soichiro ONO, Mami NAKAMURA, Hitoshi NAKAO, Naoya ISHITANI
  • Publication number: 20210277294
    Abstract: Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa·s) when a shearing speed is 5 (sec?1) and is from 1 to 30 (Pa·s) when the shearing speed is 200 (sec?1).
    Type: Application
    Filed: July 7, 2017
    Publication date: September 9, 2021
    Applicants: CEMEDINE CO., LTD., HONDA MOTOR CO., LTD.
    Inventors: Daisuke MAKINO, Atsuhiko SUZUKI, Yuusuke MURACHI, Katsutoshi ANDO, Koji ODA
  • Publication number: 20210102101
    Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 8, 2021
    Applicants: CEMEDINE CO., LTD., MAZDA MOTOR CORPORATION
    Inventors: Daisuke MAKINO, Atsuhiko SUZUKI, Yusuke MURACHI, Motoyasu ASAKAWA, Katsuya HIMURO, Kenichi YAMAMOTO
  • Publication number: 20190300760
    Abstract: Provided are: a structure adhesive composition which changes color when heat-cured; a method for producing a vehicle structure using the same; and a vehicle structure. The structure adhesive composition which changes color when heat-cured is a structure adhesive composition including: (A) an epoxy resin; (B) an epoxy resin latent curing agent; and (C) a monoazo pigment, wherein a compounded proportion of the monoazo pigment in the structure adhesive composition constitutes 0.01-10 mass %. It is preferable for the structure adhesive composition to also contain (D) a curing accelerator.
    Type: Application
    Filed: July 7, 2017
    Publication date: October 3, 2019
    Applicants: CEMEDINE CO., LTD., HONDA MOTOR CO., LTD.
    Inventors: Daisuke MAKINO, Atsuhiko SUZUKI, Yuusuke MURACHI, Katsutoshi ANDO
  • Patent number: 9851670
    Abstract: When ending image forming, a state is realized where charging by a charging roller is stopped (charging bias off) and also applying DC voltage at a developing device is stopped (developing bias DC off). In this state, AC voltage is applied to the developing device (developing bias AC on), thereby adhering toner to the surface of a photosensitive drum and forming interposing toner. Driving of the photosensitive drum and an intermediate transfer belt is then stopped in the state with the interposing toner interposed between the photosensitive drum and intermediate transfer belt.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: December 26, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yasushi Takeuchi, Takayuki Ganko, Koji Arimura, Yusuke Ishida, Takanori Iida, Toshiyuki Yamada, Daisuke Makino, Taisuke Matsuura
  • Publication number: 20170060061
    Abstract: When ending image forming, a state is realized where charging by a charging roller is stopped (charging bias off) and also applying DC voltage at a developing device is stopped (developing bias DC off). In this state, AC voltage is applied to the developing device (developing bias AC on), thereby adhering toner to the surface of a photosensitive drum and forming interposing toner. Driving of the photosensitive drum and an intermediate transfer belt is then stopped in the state with the interposing toner interposed between the photosensitive drum and intermediate transfer belt.
    Type: Application
    Filed: August 23, 2016
    Publication date: March 2, 2017
    Inventors: Yasushi Takeuchi, Takayuki Ganko, Koji Arimura, Yusuke Ishida, Takanori Iida, Toshiyuki Yamada, Daisuke Makino, Taisuke Matsuura
  • Patent number: 8970912
    Abstract: An image forming apparatus includes: a holding unit configured to hold image processing coefficients, each of which representing a relationship between an input density and an output density of an image signal output to an image forming unit; and an updating unit configured to update an image processing coefficient based on the relationship between densities of measurement images and densities of image signals for forming the measurement images. The updating unit is further configured to, when a maximum value of an output density of the image processing coefficients is smaller than a maximum value of the density of the image signal, form at least one first measurement image in accordance with an image signal indicating a density higher than the maximum value of the output density of the image processing coefficients.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: March 3, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventor: Daisuke Makino
  • Publication number: 20130278951
    Abstract: An image forming apparatus includes: a holding unit configured to hold image processing coefficients, each of which representing a relationship between an input density and an output density of an image signal output to an image forming unit; and an updating unit configured to update an image processing coefficient based on the relationship between densities of measurement images and densities of image signals for forming the measurement images. The updating unit is further configured to, when a maximum value of an output density of the image processing coefficients is smaller than a maximum value of the density of the image signal, form at least one first measurement image in accordance with an image signal indicating a density higher than the maximum value of the output density of the image processing coefficients.
    Type: Application
    Filed: April 8, 2013
    Publication date: October 24, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Daisuke Makino
  • Patent number: 8159515
    Abstract: An image forming apparatus includes an image forming unit, an exposure unit, a detection unit, a storage unit, and a control unit. The image forming unit includes a photosensitive member on which an electrostatic latent image is formed. The exposure unit exposes the photosensitive member. The detection unit detects that a reference position disposed on the photosensitive member has reached a predetermined position. The storage unit stores correction data for correcting unevenness of potential characteristic in the photosensitive member. The control unit controls an exposure intensity of the exposure unit at each position on the photosensitive member based on the correction data.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: April 17, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventor: Daisuke Makino
  • Patent number: 8053684
    Abstract: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: November 8, 2011
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Shigemasa Takahashi, Takashi Yamada, Shinji Mizuno, Masahiro Kitahara, Daisuke Makino
  • Patent number: 7819996
    Abstract: Methods of manufacturing a ceramic sheet and a gas sensing element are disclosed. At least ceramic powder, a binder and a plasticizer are blended and mixed in slurry. The slurry is formed into unfired green sheets, on which paste is printed. Each of the unfired green sheets has porosity greater than 5%. In the manufacturing methods, the unfired green sheets are pressurized with a pressure of 10 MPa at a temperature above 60° C., after which the paste is printed on surfaces of the unfired green sheets. In the method of manufacturing the gas sensing element, a shielding layer, a porous diffusion resistance layer and the unfired green sheets for a sensing layer, a reference gas airspace forming layer and a heating layer are stacked to form a stacked ceramic body, whish is fired to obtain the gas sensing element.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: October 26, 2010
    Assignees: Nippon Soken, Inc., Denso Corporation
    Inventors: Eturo Yasuda, Noriaki Kihara, Daisuke Makino, Makoto Shirai, Hirokatsu Mukai, Takumi Ushikubo
  • Patent number: 7728710
    Abstract: An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is slidingly contacted with a slider. The insulating base (10) is a synthetic resin molded piece. The flexible circuit board (20) is insert-molded to the insulating base (10). The electronic component substrate (1-1) is produced by preparing the flexible circuit board (20) and first and second mold members (41, 45) having a cavity (C1) with a shape that corresponds to the external shape of the electronic component substrate (1-1). Then, the flexible circuit board (20) is accommodated in the cavity (C1) between the first and second mold members (41,45), and the cavity (C1) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members (41, 45) are removed.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: June 1, 2010
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Shinji Mizuno, Koji Mitsui, Katsutoshi Yanoshita, Shinichi Suzuki, Takashi Shinoki, Kazutaka Nakagome, Naoki Fukuda, Kozo Morita, Daisuke Makino
  • Publication number: 20100040390
    Abstract: An image forming apparatus includes an image forming unit, an exposure unit, a detection unit, a storage unit, and a control unit. The image forming unit includes a photosensitive member on which an electrostatic latent image is formed. The exposure unit exposes the photosensitive member. The detection unit detects that a reference position disposed on the photosensitive member has reached a predetermined position. The storage unit stores correction data for correcting unevenness of potential characteristic in the photosensitive member. The control unit controls an exposure intensity of the exposure unit at each position on the photosensitive member based on the correction data.
    Type: Application
    Filed: August 14, 2009
    Publication date: February 18, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Daisuke Makino
  • Publication number: 20090277684
    Abstract: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
    Type: Application
    Filed: December 19, 2006
    Publication date: November 12, 2009
    Applicant: TEIKOKU TSUSHIN KOGYO CO., LTD.
    Inventors: Shigemasa Takahashi, Takashi Yamada, Shinji Mizuno, Masahiro Kitahara, Daisuke Makino
  • Patent number: 7575663
    Abstract: A gas sensor is disclosed which attains high response speed, low power consumption, superior water splash resistance and a little setting direction dependency and setting angle dependency. In this gas sensor, a measured gas room is provided inside an inner cover, and gas passage holes for leading a measured gas in are provided on side surfaces of the inner cover and an outer cover. The gas passage holes provided on the outer cover are positioned much closer to a top end side than the gas passage hole provided closest to the top end side in the inner cover. Partitions disposed extendedly in an axial direction of the gas sensor are provided between the outer cover and the inner cover.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: August 18, 2009
    Assignees: Denso Corporation, Nippon Soken, Inc.
    Inventors: Satoshi Nakamura, Takashi Kojima, Daisuke Makino
  • Publication number: 20090084673
    Abstract: There is described a gas sensor element 1 including a solid electrolyte body 11, insulators 15, 141, 142, 197, 161, 162, 163, 164, 165, and a pair of electrodes 121, 131 formed such that the solid electrolyte body 11 is held therebetween. The gas sensor element 1 satisfies the following requirement (a) and/or the requirement (b). (a) The solid electrolyte body 11 is made of ion-conductive composite material in which nanoparticles with specific particle diameters are dispersed in ion-conductive ceramics. (b) The insulators 15, 141, 197, 161, 162, 163, 164, 165 are made of insulative composite material in which nanoparticles with specific particle diameters are dispersed in insulative ceramics. Further, there is described a manufacturing method of a gas sensor element in which the particle diameter and dispersion quantity of the nanoparticles dispersed in the solid electrolyte body 11 and/or insulative ceramics 11 are controlled.
    Type: Application
    Filed: June 29, 2006
    Publication date: April 2, 2009
    Applicants: DENSO CORPORATION, NIPPON SOKEN, INC.
    Inventors: Itsuhei Ogata, Daisuke Makino, Satoshi Nakamura, Hiroo Imamura, Akio Tanaka