Patents by Inventor Dale J. Hagenson

Dale J. Hagenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9521789
    Abstract: A radiation shield standoff comprises a support section having a mounting surface for an electronic component, with the support section configured to separate the electronic component a predetermined distance from a chassis wall. The standoff also includes a coupling section configured to couple the standoff to the chassis wall. A flange is located between the support section and the coupling section, with the flange configured to hold a radiation shield layer in place on the chassis wall and provide radiation shielding. A boss is located between the flange and the coupling section, with the boss abutted against the flange and smaller than the flange. The standoff also comprises a radiation shielding metal.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: December 13, 2016
    Assignee: Honeywell International, Inc.
    Inventors: Owen D. Grossman, Dale J. Hagenson, Harrison Lin, Mark Lawrence Requa, III
  • Patent number: 9069001
    Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: June 30, 2015
    Assignee: Honeywell International Inc.
    Inventors: Todd L. Braman, Jacob Weinmann, Dale J. Hagenson
  • Publication number: 20140334123
    Abstract: A radiation shield standoff comprises a support section having a mounting surface for an electronic component, with the support section configured to separate the electronic component a predetermined distance from a chassis wall. The standoff also includes a coupling section configured to couple the standoff to the chassis wall. A flange is located between the support section and the coupling section, with the flange configured to hold a radiation shield layer in place on the chassis wall and provide radiation shielding. A boss is located between the flange and the coupling section, with the boss abutted against the flange and smaller than the flange. The standoff also comprises a radiation shielding metal.
    Type: Application
    Filed: May 7, 2013
    Publication date: November 13, 2014
    Applicant: Honeywell International Inc.
    Inventors: Owen D. Grossman, Dale J. Hagenson, Harrison Lin, Mark Lawrence Requa, III
  • Publication number: 20140230552
    Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.
    Type: Application
    Filed: July 30, 2012
    Publication date: August 21, 2014
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Todd L. Braman, Jacob Weinmann, Dale J. Hagenson
  • Patent number: 8266960
    Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: September 18, 2012
    Assignee: Honeywell International Inc.
    Inventors: Todd L. Braman, Jacob Weinmann, Dale J. Hagenson
  • Publication number: 20120045293
    Abstract: Systems and methods for replaceable thread locking elements are provided. In one embodiment, a threaded fastener device comprises: a first member having a threaded region; a cutout within the ring shaped member that cuts across the threaded region; and a replaceable thread locking element removeably coupled to the ring shaped member within the cutout, the replaceable thread locking element comprising a displacement member coupled to a nipple via an extending member. The nipple is inserted into and orifice within the cutout, the nipple shaped to apply a force against the first member that holds the displacement member within the cutout.
    Type: Application
    Filed: August 20, 2010
    Publication date: February 23, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James K. Baxter, Michael A. Krsiean, Dale J. Hagenson
  • Publication number: 20100257932
    Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.
    Type: Application
    Filed: April 10, 2009
    Publication date: October 14, 2010
    Applicant: Honeywell International Inc.
    Inventors: Todd L. Braman, Jacob Weinmann, Dale J. Hagenson
  • Publication number: 20090072456
    Abstract: Systems and methods for protecting a hardware device from shock loads in a package are disclosed. An example system includes a cover with an orifice at a first end and a closed second end, a cupped spring washer in the cover at the closed second end, a hardware package in the cover on the washer, and a base that, when attached to the cover, loads the washer and hardware package with a desired load.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 19, 2009
    Applicant: Honeywell International Inc.
    Inventors: Todd L. Braman, Dale J. Hagenson, Owen D. Grossman
  • Publication number: 20040150144
    Abstract: An inertial sensor system has a base, an inertial sensor, and an isolator mount. The isolator mount fastens the inertial sensor to the base, and the isolator mount includes a bolt and first and second vibration absorbing members. The bolt is inserted through the inertial sensor and the base, the first vibration absorbing member is between the bolt and the inertial sensor, and the second vibration absorbing member is between the inertial sensor and the base. The isolator mount isolates the inertial sensor from vibration, shock, and/or acoustic noise transmitted from a host system through the base.
    Type: Application
    Filed: January 30, 2003
    Publication date: August 5, 2004
    Applicant: Honeywell International Inc.
    Inventors: Scott J. Goepfert, Todd L. Braman, Dale J. Hagenson
  • Patent number: 6578682
    Abstract: Disclosed is a compact vibration isolation system for mounting an inertial sensor assembly (ISA) to an Inertial Measurement Unit (IMU) housing. The housing is mounted to a support that is subjected to shock and vibration. The vibration isolator assembly includes a ring shaped elastomeric member laminated between a ring shaped inner member and a ring shaped outer member. The inner member is securely mounted to the ISA, and the outer member is mounted to a support of the IMU housing. Because of the compact size of this system, the IMU housing contains and protects the elastomeric member from potential contamination and damage, as well as eliminates the need for delicate mechanical and electrical interfaces. The elastomeric member of the system isolates the ISA from shock, vibration, and acoustic energy that may otherwise be transmitted from the support to the ISA.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: June 17, 2003
    Assignee: Honeywell International Inc.
    Inventors: Todd L. Braman, Mark J. Riesgraf, Dale J. Hagenson
  • Publication number: 20020158390
    Abstract: Disclosed is a compact vibration isolation system for mounting an inertial sensor assembly (ISA) to an Inertial Measurement Unit (IMU) housing. The housing is mounted to a support that is subjected to shock and vibration. The vibration isolator assembly includes a ring shaped elastomeric member laminated between a ring shaped inner member and a ring shaped outer member. The inner member is securely mounted to the ISA, and the outer member is mounted to a support of the IMU housing. Because of the compact size of this system, the IMU housing contains and protects the elastomeric member from potential contamination and damage, as well as eliminates the need for delicate mechanical and electrical interfaces. The elastomeric member of the system isolates the ISA from shock, vibration, and acoustic energy that may otherwise be transmitted from the support to the ISA.
    Type: Application
    Filed: April 26, 2001
    Publication date: October 31, 2002
    Inventors: Todd L. Braman, Mark J. Riesgraf, Dale J. Hagenson
  • Patent number: 6115261
    Abstract: A sensor mount for mounting a sensor to a substrate having a support member, a substrate attachment surface, and a sensor attachment surface. The support member can be attached to the substrate at the substrate attachment surface and the sensor can be attached to the support member at the sensor attachment surface. The sensor mount is shaped so an oblique angle is formed between the plane that includes the substrate attachment surface and the plane that includes the sensor attachment surfaces. Preferably, the support member has a wedge shape.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: September 5, 2000
    Assignee: Honeywell Inc.
    Inventors: William P. Platt, Dale J. Hagenson, Douglas P. Mortenson