Patents by Inventor Dale Starkey

Dale Starkey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7622516
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: November 24, 2009
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • Patent number: 7125917
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: October 24, 2006
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • Publication number: 20060147718
    Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED or optical sensor. The molding compound includes a partially-cured epoxy composition, a linear polyol, a dye that absorbs in the region of above 700 nm to about 1200 nm and substantially transmits light from about 400 nm to about 700 nm, and an optional antioxidant material substantially uniformly distributed throughout the epoxy composition. The dye can be dissolved within the epoxy composition by heating a portion of the epoxy composition prior to B-staging of the molding compound. The cured epoxy composition has at least 40% transmittance at 600 nm, less than 10% transmittance at 900 nm, less than 10% transmittance at 1100 nm.
    Type: Application
    Filed: December 30, 2004
    Publication date: July 6, 2006
    Applicant: Henkel Corporation
    Inventor: Dale Starkey
  • Patent number: 6989412
    Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantially uniformly distributed throughout the epoxy composition. The phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: January 24, 2006
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • Publication number: 20040063840
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Application
    Filed: September 22, 2003
    Publication date: April 1, 2004
    Applicant: Henkel Loctite Corporation
    Inventor: Dale Starkey
  • Publication number: 20030001140
    Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantially uniformly distributed throughout the epoxy composition. The phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Application
    Filed: June 6, 2001
    Publication date: January 2, 2003
    Applicant: LOCTITE CORPORATION
    Inventor: Dale Starkey