Patents by Inventor Dalian University Of Technology

Dalian University Of Technology has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THIN FILM OF COPPER-NICKEL-MOLYBDENUM ALLOY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20130136650
    Abstract: A Cu—Ni—Mo alloy thin film, including Ni as a solution element and Mo as a diffusion barrier element. Ni and Mo are co-doped with Cu. The enthalpy of mixing between Mo and Cu is +19 kJ/mol, and the enthalpy of mixing between Mo and Ni is ?7 kJ/mol. The atomic fraction of Mo/Ni is within the range of 0.06-0.20 or the weight faction of Mo/Ni within the range of 0.10-0.33. The total amount of Ni and Mo additions is within the range of 0.14-1.02 at. % or wt. %. A method for manufacturing the alloy thin film is also provided.
    Type: Application
    Filed: January 27, 2013
    Publication date: May 30, 2013
    Applicant: DALIAN UNIVERSITY OF TECHNOLOGY
    Inventor: Dalian University Of Technology