Patents by Inventor Dan Feng Zhu

Dan Feng Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM
    Publication number: 20070284139
    Abstract: An integrated circuit package system is provided including providing an integrated circuit die, forming an encapsulation over the integrated circuit die, and sawing the encapsulation with a multi-level saw.
    Type: Application
    Filed: June 11, 2007
    Publication date: December 13, 2007
    Inventors: Chee Keong Chin, Yu Feng Feng, Dan Feng Zhu, Feng Yao