Patents by Inventor Dana Gruenbacher
Dana Gruenbacher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11305534Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.Type: GrantFiled: July 31, 2020Date of Patent: April 19, 2022Assignee: STMICROELECTRONICS INTERNATIONAL N.V.Inventors: Simon Dodd, David S. Hunt, Joseph Edward Scheffelin, Dana Gruenbacher, Stefan H. Hollinger, Uwe Schober, Peter Janouch
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Publication number: 20200361207Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.Type: ApplicationFiled: July 31, 2020Publication date: November 19, 2020Inventors: Simon DODD, David S. HUNT, Joseph Edward SCHEFFELIN, Dana GRUENBACHER, Stefan H. HOLLINGER, Uwe SCHOBER, Peter JANOUCH
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Patent number: 10759168Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.Type: GrantFiled: March 18, 2019Date of Patent: September 1, 2020Assignees: STMICROELECTRONICS S.r.l., STMICROELECTRONICS, INC., STMICROELECTRONICS INTERNATIONAL N.V.Inventors: Simon Dodd, David S. Hunt, Joseph Edward Scheffelin, Dana Gruenbacher, Stefan H. Hollinger, Uwe Schober, Peter Janouch
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Patent number: 10759169Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.Type: GrantFiled: March 18, 2019Date of Patent: September 1, 2020Assignees: STMICROELECTRONICS S.r.l., STMICROELECTRONICS, INC., STMICROELECTRONICS INTERNATIONAL N.V.Inventors: Simon Dodd, David S. Hunt, Joseph Edward Scheffelin, Dana Gruenbacher, Stefan H. Hollinger, Uwe Schober, Peter Janouch
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Patent number: 10646892Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.Type: GrantFiled: November 3, 2017Date of Patent: May 12, 2020Assignees: STMicroelectronics, Inc., STMICROELECTRONICS S.R.L., STMicroelectronics International N.V.Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
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Patent number: 10543504Abstract: A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.Type: GrantFiled: June 28, 2017Date of Patent: January 28, 2020Assignees: STMicroelectronics, Inc., STMICROELECTRONICS S.R.L., STMicroelectronics International N.V.Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
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Publication number: 20190217612Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.Type: ApplicationFiled: March 18, 2019Publication date: July 18, 2019Inventors: Simon DODD, David S. HUNT, Joseph Edward SCHEFFELIN, Dana GRUENBACHER, Stefan H. HOLLINGER, Uwe SCHOBER, Peter JANOUCH
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Publication number: 20190217611Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.Type: ApplicationFiled: March 18, 2019Publication date: July 18, 2019Inventors: Simon DODD, David S. HUNT, Joseph Edward SCHEFFELIN, Dana GRUENBACHER, Stefan H. HOLLINGER, Uwe SCHOBER, Peter JANOUCH
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Patent number: 10272684Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.Type: GrantFiled: August 31, 2016Date of Patent: April 30, 2019Assignees: STMICROELECTRONICS, INC., STMICROELECTRONICS INTERNATIONAL N.V., STMICROELECTRONICS S.R.L.Inventors: Simon Dodd, David S. Hunt, Joseph Edward Scheffelin, Dana Gruenbacher, Stefan H. Hollinger, Uwe Schober, Peter Janouch
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Patent number: 9919334Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.Type: GrantFiled: December 18, 2015Date of Patent: March 20, 2018Assignees: STMicroelectronics, Inc., STMicroelectronics S.R.L., STMicroelectronics International N.V.Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
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Publication number: 20180056319Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.Type: ApplicationFiled: November 3, 2017Publication date: March 1, 2018Inventors: Simon DODD, Joe SCHEFFELIN, Dave HUNT, Matt GIERE, Dana GRUENBACHER, Faiz SHERMAN
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Patent number: 9833806Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.Type: GrantFiled: December 21, 2015Date of Patent: December 5, 2017Assignees: STMicroelectronics, Inc., STMICROELECTRONICS S.R.L., STMicroelectronics International N.V.Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
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Publication number: 20170297332Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.Type: ApplicationFiled: June 28, 2017Publication date: October 19, 2017Inventors: Simon DODD, Joe SCHEFFELIN, Dave HUNT, Matt GIERE, Dana GRUENBACHER, Faiz SHERMAN
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Publication number: 20170190174Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.Type: ApplicationFiled: August 31, 2016Publication date: July 6, 2017Inventors: Simon DODD, David S. HUNT, Joseph Edward SCHEFFELIN, Dana GRUENBACHER
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Patent number: 9561657Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.Type: GrantFiled: April 26, 2016Date of Patent: February 7, 2017Assignees: STMicroelectronics S.r.l., STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics, Inc.Inventors: Simon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
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Publication number: 20160236471Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.Type: ApplicationFiled: April 26, 2016Publication date: August 18, 2016Inventors: Simon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
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Patent number: 9358567Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.Type: GrantFiled: June 20, 2014Date of Patent: June 7, 2016Assignee: STMicroelectronics, Inc.Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
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Patent number: 9357635Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.Type: GrantFiled: December 28, 2015Date of Patent: May 31, 2016Assignees: STMicroelectronics S.r.l., STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics, Inc.Inventors: Simon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
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Publication number: 20160107443Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.Type: ApplicationFiled: December 21, 2015Publication date: April 21, 2016Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana GRUENBACHER, Faiz SHERMAN
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Publication number: 20160107446Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.Type: ApplicationFiled: December 28, 2015Publication date: April 21, 2016Inventors: Simon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman