Patents by Inventor Daniel A. Saucy

Daniel A. Saucy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210144938
    Abstract: The present disclosure is directed towards aqueous compositions including agricultural water, and a dispersion of acrylic copolymer; growth media compositions including a growth media and solids from the aqueous composition; and methods including combining a dispersion of acrylic copolymer and agricultural water to form an aqueous composition, and applying the aqueous composition to a growth media.
    Type: Application
    Filed: May 23, 2018
    Publication date: May 20, 2021
    Applicants: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Lalitha V. Ganapatibhotla, Aslin Izmitli, Daniel A. Saucy, Wanglin Yu
  • Publication number: 20200262975
    Abstract: The present invention relates to a compound comprising a hydrophobically modified poly(oxyalkylene-urethane) having a hydrophobic fragment represented by Structure I: where Ar1, Ar2; R1, m, and n are defined herein. The compound of the present invention provides viscosity stability upon tinting for paints containing a hydrophobically modified poly(oxyalkylene-urethane) rheology modifier, more particularly a HEUR rheology modifier.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 20, 2020
    Inventors: John J. Rabasco, Daniel A. Saucy, Antony K. Van Dyk
  • Patent number: 10703841
    Abstract: The present invention relates to a composition comprising an aqueous dispersion of acrylic based polymer particles; less than 15 PVC of a pigment; and a hydrophobically modified poly(oxyalkylene-urethane) rheology modifier having a hydrophobic portion represented by Structure I: Where R, R1, R2, m an n are defined herein. The composition provides viscosity stability for paint formulations containing a HEUR rheology modifier.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: July 7, 2020
    Assignees: Rohm and Haas Company, Dow Global Technologies LLC
    Inventors: John J. Rabasco, Duane R. Romer, Daniel A. Saucy, Antony K. Van Dyk
  • Publication number: 20190135964
    Abstract: The present invention relates to a composition comprising an aqueous dispersion of acrylic based polymer particles; less than 15 PVC of a pigment; and a hydrophobically modified poly(oxyalkylene-urethane) rheology modifier having a hydrophobic portion represented by Structure I: Where R, R1, R2, m an n are defined herein. The composition provides viscosity stability for paint formulations containing a HEUR rheology modifier.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 9, 2019
    Inventors: John J. Rabasco, Duane R. Romer, Daniel A. Saucy, Antony K. Van Dyk
  • Patent number: 9745478
    Abstract: The present invention relates to a composition comprising an aqueous dispersion of an associative thickener having a hydrophobic portion with a calculated log P in the range of from 2.7 to 5.0; and composite particles comprising phosphorus acid functionalized polymer particles adsorbed to the surfaces of TiO2 particles; wherein the phosphorus acid functionalized polymer particles have a core-shell morphology wherein the core protuberates from the shell. The composition of the present invention provides formulators with flexibility in their use of low and mid shear rate thickeners to balance paint performance properties.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: August 29, 2017
    Assignee: Rohm and Haas Comopany
    Inventors: James C. Bohling, Arnold S. Brownell, Jihui Guo, Kevin J. Henderson, Ericka Lynn Killian, John J. Rabasco, Daniel A. Saucy, Jordan Stracke
  • Patent number: 9745492
    Abstract: The present invention relates to a composition comprising an aqueous dispersion of an associative thickener having a hydrophobic portion with a calculated log P in the range of from 2.7 to 4.8; and composite particles comprising phosphorus acid functionalized polymer particles adsorbed to the surfaces of TiO2 particles. The composition of the present invention provides formulators with flexibility in their use of low and mid shear rate thickeners to balance paint performance properties.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: August 29, 2017
    Assignee: Rohm and Haas Company
    Inventors: James C. Bohling, Arnold S. Brownell, Jihui Guo, Kevin J. Henderson, Ericka Lynn Killian, John J. Rabasco, Daniel A. Saucy, Jordan Stracke
  • Publication number: 20170081529
    Abstract: The present invention relates to a composition comprising an aqueous dispersion of an associative thickener having a hydrophobic portion with a calculated log P in the range of from 2.7 to 5.0; and composite particles comprising phosphorus acid functionalized polymer particles adsorbed to the surfaces of TiO2 particles; wherein the phosphorus acid functionalized polymer particles have a core-shell morphology wherein the core protuberates from the shell. The composition of the present invention provides formulators with flexibility in their use of low and mid shear rate thickeners to balance paint performance properties.
    Type: Application
    Filed: September 14, 2016
    Publication date: March 23, 2017
    Inventors: James C. Bohling, Arnold S. Brownell, Jihui Guo, Kevin J. Henderson, Ericka Lynn Killian, John J. Rabasco, Daniel A. Saucy, Jordan Stracke
  • Publication number: 20170081547
    Abstract: The present invention relates to a composition comprising an aqueous dispersion of an associative thickener having a hydrophobic portion with a calculated log P in the range of from 2.7 to 4.8; and composite particles comprising phosphorus acid functionalized polymer particles adsorbed to the surfaces of TiO2 particles. The composition of the present invention provides formulators with flexibility in their use of low and mid shear rate thickeners to balance paint performance properties.
    Type: Application
    Filed: September 12, 2016
    Publication date: March 23, 2017
    Inventors: James C. Bohling, Arnold S. Brownell, Jihui Guo, Kevin J. Henderson, Ericka Lynn Killian, John J. Rabasco, Daniel A. Saucy, Jordan Stracke
  • Publication number: 20050164398
    Abstract: The invention is a method for mass analysis of polymers by mobility measurements of charge reduced ions generated by electrosprays of polymers using solvents having high dielectric constants. Polymer ions formed by electrospray carry a level of charge proportional to their length and hence their mass. The number of charges on the resulting polymer ions is reduced to unity in a radioactive source. The mobility distribution of the reduced charge polymer ions is then measured in a high resolution differential mobility analyzer (DMA). A relation Z(m) between the mobility Z of a polymer and its mass m is determined using narrowly distributed polymer mass standards. Polymers analyzed in accordance with the invention include both water soluble and water insoluble polymers having weight average molecular weights between 1 kilodaltons (kD) and 500,000 kD.
    Type: Application
    Filed: January 7, 2005
    Publication date: July 28, 2005
    Inventors: James Alexander, Daniel Saucy
  • Publication number: 20050153341
    Abstract: The invention is directed to an apparatus and a method for direct mass analysis of molecules and macromolecules, including polymers, using charge reduced gas phase analyte ions generated from analyte electrosprays coupled to a time of flight mass spectrometer (TOF-MS). Molecules and macromolecules, including polymers, analyzed in accordance with the invention include both water soluble and water insoluble polymers having weight average molecular weights between 1 kilodaltons (kD) and 500,000 kD.
    Type: Application
    Filed: December 6, 2004
    Publication date: July 14, 2005
    Inventors: James Alexander, Daniel Saucy
  • Publication number: 20050109856
    Abstract: The invention provides a method for a producing stable polymer electrosprays of water soluble polymers and water insoluble polymers using one or more solvents having high dielectric constants.
    Type: Application
    Filed: October 8, 2004
    Publication date: May 26, 2005
    Inventors: James Alexander, Daniel Saucy
  • Patent number: 6568997
    Abstract: This invention is directed to a polishing composition used for the chemical mechanical polishing of semiconductor wafers having a copper metal circuit. The composition has a pH of under 5.0 and comprises the following: (a) a water soluble carboxylic acid polymer comprising polymerized unsaturated carboxylic acid monomers having a number average molecular weight of about 20,000 to 1,500,000 or blends of high and low number average molecular weight polymers of polymerized unsaturated carboxylic acid monomers; (b) 1 to 15% by weight of an oxidizing agent, (c) up to 3.0% by weight of abrasive particles, (d) 50-5,000 ppm (parts per million) of an inhibitor, (e) up to 3.0% by weight of a complexing agent, such as, malic acid, and (f) 0.1 to 5.0% by weight of organic polymer particles, wherein the polymer of the organic polymer particles has a number average molecular weight of at least 500,000 determined by GPC (gel permeation chromatography) and a Tg (glass transition temperature) of at least 25° C.
    Type: Grant
    Filed: April 5, 2001
    Date of Patent: May 27, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Wesley D. Costas, Craig D. Lack, Daniel A. Saucy
  • Publication number: 20020173243
    Abstract: An aqueous polishing composition for chemical mechanical polishing to remove copper from a buffer material, the composition comprising, an oxidizing agent, a complexing agent, an inhibitor, a dishing reducing agent, and abrasive particles comprising organic polymer particles for clearing relatively soft copper from the buffer material by chemical mechanical polishing while minimizing dishing and avoiding removal of the buffer material.
    Type: Application
    Filed: January 23, 2002
    Publication date: November 21, 2002
    Inventors: Wesley D. Costas, Craig D. Lack, Daniel A. Saucy
  • Publication number: 20020173241
    Abstract: This invention is directed to a polishing composition used for the chemical mechanical polishing of semiconductor wafers having a copper metal circuit. The composition has a pH of under 5.
    Type: Application
    Filed: April 5, 2001
    Publication date: November 21, 2002
    Inventors: Wesley D. Costas, Craig D. Lack, Daniel A. Saucy