Abstract: A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal volume for holding at least one substrate for transport to the processing section, the shell being configured to allow the internal volume to be pumped down to a predetermined vacuum pressure that is different than an exterior atmosphere outside the substrate processing system, and a load port communicably connected to the processing section to isolate the processing atmosphere from the exterior atmosphere, the load port being configured to couple with the carrier to pump down the internal volume of the carrier and to communicably connect the carrier to the processing section, for loading the substrate into the processing section through the load port.

Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

Abstract: A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal volume for holding at least one substrate for transport to the processing section, the shell being configured to allow the internal volume to be pumped down to a predetermined vacuum pressure that is different than an exterior atmosphere outside the substrate processing system, and a load port communicably connected to the processing section to isolate the processing atmosphere from the exterior atmosphere, the load port being configured to couple with the carrier to pump down the internal volume of the carrier and to communicably connect the carrier to the processing section, for loading the substrate into the processing section through the load port.

Abstract: A transfer apparatus for transporting substrates in a transfer chamber having a first and second ends and two sides extending between the ends. The transfer apparatus includes a drive section, at least one base arm fixed at one end with respect to the transfer chamber and including at least one arm link rotatably coupled to the drive section and at least one transfer arm rotatably coupled to a common end of the base arm, the at least one transfer arm has two end effectors. The drive section has motors with three independent axes of rotation defining three degrees of freedom. One degree of freedom moves the at least one base arm horizontally for transporting the at least one transfer arm and two degrees of freedom drives the at least one transfer arm to extend and retract the at least one transfer arm and swap the two end effectors.

Abstract: A semiconductor workpiece processing system including at least one substrate processing tool that has a common housing with a first side having a first substrate holding container interface and a second side having a second substrate holding container interface having a different orientation than the first substrate holding container interface, a first transport section disposed corresponding to the first side of the tool, a second transport section being separate and distinct from the first transport section and interfacing with the first transport section and being configured to transport the substrate holding container between the first transport section and the tool and between the first side and the second side of the tool, the second transport section including at least one overhead gantry disposed above the tool, where the second transfer section is capable of interfacing with at least the second substrate holding container interface.

Abstract: A substrate transport system includes a carrier having a housing forming an interior environment having an opening for holding at least one substrate and a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid reservoir exterior to the interior environment and configured to contain a fluid, forming a different atmosphere in the fluid reservoir than the interior atmosphere, to form a fluidic barrier seal that seals the interior environment from an environment exterior to the carrier.

Abstract: A semiconductor workpiece processing system including at least one substrate processing tool that has a common housing with a first side having a first substrate holding container interface and a second side having a second substrate holding container interface having a different orientation than the first substrate holding container interface, a first transport section disposed corresponding to the first side of the tool, a second transport section being separate and distinct from the first transport section and interfacing with the first transport section and being configured to transport the substrate holding container between the first transport section and the tool and between the first side and the second side of the tool, the second transport section including at least one overhead gantry disposed above the tool, where the second transfer section is capable of interfacing with at least the second substrate holding container interface.

Abstract: A semiconductor workpiece processing system having at least one processing apparatus for processing workpieces, a primary transport system, a secondary transport system and one or more interfaces between first transport system and second transport system. The primary and secondary transport systems each have one or more sections of substantially constant velocity and in queue sections communicating with the constant velocity sections.

Abstract: A method for pressurizing a substrate carrier including pressurizing a chamber that is of unitary construction with the carrier and/or a substrate cassette within the carrier and maintaining a pressure within the carrier by releasing gas from the chamber into the carrier.

Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

Abstract: A semiconductor workpiece processing system having at least one processing apparatus for processing workpieces, a primary transport system, a secondary transport system and one or more interfaces between first transport system and second transport system. The primary and secondary transport systems each have one or more sections of substantially constant velocity and in queue sections communicating with the constant velocity sections.

Abstract: Chucking mechanisms may include a plurality of chucking sections respectively connecting to a pressure control device to generate individual chucking forces. The individual chucking forces of the chucking sections may be varied by the pressure control device such that a magnitude of separation force is reduced for an imprint lithography system.

Abstract: The present invention features a method to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The method includes sensing relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.

Abstract: Chucking mechanisms may include a plurality of chucking sections respectively connecting to a pressure control device to generate individual chucking forces. The individual chucking forces of the chucking sections may be varied by the pressure control device such that a magnitude of separation force is reduced for an imprint lithography system.

Abstract: A load port including a frame defining a load port opening, a substrate carrier interface connected to the frame and configured to removably couple with a substrate carrier shell, a load port door configured to interface with a substrate carrier door, the load port door being movably coupled to frame and having a first position substantially blocking the load port opening, and a second position where the load port opening is substantially unblocked by the load port door, and a door coupling member without moving parts, located on the load port door configured to releasably couple with a corresponding member without moving parts on the substrate carrier door, wherein activation of the door coupling member effects coupling between the load port door and substrate carrier door and a passive release of the substrate carrier door from the substrate carrier shell.

Abstract: A chucking system may include a plurality of discrete vacuum sections. The size of at least one vacuum section may be configured to be substantially similar to size of a strained region of the substrate. The strained region of the substrate is a localized deformation in the substrate due to separation force applied during a nano-imprint lithography process.

Abstract: The present invention is directed towards a chucking system, including, inter alia, a body having a surface with a pin extending therefrom having a throughway defined therein, and a land surrounding the protrusions defining a channel between the pin and the land. In a further embodiment, the body comprises a plurality of protrusions.

Abstract: A semiconductor workpiece processing system having at least one processing apparatus for processing workpieces, a primary transport system, a secondary transport system and one or more interfaces between first transport system and second transport system. The primary and secondary transport systems each have one or more sections of substantially constant velocity and in queue sections communicating with the constant velocity sections.

Abstract: A semiconductor workpiece processing system having at least one processing apparatus for processing workpieces, a primary transport system, a secondary transport system and one or more interfaces between first transport system and second transport system. The primary and secondary transport systems each have one or more sections of substantially constant velocity and in queue sections communicating with the constant velocity sections.

Abstract: The present is directed towards an imprint lithography system including, inter alia, a docking plate; a motion stage having a range of motion associated therewith, the range of motion having a periphery spaced-apart from the docking plate a first distance; and a body, having first and second opposed sides spaced-apart a second distance, selectively coupled between the docking plate and the motion stage, the first distance being greater than the second distance to minimize a probability of a collision between the docking plate, the motion stage and the body while transferring the body between the docking plate and the motion stage.