Abstract: A lamp socket assembly for use with a printed circuit, particularly where the mounting aperture in the circuit board is relatively small and the board may be remotely located. The assembly includes a lamp socket and a separate key member. The key receives the socket in latched relation therewith, the latching arrangement being such as to afford limited longitudinal displacement of the socket relative to the key. One or more biasing members, such as cantilevered spring fingers, are formed integrally with the socket, or preferably the key, and act to urge the socket relatively forward from the key. Electrical leads from the lamp pass over a flange formed at the base of the socket and are urged upwardly with the base into good electrical contact with the printed circuit on the under side of the board. The key member is preferably elongated to afford remote installation of the socket assembly on the printed circuit board.

Abstract: A tactile switch plate for a keyboard member has a planar body portion provided with a plurality of outwardly deformed carrier portions corresponding in number and spacing to the number and spacing of the keys of the keyboard. Each of the carrier portions is resiliently flexible for movement toward the plane of the body and each carrier portion carries a preferably elastomeric switching member that is adapted to bridge the conductors and establish an electrical circuit between the conductors. The plate and switching members are produced by a molding process and the elastomeric switching members are cured by heat.

Abstract: Apparatus for protecting the armature of an electric motor against excessive temperatures comprises a resiliently compressible and expansible pad in the armature circuit and composed of thermally sensitive, non-conductive material containing a plurality of conductive particles engageable with one another when the pad is in a compressed condition to establish a conductive path through the pad. The pad normally is maintained in a compressed, conductive condition by resilient force applying means which is of such resilience as to permit expansion of the pad in response to an increase in its temperature and render the pad non-conductive.